ZHCSCJ1C February   2014  – June 2016 TMS570LC4357

PRODUCTION DATA.  

  1. 器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 修订历史记录
  3. Device Comparison
  4. Terminal Configuration and Functions
    1. 4.1 ZWT BGA Package Ball-Map (337 Terminal Grid Array)
    2. 4.2 Terminal Functions
      1. 4.2.1 ZWT Package
        1. 4.2.1.1  Multibuffered Analog-to-Digital Converters (MibADC)
        2. 4.2.1.2  Enhanced High-End Timer Modules (N2HET)
        3. 4.2.1.3  RAM Trace Port (RTP)
        4. 4.2.1.4  Enhanced Capture Modules (eCAP)
        5. 4.2.1.5  Enhanced Quadrature Encoder Pulse Modules (eQEP)
        6. 4.2.1.6  Enhanced Pulse-Width Modulator Modules (ePWM)
        7. 4.2.1.7  Data Modification Module (DMM)
        8. 4.2.1.8  General-Purpose Input / Output (GIO)
        9. 4.2.1.9  FlexRay Interface Controller (FlexRay)
        10. 4.2.1.10 Controller Area Network Controllers (DCAN)
        11. 4.2.1.11 Local Interconnect Network Interface Module (LIN)
        12. 4.2.1.12 Standard Serial Communication Interface (SCI)
        13. 4.2.1.13 Inter-Integrated Circuit Interface Module (I2C)
        14. 4.2.1.14 Multibuffered Serial Peripheral Interface Modules (MibSPI)
        15. 4.2.1.15 Ethernet Controller
        16. 4.2.1.16 External Memory Interface (EMIF)
        17. 4.2.1.17 Embedded Trace Macrocell Interface for Cortex-R5F (ETM-R5)
        18. 4.2.1.18 System Module Interface
        19. 4.2.1.19 Clock Inputs and Outputs
        20. 4.2.1.20 Test and Debug Modules Interface
        21. 4.2.1.21 Flash Supply and Test Pads
        22. 4.2.1.22 Supply for Core Logic: 1.2-V Nominal
        23. 4.2.1.23 Supply for I/O Cells: 3.3-V Nominal
        24. 4.2.1.24 Ground Reference for All Supplies Except VCCAD
        25. 4.2.1.25 Other Supplies
      2. 4.2.2 Multiplexing
        1. 4.2.2.1 Output Multiplexing
          1. 4.2.2.1.1 Notes on Output Multiplexing
        2. 4.2.2.2 Input Multiplexing
          1. 4.2.2.2.1 Notes on Input Multiplexing
          2. 4.2.2.2.2 General Rules for Multiplexing Control Registers
  5. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Power-On Hours (POH)
    4. 5.4  Device Recommended Operating Conditions
    5. 5.5  Switching Characteristics over Recommended Operating Conditions for Clock Domains
    6. 5.6  Wait States Required - L2 Memories
    7. 5.7  Power Consumption Summary
    8. 5.8  Input/Output Electrical Characteristics Over Recommended Operating Conditions
    9. 5.9  Thermal Resistance Characteristics for the BGA Package (ZWT)
    10. 5.10 Timing and Switching Characteristics
      1. 5.10.1 Input Timings
      2. 5.10.2 Output Timings
  6. System Information and Electrical Specifications
    1. 6.1  Device Power Domains
    2. 6.2  Voltage Monitor Characteristics
      1. 6.2.1 Important Considerations
      2. 6.2.2 Voltage Monitor Operation
      3. 6.2.3 Supply Filtering
    3. 6.3  Power Sequencing and Power-On Reset
      1. 6.3.1 Power-Up Sequence
      2. 6.3.2 Power-Down Sequence
      3. 6.3.3 Power-On Reset: nPORRST
        1. 6.3.3.1 nPORRST Electrical and Timing Requirements
    4. 6.4  Warm Reset (nRST)
      1. 6.4.1 Causes of Warm Reset
      2. 6.4.2 nRST Timing Requirements
    5. 6.5  ARM Cortex-R5F CPU Information
      1. 6.5.1 Summary of ARM Cortex-R5F CPU Features
      2. 6.5.2 Dual Core Implementation
      3. 6.5.3 Duplicate Clock Tree After GCLK
      4. 6.5.4 ARM Cortex-R5F CPU Compare Module (CCM) for Safety
        1. 6.5.4.1 Signal Compare Operating Modes
          1. 6.5.4.1.1 Active Compare Lockstep Mode
          2. 6.5.4.1.2 Self-Test Mode
          3. 6.5.4.1.3 Error Forcing Mode
          4. 6.5.4.1.4 Self-Test Error Forcing Mode
        2. 6.5.4.2 Bus Inactivity Monitor
        3. 6.5.4.3 CPU Registers Initialization
      5. 6.5.5 CPU Self-Test
        1. 6.5.5.1 Application Sequence for CPU Self-Test
        2. 6.5.5.2 CPU Self-Test Clock Configuration
        3. 6.5.5.3 CPU Self-Test Coverage
      6. 6.5.6 N2HET STC / LBIST Self-Test Coverage
    6. 6.6  Clocks
      1. 6.6.1 Clock Sources
        1. 6.6.1.1 Main Oscillator
          1. 6.6.1.1.1 Timing Requirements for Main Oscillator
        2. 6.6.1.2 Low-Power Oscillator
          1. 6.6.1.2.1 Features
          2. 6.6.1.2.2 LPO Electrical and Timing Specifications
        3. 6.6.1.3 Phase-Locked Loop (PLL) Clock Modules
          1. 6.6.1.3.1 Block Diagram
          2. 6.6.1.3.2 PLL Timing Specifications
        4. 6.6.1.4 External Clock Inputs
      2. 6.6.2 Clock Domains
        1. 6.6.2.1 Clock Domain Descriptions
        2. 6.6.2.2 Mapping of Clock Domains to Device Modules
      3. 6.6.3 Special Clock Source Selection Scheme for VCLKA4_DIVR_EMAC
      4. 6.6.4 Clock Test Mode
    7. 6.7  Clock Monitoring
      1. 6.7.1 Clock Monitor Timings
      2. 6.7.2 External Clock (ECLK) Output Functionality
      3. 6.7.3 Dual Clock Comparators
        1. 6.7.3.1 Features
        2. 6.7.3.2 Mapping of DCC Clock Source Inputs
    8. 6.8  Glitch Filters
    9. 6.9  Device Memory Map
      1. 6.9.1 Memory Map Diagram
      2. 6.9.2 Memory Map Table
      3. 6.9.3 Special Consideration for CPU Access Errors Resulting in Imprecise Aborts
      4. 6.9.4 Master/Slave Access Privileges
        1. 6.9.4.1 Special Notes on Accesses to Certain Slaves
      5. 6.9.5 MasterID to PCRx
      6. 6.9.6 CPU Interconnect Subsystem SDC MMR Port
      7. 6.9.7 Parameter Overlay Module (POM) Considerations
    10. 6.10 Flash Memory
      1. 6.10.1 Flash Memory Configuration
      2. 6.10.2 Main Features of Flash Module
      3. 6.10.3 ECC Protection for Flash Accesses
      4. 6.10.4 Flash Access Speeds
      5. 6.10.5 Flash Program and Erase Timings
        1. 6.10.5.1 Flash Program and Erase Timings for Program Flash
        2. 6.10.5.2 Flash Program and Erase Timings for Data Flash
    11. 6.11 L2RAMW (Level 2 RAM Interface Module)
      1. 6.11.1 L2 SRAM Initialization
    12. 6.12 ECC / Parity Protection for Accesses to Peripheral RAMs
    13. 6.13 On-Chip SRAM Initialization and Testing
      1. 6.13.1 On-Chip SRAM Self-Test Using PBIST
        1. 6.13.1.1 Features
        2. 6.13.1.2 PBIST RAM Groups
      2. 6.13.2 On-Chip SRAM Auto Initialization
    14. 6.14 External Memory Interface (EMIF)
      1. 6.14.1 Features
      2. 6.14.2 Electrical and Timing Specifications
        1. 6.14.2.1 Read Timing (Asynchronous RAM)
        2. 6.14.2.2 Write Timing (Asynchronous RAM)
        3. 6.14.2.3 EMIF Asynchronous Memory Timing
