ZHCSE73C September   2015  – July 2017 TPS25810

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
      1. 7.1.1 USB Type C Basic
      2. 7.1.2 Configuration Channel
      3. 7.1.3 Detecting a Connection
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Configuration Channel Pins CC1 and CC2
      2. 7.3.2 Current Capability Advertisement and Overload Protection
      3. 7.3.3 Undervoltage Lockout (UVLO)
        1. 7.3.3.1  Device Power Pins (IN1, IN2, AUX, OUT, and GND)
        2. 7.3.3.2  FAULT Response
        3. 7.3.3.3  Thermal Shutdown
        4. 7.3.3.4  REF
        5. 7.3.3.5  Audio Accessory Detection
        6. 7.3.3.6  Debug Accessory Detection
        7. 7.3.3.7  Plug Polarity Detection
        8. 7.3.3.8  Device Enable Control
        9. 7.3.3.9  Load Detect
        10. 7.3.3.10 Power Wake
        11. 7.3.3.11 Port Power Management (PPM)
        12. 7.3.3.12 Implementing PPM in a System with Two Type-C Ports
        13. 7.3.3.13 PPM Operation
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Type C DFP Port Implementation without BC 1.2 Support
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Input and Output Capacitance
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Type-C DFP Port Implementation with BC 1.2 (DCP Mode) Support
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Power Supply Recommendations

The device has three power supply inputs; IN1, which is directly connected to OUT via the power MOSFET, is tied to the VBUS pin in the Type-C receptacle. IN2 also has a current limiting switch and is MUXed either to the CC1 or CC2 pin in the Type-C receptacle depending on cable plug polarity. AUX is the chip supply. In most applications all three supplies are tied together. In a special implementation like power wake IN1/IN2 are tied to a single supply while AUX is powered by a supply that is always ON and can be as low as 2.9 V.

USB Specification Revisions 2.0 and 3.1 require VBUS voltage at the connector to be between 4.75 V to 5.5 V. Depending on layout and routing from supply to the connector the voltage droop on VBUS has to be tightly controlled. Locate the input supply close to the device. For all applications, a 10-μF or greater ceramic bypass capacitor between OUT and GND is recommended as close to the Type-C connector of the device as possible for local noise decoupling. The power supply should be rated higher than the current limit set to avoid voltage droops during over current and short-circuit conditions.