ZHCSDW8C April   2015  – December 2017 TPA3144D2

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Gain Setting via GAIN Pin
      2. 9.3.2  SD Operation
      3. 9.3.3  Gain Limit Control, LIMTHRES and LIMRATE
      4. 9.3.4  SPEAKERGUARD Automatic Gain Limit, AGL
      5. 9.3.5  Thermal Foldback, TFB
      6. 9.3.6  PLIMIT
      7. 9.3.7  LIMTHRES
      8. 9.3.8  Spread Spectrum and De-Phase Control
      9. 9.3.9  GVDD Supply
      10. 9.3.10 DC Detect
      11. 9.3.11 PBTL Select
      12. 9.3.12 Short-Circuit Protection and Automatic Recovery Feature
      13. 9.3.13 Thermal Protection
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 PCB Material Recommendation
        2. 10.2.1.2 PVCC Capacitor Recommendation
        3. 10.2.1.3 Decoupling Capacitor Recommendations
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Ferrite Bead Filter Considerations
        2. 10.2.2.2 Efficiency: LC Filter Required with the Traditional Class-D Modulation Scheme
        3. 10.2.2.3 When to Use an Output Filter for EMI Suppression
        4. 10.2.2.4 Input Resistance
        5. 10.2.2.5 Input Capacitor, Ci
        6. 10.2.2.6 BSN and BSP Capacitors
        7. 10.2.2.7 Differential Inputs
        8. 10.2.2.8 Using Low-ESR Capacitors
      3. 10.2.3 Application Performance Curves
        1. 10.2.3.1 EN55013 Radiated Emissions Results
        2. 10.2.3.2 EN55022 Conducted Emissions Results
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling, CS
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 第三方产品免责声明
    2. 13.2 文档支持
      1. 13.2.1 相关文档
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.2.3.1 EN55013 Radiated Emissions Results

TPA3144D2 EVM, PVCC = 12 V, 8-Ω load, up to 1 meter speaker cable, Spread Spectrum enabled, PO = 1.25 W
TPA3144D2 CISPR_Pre_Scan_Hor_30MHz_1GHz_los882.gif
CISPR Class B 3m 30-1000MHz Scan#7- TPA3144D2 EVM with 8R Load, Different ferrite choke, Murata 601FB+1nF, 1-meter cable, Battery supply, SS-TRI, BD, 1.25W, Spkr Wire Config2
Figure 30. Radiated Emission - Horizontal
TPA3144D2 CISPR_Pre_Scan_Ver_30MHz_1GHz.gif
CISPR Class B 3m 30-1000MHz Scan#7- TPA3144D2 EVM with 8R Load, Different ferrite choke, Murata 601FB+1nF, 1-meter cable, Battery supply, SS-TRI, BD, 1.25W, Spkr Wire Config2
Figure 31. Radiated Emission - Vertical

Table 6. Radiated Emission - Horizontal

FREQUENCY
MHz		 LIMIT
dBµV/m		 PEAKS
dBµV/m		 Q-PEAK
dBµV/m		 MARGIN
dB		 TURN TABLE
DEGREES		 TOWER
cm
166.246 40.457 21.781 21.975 –18.482 44.9 100
237.372 47.457 29.330 29.186 –18.271 326.9 100

space

Table 7. Radiated Emission - Vertical

FREQUENCY
MHz		 LIMIT
dBµV/m		 PEAKS
dBµV/m		 Q-PEAK
dBµV/m		 MARGIN
dB		 TURN TABLE
DEGREES		 TOWER
cm
56.841 40.457 26.213 27.058 –13.399 54 100
241.9 47.457 19.429 20.430 –27.027 –0.1 100