        4. 6.14.2.4 Read Timing (Synchronous RAM)
        5. 6.14.2.5 Write Timing (Synchronous RAM)
        6. 6.14.2.6 EMIF Synchronous Memory Timing
    15. 6.15 Vectored Interrupt Manager
      1. 6.15.1 VIM Features
      2. 6.15.2 Interrupt Generation
      3. 6.15.3 Interrupt Request Assignments
    16. 6.16 ECC Error Event Monitoring and Profiling
      1. 6.16.1 EPC Module Operation
        1. 6.16.1.1 Correctable Error Handling
        2. 6.16.1.2 Uncorrectable Error Handling
    17. 6.17 DMA Controller
      1. 6.17.1 DMA Features
      2. 6.17.2 DMA Transfer Port Assignment
      3. 6.17.3 Default DMA Request Map
      4. 6.17.4 Using a GIO terminal as a DMA Request Input
    18. 6.18 Real-Time Interrupt Module
      1. 6.18.1 Features
      2. 6.18.2 Block Diagrams
      3. 6.18.3 Clock Source Options
      4. 6.18.4 Network Time Synchronization Inputs
    19. 6.19 Error Signaling Module
      1. 6.19.1 ESM Features
      2. 6.19.2 ESM Channel Assignments
    20. 6.20 Reset / Abort / Error Sources
    21. 6.21 Digital Windowed Watchdog
    22. 6.22 Debug Subsystem
      1. 6.22.1  Block Diagram
      2. 6.22.2  Debug Components Memory Map
      3. 6.22.3  Embedded Cross Trigger
      4. 6.22.4  JTAG Identification Code
      5. 6.22.5  Debug ROM
      6. 6.22.6  JTAG Scan Interface Timings
      7. 6.22.7  Advanced JTAG Security Module
      8. 6.22.8  Embedded Trace Macrocell (ETM-R5)
        1. 6.22.8.1 ETM TRACECLKIN Selection
        2. 6.22.8.2 Timing Specifications
      9. 6.22.9  RAM Trace Port (RTP)
        1. 6.22.9.1 RTP Features
        2. 6.22.9.2 Timing Specifications
      10. 6.22.10 Data Modification Module (DMM)
        1. 6.22.10.1 DMM Features
        2. 6.22.10.2 Timing Specifications
      11. 6.22.11 Boundary Scan Chain
  7. Peripheral Information and Electrical Specifications
    1. 7.1  Enhanced Translator PWM Modules (ePWM)
      1. 7.1.1 ePWM Clocking and Reset
      2. 7.1.2 Synchronization of ePWMx Time-Base Counters
      3. 7.1.3 Synchronizing all ePWM Modules to the N2HET1 Module Time Base
      4. 7.1.4 Phase-Locking the Time-Base Clocks of Multiple ePWM Modules
      5. 7.1.5 ePWM Synchronization with External Devices
      6. 7.1.6 ePWM Trip Zones
        1. 7.1.6.1 Trip Zones TZ1n, TZ2n, TZ3n
        2. 7.1.6.2 Trip Zone TZ4n
        3. 7.1.6.3 Trip Zone TZ5n
        4. 7.1.6.4 Trip Zone TZ6n
      7. 7.1.7 Triggering of ADC Start of Conversion Using ePWMx SOCA and SOCB Outputs
      8. 7.1.8 Enhanced Translator-Pulse Width Modulator (ePWMx) Electrical Data/Timing
    2. 7.2  Enhanced Capture Modules (eCAP)
      1. 7.2.1 Clock Enable Control for eCAPx Modules
      2. 7.2.2 PWM Output Capability of eCAPx
      3. 7.2.3 Input Connection to eCAPx Modules
      4. 7.2.4 Enhanced Capture Module (eCAP) Electrical Data/Timing
    3. 7.3  Enhanced Quadrature Encoder (eQEP)
      1. 7.3.1 Clock Enable Control for eQEPx Modules
      2. 7.3.2 Using eQEPx Phase Error to Trip ePWMx Outputs
      3. 7.3.3 Input Connection to eQEPx Modules
      4. 7.3.4 Enhanced Quadrature Encoder Pulse (eQEPx) Timing
    4. 7.4  12-bit Multibuffered Analog-to-Digital Converter (MibADC)
      1. 7.4.1 MibADC Features
      2. 7.4.2 Event Trigger Options
        1. 7.4.2.1 MibADC1 Event Trigger Hookup
        2. 7.4.2.2 MibADC2 Event Trigger Hookup
        3. 7.4.2.3 Controlling ADC1 and ADC2 Event Trigger Options Using SOC Output from ePWM Modules
      3. 7.4.3 ADC Electrical and Timing Specifications
      4. 7.4.4 Performance (Accuracy) Specifications
        1. 7.4.4.1 MibADC Nonlinearity Errors
        2. 7.4.4.2 MibADC Total Error
    5. 7.5  General-Purpose Input/Output
      1. 7.5.1 Features
    6. 7.6  Enhanced High-End Timer (N2HET)
      1. 7.6.1 Features
      2. 7.6.2 N2HET RAM Organization
      3. 7.6.3 Input Timing Specifications
      4. 7.6.4 N2HET1-N2HET2 Interconnections
      5. 7.6.5 N2HET Checking
        1. 7.6.5.1 Internal Monitoring
        2. 7.6.5.2 Output Monitoring using Dual Clock Comparator (DCC)
      6. 7.6.6 Disabling N2HET Outputs
      7. 7.6.7 High-End Timer Transfer Unit (HET-TU)
        1. 7.6.7.1 Features
        2. 7.6.7.2 Trigger Connections
    7. 7.7  FlexRay Interface
      1. 7.7.1 Features
      2. 7.7.2 Electrical and Timing Specifications
      3. 7.7.3 FlexRay Transfer Unit
    8. 7.8  Controller Area Network (DCAN)
      1. 7.8.1 Features
      2. 7.8.2 Electrical and Timing Specifications
    9. 7.9  Local Interconnect Network Interface (LIN)
      1. 7.9.1 LIN Features
    10. 7.10 Serial Communication Interface (SCI)
      1. 7.10.1 Features
    11. 7.11 Inter-Integrated Circuit (I2C)
      1. 7.11.1 Features
      2. 7.11.2 I2C I/O Timing Specifications
    12. 7.12 Multibuffered / Standard Serial Peripheral Interface
      1. 7.12.1 Features
      2. 7.12.2 MibSPI Transmit and Receive RAM Organization
      3. 7.12.3 MibSPI Transmit Trigger Events
        1. 7.12.3.1 MIBSPI1 Event Trigger Hookup
        2. 7.12.3.2 MIBSPI2 Event Trigger Hookup
        3. 7.12.3.3 MIBSPI3 Event Trigger Hookup
        4. 7.12.3.4 MIBSPI4 Event Trigger Hookup
        5. 7.12.3.5 MIBSPI5 Event Trigger Hookup
      4. 7.12.4 MibSPI/SPI Master Mode I/O Timing Specifications
      5. 7.12.5 SPI Slave Mode I/O Timings
    13. 7.13 Ethernet Media Access Controller
      1. 7.13.1 Ethernet MII Electrical and Timing Specifications
      2. 7.13.2 Ethernet RMII Timing
      3. 7.13.3 Management Data Input/Output (MDIO)
  8. Applications, Implementation, and Layout
    1. 8.1 TI Design or Reference Design
  9. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
      2. 9.1.2 Device and Development-Support Tool Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation from Texas Instruments
      2. 9.2.2 Receiving Notification of Documentation Updates
      3. 9.2.3 社区资源
    3. 9.3 商标
    4. 9.4 静电放电警告
    5. 9.5 Glossary
    6. 9.6 Device Identification
      1. 9.6.1 Device Identification Code Register
      2. 9.6.2 Die Identification Registers
    7. 9.7 Module Certifications
      1. 9.7.1 FlexRay Certifications
      2. 9.7.2 DCAN Certification
      3. 9.7.3 LIN Certification
        1. 9.7.3.1 LIN Master Mode
        2. 9.7.3.2 LIN Slave Mode - Fixed Baud Rate
        3. 9.7.3.3 LIN Slave Mode - Adaptive Baud Rate
  10. 10Mechanical Data
    1. 10.1 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ZWT|337
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 System Information and Electrical Specifications

