ZHCSCG9C May   2014  – July 2019 TPS62150A-Q1 , TPS62152A-Q1 , TPS62153A-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用电路原理图 空白 空白 空白
      2.      效率与输出电流 空白
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Pulse Width Modulation (PWM) Operation
      2. 9.3.2  Power Save Mode Operation
      3. 9.3.3  100% Duty-Cycle Operation
      4. 9.3.4  Enable / Shutdown (EN)
      5. 9.3.5  Soft Start / Tracking (SS/TR)
      6. 9.3.6  Current Limit And Short Circuit Protection
      7. 9.3.7  Power Good (PG)
      8. 9.3.8  Pin-Selectable Output Voltage (DEF)
      9. 9.3.9  Frequency Selection (FSW)
      10. 9.3.10 Under Voltage Lockout (UVLO)
      11. 9.3.11 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation above TJ=125°C
      2. 9.4.2 Operation with VIN < 3V
      3. 9.4.3 Operation with separate EN Control
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 TPS62150A-Q1 Point-Of-Load Step Down Converter
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 10.2.1.2.2 Programming The Output Voltage
          3. 10.2.1.2.3 External Component Selection
          4. 10.2.1.2.4 Inductor Selection
          5. 10.2.1.2.5 Output Capacitor
          6. 10.2.1.2.6 Input Capacitor
          7. 10.2.1.2.7 Soft Start Capacitor
          8. 10.2.1.2.8 Tracking Function
          9. 10.2.1.2.9 Output Filter And Loop Stability
        3. 10.2.1.3 Application Curves
      2. 10.2.2 System Examples
        1. 10.2.2.1 Regulated Power LED Supply
        2. 10.2.2.2 Inverting Power Supply
        3. 10.2.2.3 Active Output Discharge
        4. 10.2.2.4 Various Output Voltages
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 第三方产品免责声明
    2. 13.2 相关链接
    3. 13.3 接收文档更新通知
    4. 13.4 社区资源
    5. 13.5 商标
    6. 13.6 静电放电警告
    7. 13.7 Glossary
  14. 14机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGT|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configuration and Functions

RGT Package
16-Pin VQFN
Top View
TPS62150A-Q1 TPS62152A-Q1 TPS62153A-Q1 SLVSCC3_pinout.gif

Pin Functions

PIN(1) I/O DESCRIPTION
NAME NO.
SW 1,2,3 O Switch node, which is connected to the internal MOSFET switches. Connect inductor between SW and output capacitor.
PG 4 O Output power good (High = VOUT ready, Low = VOUT below nominal regulation) ; open drain (requires pull-up resistor)
FB 5 I Voltage feedback of adjustable version. Connect resistive voltage divider to this pin. It is recommended to connect FB to AGND on fixed output voltage versions for improved thermal performance.
AGND 6 Analog Ground. Must be connected directly to the Exposed Thermal Pad and common ground plane.
FSW 7 I Switching Frequency Select (Low=2.5MHz, High=1.25MHz for typical operation)(2)
DEF 8 I Output Voltage Scaling (Low = nominal, High = nominal + 5%)(2)
SS/TR 9 I Soft-Start / Tracking Pin. An external capacitor connected to this pin sets the internal voltage reference rise time. It can be used for tracking and sequencing.
AVIN 10 I Supply voltage for control circuitry. Connect to same source as PVIN.
PVIN 11,12 I Supply voltage for power stage. Connect to same source as AVIN.
EN 13 I Enable input (High = enabled, Low = disabled)(2)
VOS 14 I Output voltage sense pin and connection for the control loop circuitry.
PGND 15,16 Power Ground. Must be connected directly to the Exposed Thermal Pad and common ground plane.
Exposed Thermal Pad Must be connected to AGND (pin 6), PGND (pin 15,16) and common ground plane(3). Must be soldered to achieve appropriate power dissipation and mechanical reliability.
(1) For more information about connecting pins, see Detailed Description and Application and Implementation sections.
(2) An internal pull-down resistor keeps logic level low, if pin is floating.
(3) See Figure 50.