SLVSDF2A May   2017  – July 2017 TPS22970

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical DC Characteristics
    8. 6.8 Typical AC Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 On and Off Control
      2. 8.3.2 Quick Output Discharge (QOD)
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Thermal Consideration
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Maximum Voltage Drop and On-Resistance
        2. 9.2.2.2 Managing Inrush Current
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN Input voltage –0.3 4 V
VOUT Output voltage –0.3 4 V
VON ON voltage –0.3 4 V
IMAX Maximum continuous switch current 4 A
IPLS Maximum pulsed switch current, pulse < 300-µs, 2% duty cycle 6 A
TJ Maximum junction temperature Internally Limited
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN Input voltage 0.65 3.6 V
VOUT Output voltage VIN V
VIH High-level input voltage, ON 0.9 3.6 V
VIL Low-level input voltage, ON 0 0.45 V
TJ Operating temperature –40 125 °C
TA Operating free-air temperature –40 105 °C

6.4 Thermal Information

THERMAL METRIC (1) TPS22970 UNIT
YZP (DSBGA)
8 PINS
RθJA Junction-to-ambient thermal resistance 130 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 54 °C/W
RθJB Junction-to-board thermal resistance 51 °C/W
ψJT Junction-to-top characterization parameter 1 °C/W
ψJB Junction-to-board characterization parameter 50 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

Unless otherwise noted, VIN = 0.65 V to 3.6 V
PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT
IQ Quiescent current VOUT = Open, Switch enabled VIN > 1.2 V –40°C to +85°C 30 65 µA
–40°C to +105°C 75
VIN ≤ 1.2 V –40°C to +85°C 20 50
–40°C to +105°C 55
ISD Shutdown current VOUT = GND, Switch disabled VIN > 1.8 V –40°C to +85°C 1 7.5 µA
–40°C to +105°C 18
VIN ≤ 1.8 V –40°C to +85°C 0.9 5
–40°C to +105°C 9.5
RON ON-resistance IOUT = –200 mA VIN ≥ 1.8 V 25°C 4.7 8.5 mΩ
–40°C to +85°C 9.5
–40°C to +105°C 11.5
VIN = 1.2 V 25°C 4.9 9.1
–40°C to +85°C 10.1
–40°C to +105°C 12.1
VIN = 1.05 V 25°C 5.1 9.4
–40°C to +85°C 10.4
–40°C to +105°C 12.4
VIN = 0.65 V 25°C 6.4 11.5
–40°C to +85°C 12.5
–40°C to +105°C 14.5
RPD Output pull down resistance(1) IOUT = 3 mA, Switch disabled VIN = 3.6 V –40°C to +105°C 150 Ω
VIN = 0.65 V –40°C to +105°C 710 Ω
ION ON input leakage current VON = 0 V to 3.6 V –40°C to +105°C 0.1 µA
TSD Thermal shutdown Junction temperature rising 170 °C
TSD, HYS Thermal shutdown hysteresis Junction temperature falling 30 °C
(1) See the Quick Output Discharge (QOD) section.

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN = 3.6 V, VON = 3.6 V,
TA = 25°C (unless otherwise noted)
tON Turn-ON time CL = 0.1 µF, RL = 10 Ω 1530 µs
tOFF Turn-OFF time CL = 0.1 µF, RL = 10 Ω 3.2
tR VOUT Rise time CL = 0.1 µF, RL = 10 Ω 985
tF VOUT Fall time CL = 0.1 µF, RL = 10 Ω 1.8
tD ON delay time CL = 0.1 µF, RL = 10 Ω 550
VIN = 1.8 V, VON = 3.6 V,
TA = 25°C (unless otherwise noted)
tON Turn-ON time CL = 0.1 µF, RL = 10 Ω 1170 µs
tOFF Turn-OFF time CL = 0.1 µF, RL = 10 Ω 4.9
tR VOUT Rise Time CL = 0.1 µF, RL = 10 Ω 645
tF VOUT Fall time CL = 0.1 µF, RL = 10 Ω 2.2
tD ON delay time CL = 0.1 µF, RL = 10 Ω 525
VIN = 0.65 V, VON = 3.6 V,
TA = 25°C (unless otherwise noted)
tON Turn-ON time CL = 0.1 µF, RL = 10 Ω 815 µs
tOFF Turn-OFF time CL = 0.1 µF, RL = 10 Ω 61
tR VOUT Rise time CL = 0.1 µF, RL = 10 Ω 320
tF VOUT Fall time CL = 0.1 µF, RL = 10 Ω 6.3
tD ON delay time CL = 0.1 µF, RL = 10 Ω 495

6.7 Typical DC Characteristics

TPS22970 D001_SLVSDF2.gif
VON = 3.6 V VOUT = Open
Figure 1. Quiescent Current vs Temperature
TPS22970 D003_SLVSDF2.gif
VON = 3.6 V IOUT = -200 mA
Figure 3. On-Resistance vs Temperature
TPS22970 D002_SLVSDF2.gif
VON = 0 V VOUT = GND
Figure 2. Input Shutdown Current vs Temperature
TPS22970 D004_SLVSDF2.gif
VON = 0 V IOUT = 3 mA
Figure 4. Output Pull-Down Resistance vs Temperature

6.8 Typical AC Characteristics

TPS22970 D005_SLVSDF2.gif Figure 5. Turn-ON Time vs Temperature
TPS22970 D007_SLVSDF2.gif Figure 7. Rise Time vs Temperature
TPS22970 D009_SLVSDF2.gif
RL = 10 Ω CL = 0.1 µF
Figure 9. Delay Time vs Temperature
TPS22970 1p8_Rise.png
RL = 10 Ω TA = 25°C CL = 0.1 µF
Figure 11. Turn-ON Response at 1.8 VIN
TPS22970 3p6_Fall.png
RL = 10 Ω TA = 25°C CL = 0.1 µF
Figure 13. Turn-OFF Response at 3.6 VIN
TPS22970 0p65_Fall.png
RL = 10 Ω TA = 25°C CL = 0.1 µF
Figure 15. Turn-OFF Response at 0.65 VIN
TPS22970 0p65_cout147.png
RL = OPEN TA = 25°C CL = 147 µF
Figure 17. Inrush Current at 0.65 VIN
TPS22970 D006_SLVSDF2.gif Figure 6. Turn-OFF Time vs Temperature
TPS22970 D008_SLVSDF2.gif
RL = 10 Ω CL = 0.1 µF
Figure 8. Fall Time vs Temperature
TPS22970 3p6_Rise.png
RL = 10 Ω TA = 25°C CL = 0.1 µF
Figure 10. Turn-ON Response at 3.6 VIN
TPS22970 0p65_Rise.png
RL = 10 Ω TA = 25°C CL = 0.1 µF
Figure 12. Turn-ON Response at 0.65 VIN
TPS22970 1p8_Fall.png
RL = 10 Ω TA = 25°C CL = 0.1 µF
Figure 14. Turn-OFF Response at 1.8 VIN
TPS22970 3p6_cout147.png
RL = OPEN TA = 25°C CL = 147 µF
Figure 16. Inrush Current at 3.6 VIN