ZHCSJL1C September   2010  – April 2019 TPS61251

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Current Limit Operation
      2. 9.3.2 Soft Start
      3. 9.3.3 Enable
      4. 9.3.4 Undervoltage Lockout (UVLO)
      5. 9.3.5 Power Good
      6. 9.3.6 Input Overvoltage Protection
      7. 9.3.7 Load Disconnect and Reverse Current Protection
      8. 9.3.8 Thermal Regulation
      9. 9.3.9 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Save Mode
      2. 9.4.2 Snooze Mode
      3. 9.4.3 100% Duty-Cycle Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Custom Design With WEBENCH® Tools
        2. 10.2.2.2 Output Voltage Setting
        3. 10.2.2.3 Average Input Current Limit
        4. 10.2.2.4 Maximum Output Current
        5. 10.2.2.5 Inductor Selection
        6. 10.2.2.6 Output Capacitor
        7. 10.2.2.7 Input Capacitor
        8. 10.2.2.8 Checking Loop Stability
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Consideration
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 第三方产品免责声明
    2. 13.2 开发支持
      1. 13.2.1 使用 WEBENCH® 工具创建定制设计
    3. 13.3 接收文档更新通知
    4. 13.4 社区资源
    5. 13.5 商标
    6. 13.6 静电放电警告
    7. 13.7 术语表
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12.3 Thermal Consideration

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependant issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below:

  • Improving the power dissipation capability of the PCB design
    • For example, increase of the GND plane on the top layer which is connected to the exposed thermal pad
    • Use thicker cupper layer
  • Improving the thermal coupling of the component to the PCB
  • Introducing airflow in the system

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. The maximum junction temperature (TJ) of the TPS61251 device is 150°C.