ZHCSCN2 July 2014 TPS57114-EP
PRODUCTION DATA.
PIN | DESCRIPTION | |
---|---|---|
NAME | NO. | |
AGND | 5 | Connect analog ground electrically to GND close to the device. |
BOOT | 13 | The device requires a bootstrap capacitor between BOOT and PH. Having the voltage on this capacitor below the minimum required by the BOOT UVLO forces the output to switch off until the capacitor recharges. |
COMP | 7 | Error amplifier output, and input to the output-switch current comparator. Connect frequency-compensation components to this pin. |
EN | 15 | Enable pin, internal pullup current source. Pull below 1.2 V to disable. Float to enable. An alternative use of this pin can be to set the on-off threshold (adjust UVLO) with two additional resistors. |
GND | 3 | Power ground. Electrically connect this pin directly to the thermal pad under the IC. |
4 | ||
PH | 10 | The source of the internal high-side power MOSFET and the drain of the internal low-side (synchronous) rectifier MOSFET |
11 | ||
12 | ||
PWRGD | 14 | An open-drain output; asserts low if output voltage is low due to thermal shutdown, overcurrent, overvoltage, undervoltage, or EN shutdown. |
RT/CLK | 8 | Resistor-timing or external-clock input pin. |
SS/TR | 9 | Slow start and tracking. An external capacitor connected to this pin sets the output-voltage rise time. Another use of this pin is for tracking. |
VIN | 1 | Input supply voltage, 2.95 to 6 V |
2 | ||
16 | ||
VSENSE | 6 | Inverting node of the transconductance (gm) error amplifier |
Thermal pad | — | Connect the GND pin to the exposed thermal pad for proper operation. Connect this thermal pad to any internal PCB ground plane using multiple vias for good thermal performance. |