6.1 Device Power Domains

The device core logic is split up into multiple virtual power domains to optimize the power for a given application use case.

This device has six logic power domains: PD1, PD2, PD3, PD4, PD5, and PD6. PD1 is a domain which cannot turn off of its clocks at once through the Power-Management Module (PMM). However, individual clock domain operating in PD1 can be individually enabled or disabled through the SYS.CDDIS register. Each of the other power domains can be turned ON, IDLE or OFF as per the application requirement through the PMM module.

In this device, a power domain can operate in one of the three possible power states: ON, IDLE and OFF. ON state is the normal operating state where clocks are actively running in the power domain. When clocks are turned off, the dynamic current is removed from the power domain. In this device, both the IDLE and OFF states have the same power characteristic. When put into either the IDLE or the OFF state, only clocks are turned off from the power domain. Leakage current from the power domain still remains. Note that putting a power domain in the OFF state will not remove any leakage current in this device. In changing the power domain states, the user must poll the system status register to check the completion of the transition. From a programmer model perspective, all three power states are available from the PMM module.

The actual management of the power domains and the hand-shaking mechanism is managed by the PMM. Refer to the Power Management Module (PMM) chapter of the device technical reference manual for more details.

6.2 Voltage Monitor Characteristics

A voltage monitor is implemented on this device. The purpose of this voltage monitor is to eliminate the requirement for a specific sequence when powering up the core and I/O voltage supplies.

6.2.1 Important Considerations

  • The voltage monitor does not eliminate the need of a voltage supervisor circuit to ensure that the device is held in reset when the voltage supplies are out of range.
  • The voltage monitor only monitors the core supply (VCC) and the I/O supply (VCCIO). The other supplies are not monitored by the VMON. For example, if the VCCAD or VCCP are supplied from a source different from that for VCCIO, then there is no internal voltage monitor for the VCCAD and VCCP supplies.

6.2.2 Voltage Monitor Operation

The voltage monitor generates the Power Good MCU signal (PGMCU) as well as the I/Os Power Good IO signal (PGIO) on the device. During power-up or power-down, the PGMCU and PGIO are driven low when the core or I/O supplies are lower than the specified minimum monitoring thresholds. The PGIO and PGMCU being low isolates the core logic as well as the I/O controls during power up or power down of the supplies. This allows the core and I/O supplies to be powered up or down in any order.

When the voltage monitor detects a low voltage on the I/O supply, it will assert a power-on reset. When the voltage monitor detects an out-of-range voltage on the core supply, it asynchronously makes all output pins high impedance, and asserts a power-on reset. The I/O supply must be above the threshold for monitoring the core supply. The voltage monitor is disabled when the device enters a low power mode.

The VMON also incorporates a glitch filter for the nPORRST input. Refer to Section 6.3.3.1 for the timing information on this glitch filter.

Table 6-1 Voltage Monitoring Specifications

PARAMETER MIN TYP MAX UNIT
VMON Voltage monitoring thresholds VCC low - VCC level below this threshold is detected as too low. 0.75 0.9 1.13 V
VCC high - VCC level above this threshold is detected as too high. 1.40 1.7 2.1
VCCIO low - VCCIO level below this threshold is detected as too low. 1.85 2.4 2.99

6.2.3 Supply Filtering

The VMON has the capability to filter glitches on the VCC and VCCIO supplies.

Table 6-2 lists the characteristics of the supply filtering. Glitches in the supply larger than the maximum specification cannot be filtered.

Table 6-2 VMON Supply Glitch Filtering Capability

PARAMETER MIN MAX UNIT
Width of glitch on VCC that can be filtered 250 1000 ns
Width of glitch on VCCIO that can be filtered 250 1000 ns

6.3 Power Sequencing and Power-On Reset

6.3.1 Power-Up Sequence

There is no timing dependency between the ramp of the VCCIO and the VCC supply voltage. The power-up sequence starts with the I/O voltage rising above the minimum I/O supply threshold, (for more details, see Table 6-3), core voltage rising above the minimum core supply threshold and the release of power-on reset. The high-frequency oscillator will start up first and its amplitude will grow to an acceptable level. The oscillator start-up time is dependent on the type of oscillator and is provided by the oscillator vendor. The different supplies to the device can be powered up in any order.

The device goes through the following sequential phases during power up.

Table 6-3 Power-Up Phases

Oscillator start-up and validity check 1024 oscillator cycles
eFuse autoload 3650 oscillator cycles
Flash pump power-up 250 oscillator cycles
Flash bank power-up 1460 oscillator cycles
Total 6384 oscillator cycles

The CPU reset is released at the end of the above sequence and fetches the first instruction from address 0x00000000.

6.3.2 Power-Down Sequence

The different supplies to the device can be powered down in any order.

6.3.3 Power-On Reset: nPORRST

This is the power-on reset. This reset must be asserted by an external circuitry whenever the I/O or core supplies are outside the specified recommended range. This signal has a glitch filter on it. It also has an internal pulldown.

