ZHCSPK7F November   2004  – January 2022 TPS2384

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 PMM Faults
      2. 8.3.2 Watchdog Timer
    4. 8.4 Device Functional Modes
      1. 8.4.1  Auto Mode
      2. 8.4.2  Auto Mode Functional Description
        1. 8.4.2.1 AM Discovery
        2. 8.4.2.2 AM Classification
        3. 8.4.2.3 AM Power Delivery
      3. 8.4.3  AM Faults and INTB Output
      4. 8.4.4  Over and Undervoltage Fault
      5. 8.4.5  Over Current or Current Limit Faults
      6. 8.4.6  Undercurrent Fault (DC Modulated Disconnect)
      7. 8.4.7  Power Management Mode (PMM)
        1. 8.4.7.1 13 PMM Functions
      8. 8.4.8  PMM Discovery 1
      9. 8.4.9  PMM Discovery 2
      10. 8.4.10 PMM Classification
      11. 8.4.11 PMM Legacy
      12. 8.4.12 PMM Rup Pwr
      13. 8.4.13 PMM RDWN
    5. 8.5 Programming
      1. 8.5.1 I2C Interface Description
      2. 8.5.2 Start and Stop
      3. 8.5.3 Chip Address
      4. 8.5.4 Chip Addressing
      5. 8.5.5 Data Write Cycle
      6. 8.5.6 Port and Register Cycle
      7. 8.5.7 Data Read Cycle
    6. 8.6 Register Maps
      1. 8.6.1 Register/Port Addressing Map
      2. 8.6.2 Common Read, Register Select
      3. 8.6.3 Common Write, Register Select = 1111 (Test Register)
      4. 8.6.4 Common Control Write, Register Select = 0001
      5. 8.6.5 Port Control Write 1, Register Select = 0010 (One Per Port)
      6. 8.6.6 Port Control Write 2, Register Select = 0011 (One Per Port)
      7. 8.6.7 Port Status Read 1, Register Select = 0100 (One Per Port)
      8. 8.6.8 Port Status Read 2, Register Select = 0101 (One Per Port)
      9. 8.6.9 A/D Results Registers (Discovery Current, Voltage, Current and Temperature)
        1. 8.6.9.1 Discovery Current — Lower Bits, Register Select = 0110 (One Per Port)
        2. 8.6.9.2 Discovery Current — Upper Bits, Register Select = 0111 (One Per Port)
        3. 8.6.9.3 Voltage — Lower Bits, Register Select = 1000 (One Per Port)
        4. 8.6.9.4 Voltage — Upper Bits, Register Select = 1001 (One Per Port)
        5. 8.6.9.5 Current — Lower Bits, Register Select = 1010 (One Per Port)
        6. 8.6.9.6 Current — Upper Bits, Register Select = 1011 (One Per Port)
        7. 8.6.9.7 Temperature — Lower Bits, Register Select = 1100 (One Per Port)
        8. 8.6.9.8 Temperature — Upper Bits, Register Select = 1101 (One Per Port)
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 AC Disconnect Drive Circuit Detail
      2. 9.1.2 Connection of Unused Ports and Pins
      3. 9.1.3 Opto-isolator Interface
      4. 9.1.4 Port Protection from Electrical Transients
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Power Pin Bypass Capacitors
        2. 9.2.2.2 Per Port Components
        3. 9.2.2.3 Bias and Timing
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Local Circuits
      2. 11.1.2 System Protection Circuits
    2. 11.2 Layout Example
    3. 11.3 Thermal Consideration
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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6.4 Thermal Information

THERMAL METRIC(1) PAP [HTQFP] PJD [HTQFP] UNIT
64 PINS 64 PINS
RθJA Junction-to-ambient thermal resistance 23.9 30.1(2) °C/W
RθJC(top) Junction-to-case (top) thermal resistance 8.4 0.3
RθJB Junction-to-board thermal resistance 6.9 7.4
ψJT Junction-to-top characterization parameter 0.2 0.2
ψJB Junction-to-board characterization parameter 6.8 7.4
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.2 N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) RθJA varies with the heat sink used. Data modeled using 15 mm x 15 mm x 5 mm copper block heat sink.