ZHCS322D May   2011  – December 2014 TPS62730 , TPS62732 , TPS62733

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 DCS-Control™
      2. 9.3.2 ON/BYP Mode Selection
      3. 9.3.3 STAT Open-Drain Output
    4. 9.4 Device Functional Modes
      1. 9.4.1 Start-Up
      2. 9.4.2 Automatic Transition from DC-DC to Bypass Operation
      3. 9.4.3 Internal Current Limit
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Output Filter Design (Inductor and Output Capacitor)
        2. 10.2.2.2 Inductor Selection
        3. 10.2.2.3 DC-DC Output Capacitor Selection
        4. 10.2.2.4 Additional Decoupling Capacitors
        5. 10.2.2.5 Input Capacitor Selection
          1. 10.2.2.5.1 Input Buffer Capacitor Selection
        6. 10.2.2.6 Checking Loop Stability
      3. 10.2.3 Application Curves
    3. 10.3 System Examples
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 第三方产品免责声明
    2. 13.2 相关链接
    3. 13.3 商标
    4. 13.4 静电放电警告
    5. 13.5 术语表
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 Layout

12.1 Layout Guidelines

As for all switching power supplies, the layout is an important step in the design. Especially RF designs demand careful attention to the PCB layout. Care must be taken in board layout to get the specified performance. If the layout is not carefully done, the regulator could show poor line and/or load regulation, stability issues as well as EMI problems and interference with RF circuits. It is critical to provide a low inductance, impedance ground path. Therefore, use wide and short traces for the main current paths. The input capacitor should be placed as close as possible to the IC pins as well as the inductor and output capacitor. Use a common Power GND node and a different node for the Signal GND to minimize the effects of ground noise. Keep the common path to the GND PIN, which returns the small signal components and the high current of the output capacitors as short as possible to avoid ground noise. The VOUT line should be connected to the output capacitor and routed away from noisy components and traces (for example, SW line).

12.2 Layout Example

TPS62730 TPS62732 TPS62733 pcb_lay_lvs941.gif Figure 33. Recommended PCB Layout for TPS62730