6.3.3.1 nPORRST Electrical and Timing Requirements

Table 6-4 Electrical Requirements for nPORRST

NO. MIN MAX UNIT
VCCPORL VCC low supply level when nPORRST must be active during power up 0.5 V
VCCPORH VCC high supply level when nPORRST must remain active during power up and become active during power down 1.14 V
VCCIOPORL VCCIO / VCCP low supply level when nPORRST must be active during power up 1.1 V
VCCIOPORH VCCIO / VCCP high supply level when nPORRST must remain active during power up and become active during power down 3.0 V
VIL(PORRST) Low-level input voltage of nPORRST VCCIO > 2.5 V 0.2 * VCCIO V
Low-level input voltage of nPORRST VCCIO < 2.5 V 0.5
3 tsu(PORRST) Setup time, nPORRST active before VCCIO and VCCP > VCCIOPORL during power up 0 ms
6 th(PORRST) Hold time, nPORRST active after VCC > VCCPORH 1 ms
7 tsu(PORRST) Setup time, nPORRST active before VCC < VCCPORH during power down 2 µs
8 th(PORRST) Hold time, nPORRST active after VCCIO and VCCP > VCCIOPORH 1 ms
9 th(PORRST) Hold time, nPORRST active after VCC < VCCPORL 0 ms
tf(nPORRST) Filter time nPORRST terminal; pulses less than MIN will be filtered out, pulses greater than MAX will generate a reset. Pulses greater than MIN but less than MAX may or may not generate a reset. 475 2000 ns
TMS570LC4357 td_nPORRST_spns223.gif
A. Figure 6-1 shows that there is no timing dependency between the ramp of the VCCIO and the VCC supply voltages.
Figure 6-1 nPORRST Timing Diagram(A)

6.4 Warm Reset (nRST)

This is a bidirectional reset signal. The internal circuitry drives the signal low on detecting any device reset condition. An external circuit can assert a device reset by forcing the signal low. On this terminal, the output buffer is implemented as an open drain (drives low only). To ensure an external reset is not arbitrarily generated, TI recommends that an external pullup resistor is connected to this terminal.

This terminal has a glitch filter. It also has an internal pullup

6.4.1 Causes of Warm Reset

Table 6-5 Causes of Warm Reset

DEVICE EVENT SYSTEM STATUS FLAG
Power-Up Reset Exception Status Register, bit 15
Oscillator fail Global Status Register, bit 0
PLL slip Global Status Register, bits 8 and 9
Watchdog exception Exception Status Register, bit 13
Debugger reset Exception Status Register, bit 11
CPU Reset (driven by the CPU STC) Exception Status Register, bit 5
Software Reset Exception Status Register, bit 4
External Reset Exception Status Register, bit 3

6.4.2 nRST Timing Requirements

Table 6-6 nRST Timing Requirements(1)

MIN MAX UNIT
tv(RST) Valid time, nRST active after nPORRST inactive 5032tc(OSC) ns
Valid time, nRST active (all other System reset conditions) 32tc(VCLK)
tf(nRST) Filter time nRST terminal; pulses less than MIN will be filtered out, pulses greater than MAX will generate a reset 475 2000 ns
(1) Specified values do not include rise/fall times. For rise and fall timings, see Table 5-5.

6.5 ARM Cortex-R5F CPU Information

6.5.1 Summary of ARM Cortex-R5F CPU Features

The features of the ARM Cortex-R5F CPU include:

  • An integer unit with integral Embedded ICE-RT logic.
  • High-speed Advanced Microprocessor Bus Architecture (AMBA) Advanced eXtensible Interfaces (AXI) for Level two (L2) master and slave interfaces.
  • Floating-Point Coprocessor
  • Dynamic branch prediction with a global history buffer, and a 4-entry return stack
  • Low interrupt latency.
  • Nonmaskable interrupt.
  • Harvard Level one (L1) memory system with:
    • 32KB of instruction cache and 32KB of data cache implemented. Both Instruction and data cache have ECC support.
    • ARMv7-R architecture Memory Protection Unit (MPU) with 16 regions
  • Dual core logic for fault detection in safety-critical applications.
  • L2 memory interface:
    • Single 64-bit master AXI interface
    • 64-bit slave AXI interface to cache memories
    • 32-bit AXI_Peri ports to support low latency peripheral ports
  • Debug interface to a CoreSight Debug Access Port (DAP).
  • Performance Monitoring Unit (PMU).
  • Vectored Interrupt Controller (VIC) port.
  • AXI accelerator coherency port (ACP) supporting IO coherency with write-through cacheable regions
  • Ability to generate ECC on L2 data buses and parity of all control channels
  • Both CPU cores in lock-step
  • Eight hardware breakpoints
  • Eight watchpoints

6.5.2 Dual Core Implementation

The device has two Cortex-R5F cores, where the output signals of both CPUs are compared in the CCM-R5F unit. To avoid common mode impacts the signals of the CPUs to be compared are delayed by two clock cycles as shown in Figure 6-2.

TMS570LC4357 fig_lockstep_ccmr5_block_diagram.gif Figure 6-2 Dual Core Implementation

6.5.3 Duplicate Clock Tree After GCLK

The CPU clock domain is split into two clock trees, one for each CPU, with the clock of the second CPU running at the same frequency and in phase to the clock of CPU1. See Figure 6-2.

6.5.4 ARM Cortex-R5F CPU Compare Module (CCM) for Safety

CCM-R5F has two major functions. One is to compare the outputs of two Cortex-R5F processor cores and the VIM modules. The second function is inactivity monitoring, to detect any faulted transaction initiated by the checker core.

6.5.4.1 Signal Compare Operating Modes

The CCM-R5F module run in one of four operating modes - active compare lockstep, self-test, error forcing, and self-test error forcing mode. To select an operating mode, a dedicated key must be written to the key register. CPU compare block and VIM compare block have separate key registers to select their operating modes. Status registers are also separate for these blocks.

6.5.4.1.1 Active Compare Lockstep Mode

In this mode the output signals of both CPUs and both VIMs are compared, and a difference in the outputs is indicated by the compare_error terminal. For more details about CPU and VIM lockstep comparison, refer to the device technical reference manual.

CCM-R5F also produces a signal to ESM GP1.92 to indicate its current status whether it is out of lockstep or is in self-test mode. This ensures that any lock step fault is reported to the CPU.

6.5.4.1.2 Self-Test Mode

In self-test mode the CCM-R5F is checked for faults, by applying internally generated, series of test patterns to look for any hardware faults inside the module. During self-test the compare error signal is deactivated. If a fault on the CCM-R5F module is detected, an error is shown on the selftest_error pin.

6.5.4.1.3 Error Forcing Mode

In error forcing mode a test pattern is applied to the CPU and VIM related inputs of the compare logic to force an error at the compare error signal of the compare unit. Error forcing mode is done separately for VIM signal compare block and CPU signal compare block. For each block, this mode is enabled by writing the key in corresponding block’s key register.

6.5.4.1.4 Self-Test Error Forcing Mode

In self-test error forcing mode an error is forced at the self-test error signal. The compare block is still running in lockstep mode and the key is switched to lockstep after one clock cycle.

Table 6-7 CPU Compare Self-Test Cycles

MODE NUMBER OF GCLK CYCLES
Self-Test Mode 4947
Self-Test Error Forcing Mode 1
Error Forcing Mode 1

Table 6-8 VIM Compare Self-Test Cycles

MODE NUMBER OF VCLK CYCLES
Self-Test Mode 151
Self-Test Error Forcing Mode 1
Error Forcing Mode 1

6.5.4.2 Bus Inactivity Monitor

CCM-R5F also monitors the inputs to the interconnect coming from the checker Cortex-R5F core. The input signals to the interconnect are compared against their default clamped values. The checker core must not generate any bus transaction to the interconnect system as all bus transactions are carried out through the main CPU core. If any signal value is different from its clamped value, an error signal is generated. The error response in case of a detected transaction is sent to ESM.

In addition to bus monitoring the checker CPU core, the CCM-R5F will also monitor several other critical signals from other masters residing in other power domains. This is to ensure an inadvertent bus transaction from an unused power domain can be detected. To enable detection of unwanted transaction from an unused master, the power domain in which the master to be monitored will need to be configured in OFF power state through the PMM module.

