ZHCSF76B July   2016  – December 2019 TPS22918-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
      2.      导通电阻与输入电压间的关系典型值
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical DC Characteristics
    8. 6.8 Typical AC Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 On and Off Control
      2. 8.3.2 Quick Output Discharge (QOD)
        1. 8.3.2.1 QOD when System Power is Removed
        2. 8.3.2.2 Internal QOD Considerations
      3. 8.3.3 Adjustable Rise Time (CT)
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input Capacitor (CIN)
        2. 9.2.2.2 Output Capacitor (CL) (Optional)
        3. 9.2.2.3 Shutdown Sequencing During Unexpected System Power Loss
        4. 9.2.2.4 VIN to VOUT Voltage Drop
        5. 9.2.2.5 Inrush Current
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 接收文档更新通知
    4. 12.4 社区资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.6 Switching Characteristics

See timing test circuit in Figure 21 (unless otherwise noted) for references to external components used for the test condition in the switching characteristics table. Switching characteristics shown below are only valid for the power-up sequence where VIN is already in steady state condition before the ON pin is asserted high. Test Conditions: VON = 5 V, TA = 25°C.
PARAMETER TEST CONDITION MIN TYP MAX UNIT
VIN = 5 V
tON Turnon time RL = 10 Ω, CIN = 1 µF, COUT = 0.1 µF, CT = 1000 pF 1950 µs
tOFF Turnoff time RL = 10 Ω, CIN = 1 µF, COUT = 0.1 µF, CT = 1000 pF 2 µs
tR VOUT rise time RL = 10 Ω, CIN = 1 µF, COUT = 0.1 µF, CT = 1000 pF 2540 µs
tF VOUT fall time RL = 10 Ω, CIN = 1 µF, COUT = 0.1 µF, CT = 1000 pF 2 µs
tD Delay time RL = 10 Ω, CIN = 1 µF, COUT = 0.1 µF, CT = 1000 pF 690 µs
VIN = 3.3 V
tON Turnon time RL = 10 Ω, CIN = 1 µF, COUT = 0.1 µF, CT = 1000 pF 1430 µs
tOFF Turnoff time RL = 10 Ω, CIN = 1 µF, COUT = 0.1 µF, CT = 1000 pF 2 µs
tR VOUT rise time RL = 10 Ω, CIN = 1 µF, COUT = 0.1 µF, CT = 1000 pF 1680 µs
tF VOUT fall time RL = 10 Ω, CIN = 1 µF, COUT = 0.1 µF, CT = 1000 pF 2 µs
tD Delay time RL = 10 Ω, CIN = 1 µF, COUT = 0.1 µF, CT = 1000 pF 590 µs
VIN = 1.8 V
tON Turnon time RL = 10 Ω, CIN = 1 µF, COUT = 0.1 µF, CT = 1000 pF 965 µs
tOFF Turnoff time RL = 10 Ω, CIN = 1 µF, COUT = 0.1 µF, CT = 1000 pF 2 µs
tR VOUT rise time RL = 10 Ω, CIN = 1 µF, COUT = 0.1 µF, CT = 1000 pF 960 µs
tF VOUT fall time RL = 10 Ω, CIN = 1 µF, COUT = 0.1 µF, CT = 1000 pF 2 µs
tD Delay time RL = 10 Ω, CIN = 1 µF, COUT = 0.1 µF, CT = 1000 pF 480 µs
VIN = 1 V
tON Turnon time RL = 10 Ω, CIN = 1 µF, COUT = 0.1 µF, CT = 1000 pF 725 µs
tOFF Turnoff time RL = 10 Ω, CIN = 1 µF, COUT = 0.1 µF, CT = 1000 pF 3 µs
tR VOUT rise time RL = 10 Ω, CIN = 1 µF, COUT = 0.1 µF, CT = 1000 pF 560 µs
tF VOUT fall time RL = 10 Ω, CIN = 1 µF, COUT = 0.1 µF, CT = 1000 pF 2 µs
tD Delay time RL = 10 Ω, CIN = 1 µF, COUT = 0.1 µF, CT = 1000 pF 430 µs