ZHCSK09B July   2019  – March 2020 TPS7A02

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     负载瞬态响应(VIN = VOUT + 1V,COUT = 1µF,在 1µs 内 IOUT = 1mA 至 50mA)
    2.     接地电流效率与输出电流间的关系
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions: DQN, DBV
    2.     Pin Functions: YCH
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Excellent Transient Response
      2. 7.3.2 Active Discharge (P-Version Only)
      3. 7.3.3 Low IQ in Dropout
      4. 7.3.4 Smart Enable
      5. 7.3.5 Dropout Voltage
      6. 7.3.6 Foldback Current Limit
      7. 7.3.7 Undervoltage Lockout (UVLO)
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Load Transient Response
      4. 8.1.4 Undervoltage Lockout (UVLO) Operation
      5. 8.1.5 Power Dissipation (PD)
        1. 8.1.5.1 Estimating Junction Temperature
        2. 8.1.5.2 Recommended Area for Continuous Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 器件命名规则
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

特性

  • 超低 IQ:25nA(典型值),即使处于压降状态
  • 关断 IQ:3nA(典型值)
  • 出色的瞬态响应(1mA 至 50mA)
    • 建立时间小于 10µs
    • 100mV 下冲
  • 封装:
    • 1.0mm × 1.0mm X2SON
    • SOT23-5
    • 0.64mm x 0.64mm DSBGA(预发布)
  • 输入电压范围:1.5V 至 6.0V
  • 输出电压范围:0.8V 至 5.0V(固定)
  • 输出精度:在工作温度范围内为 1.5%
  • 智能使能端下拉
  • 超低压降:
    • 在 200mA 下为 270mV(最大值)(VOUT = 3.3V)
  • 与 1µF 或更大的电容器一起工作时保持稳定