6.5.4.3 CPU Registers Initialization

To avoid an erroneous CCM-R5F compare error, the application software must ensure that the CPU registers of both CPUs are initialized with the same values before the registers are used, including function calls where the register values are pushed onto the stack.

Example routine for CPU register initialization:

TMS570LC4357 cpu_reg_init_code_spns215a.gif

6.5.5 CPU Self-Test

The CPU STC (Self-Test Controller) is used to test the two Cortex-R5F CPU Cores using the Deterministic Logic BIST Controller as the test engine.

The main features of the self-test controller are:

  • Ability to divide the complete test run into independent test intervals
  • Capable of running the complete test as well as running few intervals at a time
  • Ability to continue from the last executed interval (test set) as well as ability to restart from the beginning (First test set)
  • Complete isolation of the self-tested CPU core from rest of the system during the self-test run
  • Ability to capture the Failure interval number
  • Time-out counter for the CPU self-test run as a fail-safe feature

6.5.5.1 Application Sequence for CPU Self-Test

  1. Configure clock domain frequencies.
  2. Select number of test intervals to be run.
  3. Configure the time-out period for the self-test run.
  4. Enable self-test.
  5. Wait for CPU reset.
  6. In the reset handler, read CPU self-test status to identify any failures.
  7. Retrieve CPU state if required.

For more information see the device technical reference manual.

6.5.5.2 CPU Self-Test Clock Configuration

The maximum clock rate for the self-test is 110 MHz. The STCCLK is divided down from the CPU clock. This divider is configured by the STCCLKDIV register at address 0xFFFFE644.

For more information see the device-specific Technical Reference Manual.

6.5.5.3 CPU Self-Test Coverage

The self-test, if enabled, is automatically applied to the entire processor group. Self-test will only start when nCLKSTOPPEDm is asserted which indicates the CPU cores and the ACP interface are in quiescent state. While the processor group is in self-test, other masters can still function normally including accesses to the system memory such as the L2 SRAM. Because uSCU is part of the processor group under self-test, the cache coherency checking will be bypassed.

When the self-test is completed, reset is asserted to all logic subjected to self-test. After self-test is complete, software must invalidate the cache accordingly.

The default value of the CPU LBIST clock prescaler is’ divide-by-1’. A prescalar in the STC module can be used to configure the CPU LBIST frequency with respect to the CPU GCLK frequency.

Table 6-9 lists the CPU test coverage achieved for each self-test interval. It also lists the cumulative test cycles. The test time can be calculated by multiplying the number of test cycles with the STC clock period.


Table 6-9 CPU Self-Test Coverage

INTERVALS TEST COVERAGE, % TEST CYCLES
0 0 0
1 56.85 1629
2 64.19 3258
3 68.76 4887
4 71.99 6516
5 75 8145
6 76.61 9774
7 78.08 11403
8 79.2 13032
9 80.18 14661
10 81.03 16290
11 81.9 17919
12 82.58 19548
13 83.24 21177
14 83.73 22806
15 84.15 24435
16 84.52 26064
17 84.9 27693
18 85.26 29322
19 85.68 30951
20 86.05 32580
21 86.4 34209
22 86.68 35838
23 86.94 37467
24 87.21 39096
25 87.48 40725
26 87.74 42354
27 87.98 43983
28 88.18 45612
29 88.38 47241
30 88.56 48870
31 88.75 50499
32 88.93 52128
33 89.1 53757
34 89.23 55386
35 89.41 57015
36 89.55 58644
37 89.7 60273
38 89.83 61902
39 89.96 63531
40 90.1 65160

6.5.6 N2HET STC / LBIST Self-Test Coverage

Logic BIST self-test capability for N2HETs is available in this device. The STC2 can be configured to perform self-test for both N2HETs at the same time or one at the time. The default value of the N2HET LBIST clock prescaler is divide-by-1. However, the maximum clock rate for the N2HET STC / LBIST is VCLK/2. N2HET STC test should not be executed concurrently with CPU STC test.


Table 6-10 N2HET Self-Test Coverage

INTERVALS TEST COVERAGE, % TEST CYCLES
0 0 0
1 70.01 1365
2 77.89 2730
3 81.73 4095
4 84.11 5460
5 86.05 6825
6 87.78 8190
7 88.96 9555
8 89.95 10920
9 90.63 12285

6.6 Clocks

6.6.1 Clock Sources

Table 6-11 lists the available clock sources on the device. Each clock source can be enabled or disabled using the CSDISx registers in the system module. The clock source number in the table corresponds to the control bit in the CSDISx register for that clock source.

Table 6-11 also lists the default state of each clock source.

Table 6-11 Available Clock Sources

CLOCK
SOURCE NO.
NAME DESCRIPTION DEFAULT STATE
0 OSCIN Main Oscillator Enabled
1 PLL1 Output From PLL1 Disabled
2 Reserved Reserved Disabled
3 EXTCLKIN1 External Clock Input 1 Disabled
4 CLK80K Low-Frequency Output of Internal Reference Oscillator Enabled
5 CLK10M High-Frequency Output of Internal Reference Oscillator Enabled
6 PLL2 Output From PLL2 Disabled
7 EXTCLKIN2 External Clock Input 2 Disabled

6.6.1.1 Main Oscillator

The oscillator is enabled by connecting the appropriate fundamental resonator/crystal and load capacitors across the external OSCIN and OSCOUT pins as shown in Figure 6-3. The oscillator is a single-stage inverter held in bias by an integrated bias resistor. This resistor is disabled during leakage test measurement and low power modes.

NOTE

TI strongly encourages each customer to submit samples of the device to the resonator/crystal vendors for validation. The vendors are equipped to determine which load capacitors will best tune their resonator/crystal to the microcontroller device for optimum start-up and operation over temperature and voltage extremes.

An external oscillator source can be used by connecting a 3.3-V clock signal to the OSCIN terminal and leaving the OSCOUT terminal unconnected (open) as shown in Figure 6-3.

TMS570LC4357 clock_connection_pns160.gif Figure 6-3 Recommended Crystal/Clock Connection

6.6.1.1.1 Timing Requirements for Main Oscillator

Table 6-12 Timing Requirements for Main Oscillator

MIN NOM MAX UNIT
tc(OSC) Cycle time, OSCIN (when using a sine-wave input) 50 200 ns
tc(OSC_SQR) Cycle time, OSCIN, (when input to the OSCIN is a square wave) 50 200 ns
tw(OSCIL) Pulse duration, OSCIN low (when input to the OSCIN is a square wave) 15 ns
tw(OSCIH) Pulse duration, OSCIN high (when input to the OSCIN is a square wave) 15 ns

6.6.1.2 Low-Power Oscillator

The Low-Power Oscillator (LPO) is comprised of two oscillators — HF LPO and LF LPO, in a single macro.

6.6.1.2.1 Features

The main features of the LPO are:

  • Supplies a clock at extremely low power to reduce power consumption. This is connected as clock source 4 of the Global Clock Module (GCM).
  • Supplies a high-frequency clock for nontiming-critical systems. This is connected as clock source 5 of the GCM.
  • Provides a comparison clock for the crystal oscillator failure detection circuit.

