ZHCSIY3C March   2019  – August 2019 TPS568230

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用
      2.      效率与输出电流 ECO 模式
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Operation and D-CAP3 Control
      2. 7.3.2 Soft Start
      3. 7.3.3 Large Duty Operation
      4. 7.3.4 Power Good
      5. 7.3.5 Over Current Protection and Undervoltage Protection
      6. 7.3.6 Over Voltage Protection
      7. 7.3.7 UVLO Protection
      8. 7.3.8 Output Voltage Discharge
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Light Load Operation
      2. 7.4.2 Advanced Eco-mode Control
      3. 7.4.3 Out of Audio Mode
      4. 7.4.4 Force CCM Mode
      5. 7.4.5 Mode Selection
      6. 7.4.6 Standby Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Component Selection
          1. 8.2.2.1.1 Output Voltage Set Point
          2. 8.2.2.1.2 Inductor Selection
          3. 8.2.2.1.3 Output Capacitor Selection
          4. 8.2.2.1.4 Input Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TPS568230 UNIT
RJE (VQFN)
20 PINS
RθJA Junction-to-ambient thermal resistance 44.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 32.3 °C/W
RθJB Junction-to-board thermal resistance 13.3 °C/W
ψJT Junction-to-top characterization parameter 1.3 °C/W
ψJB Junction-to-board characterization parameter 13.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 16.1 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.