ZHCSDK2B March   2015  – March 2017 TPS61177A

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Supply Voltage
      2. 7.3.2  Boost Regulator
      3. 7.3.3  Programmable Switch Frequency and Slew Rate
      4. 7.3.4  LED Current Sinks
      5. 7.3.5  Enable and Start-Up Timing
      6. 7.3.6  Input Undervoltage Protection (UVLO)
      7. 7.3.7  Overvoltage Protection (OVP)
      8. 7.3.8  Current-Sink Open Protection
      9. 7.3.9  Overcurrent Protection
      10. 7.3.10 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Mode Selection
      2. 7.4.2 Analog and PWM Mixed Dimming Mode
      3. 7.4.3 Analog Dimming Mode
      4. 7.4.4 Direct PWM Dimming
    5. 7.5 Programming
      1. 7.5.1 Configuration Parameters
    6. 7.6 Register Maps
      1. 7.6.1  MODE (A0h)
      2. 7.6.2  CS (A1h)
      3. 7.6.3  UVLO (A2h)
      4. 7.6.4  FREQ (A3h)
      5. 7.6.5  SR (A4h)
      6. 7.6.6  ILIM (A5h)
      7. 7.6.7  Control (FFh)
      8. 7.6.8  Example - Writing to a Single RAM Register
      9. 7.6.9  Example - Writing to Multiple RAM Registers
      10. 7.6.10 Example - Saving Contents of all RAM Registers to E2PROM
      11. 7.6.11 Example - Reading from a Single RAM Register
      12. 7.6.12 Example - Reading from a Single E2PROM Register
      13. 7.6.13 Example - Reading from Multiple RAM Registers
      14. 7.6.14 Example - Reading from Multiple E2PROM Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 CS Pin Unused
      2. 8.1.2 Brightness Dimming Control
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Output Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 器件支持

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 社区资源

下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅 TI 的 《使用条款》。

    TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在 e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
    设计支持 TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。

11.3 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.