TMS570LC4357 LPO_Block_Diagram_spns225.gif Figure 6-4 LPO Block Diagram

Figure 6-4 shows a block diagram of the internal reference oscillator. This is a low-power oscillator (LPO) and provides two clock sources: one nominally 80 kHz and one nominally 10 MHz.

6.6.1.2.2 LPO Electrical and Timing Specifications

Table 6-13 LPO Specifications

PARAMETER MIN TYP MAX UNIT
Clock detection Oscillator fail frequency - lower threshold, using untrimmed LPO output 1.375 2.4 4.875 MHz
Oscillator fail frequency - higher threshold, using untrimmed LPO output 22 38.4 78 MHz
LPO - HF oscillator Untrimmed frequency 5.5 9 19.5 MHz
Trimmed frequency 8.0 9.6 11.0 MHz
Start-up time from STANDBY (LPO BIAS_EN high for at least 900 µs) 10 µs
Cold start-up time 900 µs
LPO - LF oscillator Untrimmed frequency 36 85 180 kHz
Start-up time from STANDBY (LPO BIAS_EN high for at least 900 µs) 100 µs
Cold start-up time 2000 µs

6.6.1.3 Phase-Locked Loop (PLL) Clock Modules

The PLL is used to multiply the input frequency to some higher frequency.

The main features of the PLL are:

  • Frequency modulation can be optionally superimposed on the synthesized frequency of PLL1. The frequency modulation capability of PLL2 is permanently disabled.
  • Configurable frequency multipliers and dividers
  • Built-in PLL Slip monitoring circuit
  • Option to reset the device on a PLL slip detection

6.6.1.3.1 Block Diagram

Figure 6-5 shows a high-level block diagram of the two PLL macros on this microcontroller. PLLCTL1 and PLLCTL2 are used to configure the multiplier and dividers for the PLL1. PLLCTL3 is used to configure the multiplier and dividers for PLL2.

TMS570LC4357 FMzPLLx_block_diagram_pns160.gif Figure 6-5 ZWT PLLx Block Diagram

6.6.1.3.2 PLL Timing Specifications

Table 6-14 PLL Timing Specifications

PARAMETER MIN MAX UNIT
fINTCLK PLL1 Reference Clock frequency 1 20 MHz
fpost_ODCLK Post-ODCLK – PLL1 Post-divider input clock frequency 400 MHz
fVCOCLK VCOCLK – PLL1 Output Divider (OD) input clock frequency 550 MHz
fINTCLK2 PLL2 Reference Clock frequency 1 20 MHz
fpost_ODCLK2 Post-ODCLK – PLL2 Post-divider input clock frequency 400 MHz
fVCOCLK2 VCOCLK – PLL2 Output Divider (OD) input clock frequency 550 MHz

6.6.1.4 External Clock Inputs

The device supports up to two external clock inputs. This clock input must be a square-wave input. Table 6-15 specifies the electrical and timing requirements for these clock inputs.

Table 6-15 External Clock Timing and Electrical Specifications

PARAMETER MIN MAX UNIT
fEXTCLKx External clock input frequency 80 MHz
tw(EXTCLKIN)H EXTCLK high-pulse duration 6 ns
tw(EXTCLKIN)L EXTCLK low-pulse duration 6 ns
viL(EXTCLKIN) Low-level input voltage –0.3 0.8 V
viH(EXTCLKIN) High-level input voltage 2 VCCIO + 0.3 V

6.6.2 Clock Domains

6.6.2.1 Clock Domain Descriptions

Table 6-16 lists the device clock domains and their default clock sources. Table 6-16 also lists the system module control register that is used to select an available clock source for each clock domain.

Table 6-16 Clock Domain Descriptions

CLOCK DOMAIN CLOCK DISABLE BIT DEFAULT
SOURCE
SOURCE SELECTION
REGISTER
SPECIAL CONSIDERATIONS
GCLK1 SYS.CDDIS.0 OSCIN SYS.GHVSRC[3:0]
  • This the main clock from which HCLK is divided down
  • In phase with HCLK
  • Is disabled separately from HCLK through the CDDISx registers bit 0
  • Can be divided-by-1 up to 8 when running CPU self-test (LBIST) using the CLKDIV field of the STCCLKDIV register at address 0xFFFFE108
GCLK2 SYS.CDDIS.0 OSCIN SYS.GHVSRC[3:0]
  • Always the same frequency as GCLK1
  • 2 cycles delayed from GCLK1
  • Is disabled along with GCLK1
  • Gets divided by the same divider setting as that for GCLK1 when running CPU self-test (LBIST)
HCLK SYS.CDDIS.1 OSCIN SYS.GHVSRC[3:0]
  • Divided from GCLK1 through HCLKCNTLregister
  • Allowable clock ratio from 1:1 to 4:1
  • Is disabled through the CDDISx registers bit 1
VCLK SYS.CDDIS.2 OSCIN SYS.GHVSRC[3:0]
  • Divided down from HCLK through CLKCNTL register
  • Can be HCLK/1, HCLK/2,... or HCLK/16
  • Is disabled separately from HCLK through the CDDISx registers bit 2
  • HCLK:VCLK2:VCLK must be integer ratios of each other
VCLK2 SYS.CDDIS.3 OSCIN SYS.GHVSRC[3:0]
  • Divided down from HCLK
  • Can be HCLK/1, HCLK/2,... or HCLK/16
  • Frequency must be an integer multiple of VCLK frequency
  • Is disabled separately from HCLK through the CDDISx registers bit 3
VCLK3 SYS.CDDIS.8 OSCIN SYS.GHVSRC[3:0]
  • Divided down from HCLK
  • Can be HCLK/1, HCLK/2,... or HCLK/16
  • Is disabled separately from HCLK through the CDDISx registers bit 8
VCLKA1 SYS.CDDIS.4 VCLK SYS.VCLKASRC[3:0]
  • Defaults to VCLK as the source
  • Is disabled through the CDDISx registers bit 4
VCLKA2 SYS.CDDIS.5 VCLK SYS.VCLKASRC[3:0]
  • Defaults to VCLK as the source
  • Is disabled through the CDDISx registers bit 5
VCLKA4 SYS.CDDIS.11 VCLK SYS.VCLKACON1[19:16]
  • Defaults to VCLK as the source
  • Is disabled through the CDDISx registers bit 11
VCLKA4_DIVR SYS.VCLKACON1.20 VCLK SYS.VCLKACON1[19:16]
  • Divided down from VCLKA4 using the VCLKA4R field of the VCLKACON1 register
  • Frequency can be VCLKA4/1, VCLKA4/2, ..., or VCLKA4/8
  • Default frequency is VCLKA4/2
  • Is disabled separately through the VCLKA4_DIV_CDDIS bit in the VCLKACON1 register, if the VCLKA4 is not already disabled
RTICLK1 SYS.CDDIS.6 VCLK SYS.RCLKSRC[3:0]
  • Defaults to VCLK as the source
  • If a clock source other than VCLK is selected for RTICLK1, then the RTICLK1 frequency must be less than or equal to VCLK/3
  • Application can ensure this by programming the RTI1DIV field of the RCLKSRC register, if necessary
  • Is disabled through the CDDISx registers bit 6

6.6.2.2 Mapping of Clock Domains to Device Modules

Each clock domain has a dedicated functionality as shown in Figure 6-6.

