ZHCSH96H MARCH   2007  – May 2019 TPS40192 , TPS40193

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化应用示意图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dissipation Ratings
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Voltage Reference
      2. 7.3.2  Oscillator
      3. 7.3.3  UVLO
      4. 7.3.4  Enable Functionality
      5. 7.3.5  Start-Up Sequence and Timing
      6. 7.3.6  Selecting the Short Circuit Current
      7. 7.3.7  5-V Regulator
      8. 7.3.8  Prebias Start-Up
      9. 7.3.9  Drivers
      10. 7.3.10 Power Good
      11. 7.3.11 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conduction Mode
      2. 7.4.2 Low-Quiescent Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Selecting the Switching Frequency
        2. 8.2.2.2  Inductor Selection
        3. 8.2.2.3  Output Capacitor Selection (C8)
        4. 8.2.2.4  Peak Current Rating of the Inductor
        5. 8.2.2.5  Input Capacitor Selection (C7)
        6. 8.2.2.6  MOSFET Switch Selection (Q1, Q2)
        7. 8.2.2.7  Boot Strap Capacitor
        8. 8.2.2.8  Input Bypass Capacitor (C6)
        9. 8.2.2.9  BP5 Bypass Capacitor (C5)
        10. 8.2.2.10 Input Voltage Filter Resistor (R11)
        11. 8.2.2.11 Short Circuit Protection (R9)
        12. 8.2.2.12 Feedback Compensation (Modeling the Power Stage)
        13. 8.2.2.13 Feedback Divider (R7, R8)
        14. 8.2.2.14 Error Amplifier Compensation (R6, R10, C1, C2, C3)
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 相关器件
      2. 11.1.2 器件命名规则
    2. 11.2 文档支持
    3. 11.3 相关链接
    4. 11.4 接收文档更新通知
    5. 11.5 社区资源
    6. 11.6 商标
    7. 11.7 静电放电警告
    8. 11.8 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.1 Layout Guidelines

  • Optionally use R11 as a VDD filter resistor
  • Locate the bypass capacitors (C7) near the power MOSFETs.
  • Terminate signal components to a signal ground island separate from power ground
  • Connect signal ground island to thermal pad with a single 10-mil wide trace.
  • Connect power ground to the source of the synchronous rectifier.
  • The thermal pad serves as the only ground for the controller.
  • PowerPAD must be connected to signal ground and power ground at a single point only. Connect the PowerPad to the system ground.
  • PowerPad™ should be directly connected to SYNC MOSFET (Q3) source with short, wide trace.
  • Locate 3-5 vias in PowerPad™ land to remove heat from the device.
  • Connect input capacitors (C7 and C9) and output capacitors (C8 andC10) grounds directly to SYNC MOSFET (Q3) source with wide copper trace or solid power ground island.
  • Locate input capacitors (C7 and C9), MOSFETs (Q2 and Q3), inductor (L1) and output capacitor (C8 andC10) over power ground island.
  • Use short, wide traces for LDRV and HDRV MOSFET connections.
  • Route SW trace near HDRV trace.
  • Route GND trace near LDRV trace.
  • Use separate analog ground island under feedback components (C1, C2, C3, R5, R6, R7, R8 and R10).
  • Connect ground islands at PowerPad™ with 10-mil wide trace opposite SYNC MOSFET (Q2) source connection.