ZHCSDK1 March   2015 TPS61196-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Supply Voltage
      2. 7.3.2 Boost Controller
      3. 7.3.3 Switching Frequency
      4. 7.3.4 Enable and Undervoltage Lockout
      5. 7.3.5 Power-Up Sequencing and Soft Start-up
      6. 7.3.6 Unused Led String
      7. 7.3.7 Current Regulation
      8. 7.3.8 PWM Dimming
    4. 7.4 Device Functional Modes
      1. 7.4.1 Protections
        1. 7.4.1.1  Switch Current Limit Protection Using the ISNS Pin
        2. 7.4.1.2  LED Open Protection
        3. 7.4.1.3  LED Short-Cross Protection Using the FBP Pin
        4. 7.4.1.4  Schottky Diode Open Protection
        5. 7.4.1.5  Schottky Diode Short Protection
        6. 7.4.1.6  IFB Overvoltage Protection During Start-up
        7. 7.4.1.7  Output Overvoltage Protection Using the OVP Pin
        8. 7.4.1.8  Output Short-to-Ground Protection
        9. 7.4.1.9  IFB Short-to-Ground Protection
        10. 7.4.1.10 ISET Short-to-Ground Protection
        11. 7.4.1.11 Thermal Protection
      2. 7.4.2 Indication For Fault Conditions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Schottky Diode
        3. 8.2.2.3 Switch MOSFET And Gate Driver Resistor
        4. 8.2.2.4 Current Sense and Current Sense Filtering
        5. 8.2.2.5 Output Capacitor
        6. 8.2.2.6 Loop Consideration
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 商标
    2. 11.2 静电放电警告
    3. 11.3 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 商标

All other trademarks are the property of their respective owners.

11.2 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

11.3 术语表

SLYZ022 — TI 术语表。

这份术语表列出并解释术语、首字母缩略词和定义。