TMS570LC4357 dev_clock_domains_lockstep_spns195.gif Figure 6-6 Device Clock Domains

6.6.3 Special Clock Source Selection Scheme for VCLKA4_DIVR_EMAC

Some applications may need to use both the FlexRay and the Ethernet interfaces. The FlexRay controller requires the VCLKA2 frequency to be 80 MHz, while the MII interface requires VCLKA4_DIVR_EMAC to be 25 MHz and the RMII requires VCLKA4_DIVR_EAMC to be 50 MHz.

These different frequencies are supported by adding special dedicated clock source selection options for the VCLKA4_DIVR_EMAC clock domain. This logic is shown in Figure 6-7.

TMS570LC4357 VCLKA4_DIVR_EMAC_option_spns192.gif Figure 6-7 VCLKA4_DIVR Source Selection Options

The PLL2 post_ODCLK is brought out as a separate output from the PLL wrapper module. There are two additional dividers implemented at the device-level to divide this PLL2 post_ODCLK by 8 and by 16.

As shown in Figure 6-7, the VCLKA4_SRC configured through the system module VCLKACON1 control register is used to determine the clock source for the VCLKA4 and VCLKA4_DIVR. An additional multiplexor is implemented to select between the VCLKA4_DIVR and the two additional clock sources – PLL2 post_ODCLK/8 and post_ODCLK/16.

Table 6-17 lists the VCLKA4_DIVR_EMAC clock source selections.

Table 6-17 VCLKA4_DIVR_EMAC Clock Source Selection

VCLKA4_SRC FROM VCLKACON1[19–16] CLOCK SOURCE FOR VCLKA4_DIVR_EMAC
0x0 OSCIN / VCLKA4R
0x1 PLL1CLK / VCLKA4R
0x2 Reserved
0x3 EXTCLKIN1 / VCLKA4R
0x4 LF LPO / VCLKA4R
0x5 HF LPO / VCLKA4R
0x6 PLL2CLK / VCLKA4R
0x7 EXTCLKIN2 / VCLKA4R
0x8–0xD VCLK
0xE PLL2 post_ODCLK/8
0xF PLL2 post_ODCLK/16

6.6.4 Clock Test Mode

The TMS570 platform architecture defines a special mode that allows various clock signals to be selected and output on the ECLK1 terminal and N2HET1[12] device outputs. This special mode, Clock Test Mode, is very useful for debugging purposes and can be configured through the CLKTEST register in the system module. See Table 6-18 and Table 6-19 for the CLKTEST bits value and signal selection.

Table 6-18 Clock Test Mode Options for Signals on ECLK1

SEL_ECP_PIN = CLKTEST[4-0] SIGNAL ON ECLK1
00000 Oscillator Clock
00001 PLL1 Clock Output
00010 Reserved
00011 EXTCLKIN1
00100 Low-Frequency Low-Power Oscillator (LFLPO) Clock [CLK80K]
00101 High-Frequency Low-Power Oscillator (HFLPO) Clock [CLK10M]
00110 PLL2 Clock Output
00111 EXTCLKIN2
01000 GCLK1
01001 RTI1 Base
01010 Reserved
01011 VCLKA1
01100 VCLKA2
01101 Reserved
01110 VCLKA4_DIVR
01111 Flash HD Pump Oscillator
10000 Reserved
10001 HCLK
10010 VCLK
10011 VCLK2
10100 VCLK3
10101 Reserved
10110 Reserved
10111 EMAC Clock Output
11000 Reserved
11001 Reserved
11010 Reserved
11011 Reserved
11100 Reserved
11101 Reserved
11110 Reserved
11111 Reserved

Table 6-19 Clock Test Mode Options for Signals on N2HET1[12]

SEL_GIO_PIN = CLKTEST[11-8] SIGNAL ON N2HET1[12]
0000 Oscillator Valid Status
0001 PLL1 Valid Status
0010 Reserved
0011 Reserved
0100 Reserved
0101 HFLPO Clock Output Valid Status [CLK10M]
0110 PLL2 Valid Status
0111 Reserved
1000 LFLPO Clock Output Valid Status [CLK80K]
1001 Oscillator Valid status
1010 Oscillator Valid status
1011 Oscillator Valid status
1100 Oscillator Valid status
1101 Reserved
1110 VCLKA4
1111 Oscillator Valid status

6.7 Clock Monitoring

The LPO Clock Detect (LPOCLKDET) module consists of a clock monitor (CLKDET) and an internal LPO.

The LPO provides two different clock sources – a low frequency (CLK80K) and a high frequency (CLK10M).

The CLKDET is a supervisor circuit for an externally supplied clock signal (OSCIN). In case the OSCIN frequency falls out of a frequency window, the CLKDET flags this condition in the global status register (GLBSTAT bit 0: OSC FAIL) and switches all clock domains sourced by OSCIN to the CLK10M clock (limp mode clock).

The valid OSCIN frequency range is defined as: fCLK10M / 4 < fOSCIN < fCLK10M * 4.

6.7.1 Clock Monitor Timings

TMS570LC4357 LPO_Clk_Detection_pns160.gif Figure 6-8 LPO and Clock Detection, Untrimmed CLK10M

6.7.2 External Clock (ECLK) Output Functionality

The ECLK1/ECLK2 terminal can be configured to output a prescaled clock signal indicative of an internal device clock. This output can be externally monitored as a safety diagnostic.

6.7.3 Dual Clock Comparators

The Dual Clock Comparator (DCC) module determines the accuracy of selectable clock sources by counting the pulses of two independent clock sources (counter 0 and counter 1). If one clock is out of spec, an error signal is generated. For example, the DCC1 can be configured to use CLK10M as the reference clock (for counter 0) and VCLK as the "clock under test" (for counter 1). This configuration allows the DCC1 to monitor the PLL output clock when VCLK is using the PLL output as its source.

An additional use of this module is to measure the frequency of a selectable clock source. For example, the reference clock is connected to Counter 0 and the signal to be measured is connected to Counter 1. Counter 0 is programmed with a start value of known time duration (measurement time) from the reference clock. Counter 1 is programmed with a maximum start value. Start both counter simultaneously. When Counter 0 decrements to zero, both counter will stop and an error signal is generated if Counter 1 does not reach zero. The frequency of the input signals can be calculated from the count value of Counter 1 and the measurement time.

6.7.3.1 Features

  • Takes two different clock sources as input to two independent counter blocks.
  • One of the clock sources is the known-good, or reference clock; the second clock source is the "clock under test."
  • Each counter block is programmable with initial, or seed values.
  • The counter blocks start counting down from their seed values at the same time; a mismatch from the expected frequency for the clock under test generates an error signal which is used to interrupt the CPU.

6.7.3.2 Mapping of DCC Clock Source Inputs


Table 6-20 DCC1 Counter 0 Clock Sources

CLOCK SOURCE[3:0] CLOCK NAME
Others Oscillator (OSCIN)
0x5 High-frequency LPO
0xA Test clock (TCK)

Table 6-21 DCC1 Counter 1 Clock Sources

KEY[3:0] CLOCK SOURCE[3:0] CLOCK NAME
Others N2HET1[31]
0x0 Main PLL free-running clock output
0x1 PLL #2 free-running clock output
0x2 Low-frequency LPO
0xA 0x3 High-frequency LPO
0x4 Reserved
0x5 EXTCLKIN1
0x6 EXTCLKIN2
0x7 Reserved
0x8 - 0xF VCLK

Table 6-22 DCC2 Counter 0 Clock Sources

CLOCK SOURCE[3:0] CLOCK NAME
Others Oscillator (OSCIN)
0xA Test clock (TCK)

Table 6-23 DCC2 Counter 1 Clock Sources

KEY[3:0] CLOCK SOURCE[3:0] CLOCK NAME
Others N2HET2[0]
0xA 0x1 PLL2_post_ODCLK/8
0x2 PLL2_post_ODCLK/16
0x3 - 0x7 Reserved
0x8 - 0xF VCLK

6.8 Glitch Filters

Table 6-24 lists the signals with glitch filters present .

