SLVSC77D August   2013  – April 2016 TPD2E1B06

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Operating temperature –40 125 °C
IPP Peak pulse current (tp = 8/20 μs)(2) 2.5 A
PPP Peak pulse power (tp = 8/20 μs)(2) 35 W
Tstg Storage temperature –65 155 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Using Routing Option 1 or 2 as shown in Figure 13 or Figure 14.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge IEC 61000-4-2 contact discharge(2) ±10000 V
IEC 61000-4-2 air-gap discharge(2) ±15000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIO Pin IOA1 to IOA2; Pin IOB1 to IOB2 –5.5 5.5 V
TA Operating free-air temperature –40 125 °C

6.4 Thermal Information

over operating free-air temperature range (unless otherwise noted)
THERMAL METRIC(1) TPD2E1B06 UNIT
DRL (SOT)
6 PINS
RθJA Junction-to-ambient thermal resistance 349.7 ºC/W
RθJC(top) Junction-to-case (top) thermal resistance 120.5 ºC/W
RθθJB Junction-to-board thermal resistance 171.4 ºC/W
ψJT Junction-to-top characterization parameter 10.8 ºC/W
ψJB Junction-to-board characterization parameter 169.4 ºC/W
(1) For more information about traditional and new thermal metrics, the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over operating free-air temperature range. (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VRWM Reverse standoff voltage 5.5 V
VCLAMP Clamp voltage with ESD strike IPP = 1 A, TLP, I/O to GND(1)(2) 11 V
IPP = 5 A, TLP, I/O to GND(1)(2) 15
VCLAMP Clamp voltage with ESD strike IPP = 1 A, TLP, GND to I/O (1)(2) 11 V
IPP = 5 A, TLP, GND to I/O (1)(2) 15
RDYN Dynamic resistance 0.9 Ω
CL1 Pin 2 and 5 capacitance Pin 1 and 4 = GND, f = 1 MHz, VBIAS = 2.5 V(2)(3) 0.85 pF
CL2 Pin 1 and 4 capacitance Pin 2 and 5 = GND, f = 1 MHz, VBIAS = 2.5 V(2)(4) 1.05 pF
VBR Break-down voltage IIO = 1 mA 7 9.5 V
ILEAK Leakage current VBIAS = +2.5 V 1 10 nA
(1) Transmission line pulse with rise time 10 ns and pulse width 100 ns.
(2) TA = 25°C
(3) Using Routing Option 1, Figure 13.
(4) Using Routing Option 2, Figure 14.

6.6 Typical Characteristics

TPD2E1B06 C001_SLVSC77.png Figure 1. IV Curve
TPD2E1B06 C003_SLVSC77.png Figure 3. ILEAK vs Temperature
TPD2E1B06 C005_SLVSC77.png Figure 5. –8-kV Contact ESD Clamping
TPD2E1B06 C007_SLVSC77.png Figure 7. Capacitance vs VBIAS
TPD2E1B06 eye_w_lvsc77.gif Figure 9. Eye Diagram With TPD2E1B06DRL on EVM
TPD2E1B06 C002_SLVSC77.png Figure 2. Maximum Surge Rating
TPD2E1B06 C004_SLVSC77.png Figure 4. +8-kV Contact ESD Clamping
TPD2E1B06 C006_SLVSC77.png Figure 6. Insertion Loss
TPD2E1B06 eye_wo_lvsc77.gif Figure 8. Eye Diagram Without TPD2E1B06DRL on EVM