SLVSAU6I June   2011  – May 2026 TPS2000C , TPS2001C , TPS2041C , TPS2051C , TPS2061C , TPS2065C , TPS2065C-2 , TPS2068C , TPS2069C , TPS2069C-2

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: SOT-23
    5. 6.5 Thermal Information: MSOP-PowerPAD
    6. 6.6 Electrical Characteristics: TJ = TA = 25°C
    7. 6.7 Electrical Characteristics: –40°C ≤ TJ ≤ 125°C
    8. 6.8 Timing Requirements: TJ = TA = 25°C
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout
      2. 7.3.2 Enable
      3. 7.3.3 Internal Charge Pump
      4. 7.3.4 Current Limit
      5. 7.3.5 FLT
      6. 7.3.6 Output Discharge
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitance
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation and Junction Temperature
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

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6.4 Thermal Information: SOT-23

THERMAL METRIC(1) TPS20xxC, TPS20xxC-2 UNIT
DBV (SOT-23)(2) DBV (SOT-23)(3)
5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 224.9 220.4 °C/W
RθJCtop Junction-to-case (top) thermal resistance 95.2 89.7 °C/W
RθJB Junction-to-board thermal resistance 51.4 46.9 °C/W
ψJT Junction-to-top characterization parameter 6.6 5.2 °C/W
ψJB Junction-to-board characterization parameter 50.3 46.2 °C/W
RθJCbot Junction-to-case (bottom) thermal resistance — — °C/W
RθJACustom See Power Dissipation and Junction Temperature 139.3 134.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) Rated at 0.5 A or 1 A.
(3) Rated at 1.5 A or 2 A.