SLVSAU6I June   2011  – May 2026 TPS2000C , TPS2001C , TPS2041C , TPS2051C , TPS2061C , TPS2065C , TPS2065C-2 , TPS2068C , TPS2069C , TPS2069C-2

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: SOT-23
    5. 6.5 Thermal Information: MSOP-PowerPAD
    6. 6.6 Electrical Characteristics: TJ = TA = 25°C
    7. 6.7 Electrical Characteristics: –40°C ≤ TJ ≤ 125°C
    8. 6.8 Timing Requirements: TJ = TA = 25°C
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout
      2. 7.3.2 Enable
      3. 7.3.3 Internal Charge Pump
      4. 7.3.4 Current Limit
      5. 7.3.5 FLT
      6. 7.3.6 Output Discharge
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitance
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation and Junction Temperature
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.5 Thermal Information: MSOP-PowerPAD

THERMAL METRIC(1)TPS20xxC, TPS20xxC-2UNIT
DGN
(MSOP-PowerPAD)(2)		DGN
(MSOP-PowerPAD)(3)		DGK
(VSSOP)(4)
8 PINS8 PINS8 PINS
RθJAJunction-to-ambient thermal resistance72.167.1205.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance87.380.894.3°C/W
RθJBJunction-to-board thermal resistance42.237.2126.9°C/W
ψJTJunction-to-top characterization parameter7.35.624.7°C/W
ψJBJunction-to-board characterization parameter4236.9125.2°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance39.232.1—°C/W
RθJACustomSee Power Dissipation and Junction Temperature66.561.3110.3°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) Rated at 0.5 A or 1 A.
(3) Rated at 1.5 A or 2 A.
(4) Rated at 2 A.