SLVSA01C May   2011  – June 2016 TPS2062-Q1 , TPS2065-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dissipation Ratings
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Power Switch
      2. 8.3.2 Charge Pump
      3. 8.3.3 Driver
      4. 8.3.4 Enable (ENx for TPS2062-Q1) and (EN for TPS2065-Q1)
      5. 8.3.5 Overcurrent (OCx)
      6. 8.3.6 Current Sense
      7. 8.3.7 Thermal Sense
      8. 8.3.8 Undervoltage Lockout
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Overcurrent
      2. 9.1.2 OC Response
      3. 9.1.3 Undervoltage Lockout (UVLO)
      4. 9.1.4 Universal Serial Bus (USB) Applications
      5. 9.1.5 Host, Self-Powered (SPH), and Bus-Powered Hubs (BPH)
      6. 9.1.6 Low-Power Bus-Powered and High-Power Bus-Powered Functions
      7. 9.1.7 USB Power-Distribution Requirements
      8. 9.1.8 Generic Hot-Plug Applications
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
    3. 11.3 Thermal Considerations
    4. 11.4 Power Dissipation and Junction Temperature
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Related Links
    4. 12.4 Community Resource
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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10 Power Supply Recommendations

TI recommends using a 0.01-μF to 0.1-μF ceramic bypass capacitor between IN and GND, close to the device. TI recommends placing a high-value electrolytic capacitor on the output pin(s) when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor improves the immunity of the device to short-circuit transients.