Table 6-24 Glitch Filter Timing Specifications

TERMINAL PARAMETER MIN MAX UNIT
nPORRST tf(nPORRST) Filter time nPORRST terminal; pulses less than MIN will be filtered out, pulses greater than MAX will generate a reset(1) 475 2000 ns
nRST tf(nRST) Filter time nRST terminal; pulses less than MIN will be filtered out, pulses greater than MAX will generate a reset 475 2000 ns
TEST tf(TEST) Filter time TEST terminal; pulses less than MIN will be filtered out, pulses greater than MAX will pass through 475 2000 ns
(1) The glitch filter design on the nPORRST signal is designed such that no size pulse will reset any part of the microcontroller (flash pump, I/O pins, forth) without also generating a valid reset signal to the CPU.

6.9 Device Memory Map

6.9.1 Memory Map Diagram

Figure 6-9 shows the device memory map.

TMS570LC4357 memory_map_LC_spns195.gif
Figure 6-9 Memory Map

6.9.2 Memory Map Table

Table 6-25 Module Registers / Memories Memory Map

TARGET NAME MEMORY
SELECT
ADDRESS RANGE FRAME
SIZE
ACTUAL
SIZE
RESPONSE FOR
ACCESS TO
UNIMPLEMENTED
LOCATIONS IN
FRAME
START END
Level 2 Memories
Level 2 Flash Data Space 0x0000_0000 0x003F_FFFF 4MB 4MB Abort
Level 2 RAM 0x0800_0000 0x083F_FFFF 4MB 512KB Abort
Level 2 RAM ECC 0x0840_0000 0x087F_FFFF 4MB 512KB
Accelerator Coherency Port
Accelerator Coherency Port 0x0800_0000 0x087F_FFFF 8MB 512KB Abort
Level 1 Cache Memories
Cortex-R5F Data Cache Memory 0x3000_0000 0x30FF_FFFF 16MB 32KB  Abort
Cortex-R5F Instruction Cache Memory 0x3100_0000 0x31FF_FFFF 16MB 32KB
External Memory Accesses
EMIF Chip Select 2 (asynchronous) 0x6000_0000 0x63FF_FFFF 64MB 16MB Access to "Reserved" space will generate Abort
EMIF Chip Select 3 (asynchronous) 0x6400_0000 0x67FF_FFFF 64MB 16MB
EMIF Chip Select 4 (asynchronous) 0x6800_0000 0x6BFF_FFFF 64MB 16MB
EMIF Chip Select 0 (synchronous) 0x8000_0000 0x87FF_FFFF 128MB 128MB
Flash OTP, ECC, EEPROM Bank
Customer OTP, Bank0 0xF000_0000 0xF000_1FFF 8KB 4KB Abort
Customer OTP, Bank1 0xF000_2000 0xF000_3FFF 8KB 4KB
Customer OTP, EEPROM Bank 0xF000_E000 0xF000_FFFF 8KB 1KB
Customer OTP-ECC, Bank0 0xF004_0000 0xF004_03FF 1KB 512B
Customer OTP-ECC, Bank1 0xF004_0400 0xF004_07FF 1KB 512B
Customer OTP-ECC, EEPROM Bank 0xF004_1C00 0xF004_1FFF 1KB 128B
TI OTP, Bank0 0xF008_0000 0xF008_1FFF 8KB 4KB
TI OTP, Bank1 0xF008_2000 0xF008_3FFF 8KB 4KB
TI OTP, EEPROM Bank 0xF008_E000 0xF008_FFFF 8KB 1KB
TI OTP-ECC, Bank0 0xF00C_0000 0xF00C_03FF 1KB 512B
TI OTP-ECC, Bank1 0xF00C_0400 0xF00C_07FF 1KB 512B Abort
TI OTP-ECC, EEPROM Bank 0xF00C_1C00 0xF00C_1FFF 1KB 128B
EEPROM Bank-ECC 0xF010_0000 0xF01F_FFFF 1MB 16KB
EEPROM Bank 0xF020_0000 0xF03F_FFFF 2MB 128KB
Flash Data Space ECC 0xF040_0000 0xF05F_FFFF 2MB 512KB
Interconnect SDC MMR
Interconnect SDC MMR 0xFA00_0000 0xFAFF_FFFF 16MB 16MB
Registers/Memories under PCR2 (Peripheral Segment 2)
CPPI Memory Slave (Ethernet RAM) PCS[41] 0xFC52_0000 0xFC52_1FFF 8KB 8KB Abort
CPGMAC Slave (Ethernet Slave) PS[30]-PS[31] 0xFCF7_8000 0xFCF7_87FF 2KB 2KB No Error
CPGMACSS Wrapper (Ethernet Wrapper) PS[29] 0xFCF7_8800 0xFCF7_88FF 256B 256B No Error
Ethernet MDIO Interface PS[29] 0xFCF7_8900 0xFCF7_89FF 256B 256B No Error
ePWM1 PS[28] 0xFCF7_8C00 0xFCF7_8CFF 256B 256B Abort
ePWM2 0xFCF7_8D00 0xFCF7_8DFF 256B 256B Abort
ePWM3 0xFCF7_8E00 0xFCF7_8EFF 256B 256B Abort
ePWM4 0xFCF7_8F00 0xFCF7_8FFF 256B 256B Abort
ePWM5 PS[27] 0xFCF7_9000 0xFCF7_90FF 256B 256B Abort
ePWM6 0xFCF7_9100 0xFCF7_91FF 256B 256B Abort
ePWM7 0xFCF7_9200 0xFCF7_92FF 256B 256B Abort
eCAP1 0xFCF7_9300 0xFCF7_93FF 256B 256B Abort
eCAP2 PS[26] 0xFCF7_9400 0xFCF7_94FF 256B 256B Abort
eCAP3 0xFCF7_9500 0xFCF7_95FF 256B 256B Abort
eCAP4 0xFCF7_9600 0xFCF7_96FF 256B 256B Abort
eCAP5 0xFCF7_9700 0xFCF7_97FF 256B 256B Abort
eCAP6 PS[25] 0xFCF7_9800 0xFCF7_98FF 256B 256B Abort
eQEP1 0xFCF7_9900 0xFCF7_99FF 256B 256B Abort
eQEP2 0xFCF7_9A00 0xFCF7_9AFF 256B 256B Abort
PCR2 registers PPSE[4]–PPSE[5] 0xFCFF_1000 0xFCFF_17FF 2KB 2KB Reads return zeros, writes have no effect
NMPU (EMAC) PPSE[6] 0xFCFF_1800 0xFCFF_18FF 512B 512B Abort
EMIF Registers PPS[2] 0xFCFF_E800 0xFCFF_E8FF 256B 256B Abort
Cyclic Redundancy Checker (CRC) Module Register Frame
CRC1 0xFE00_0000 0xFEFF_FFFF 16MB 512KB Accesses above 0xFE000200 generate abort.
CRC2 0xFB00_0000 0xFBFF_FFFF 16MB 512KB Accesses above 0xFB000200 generate abort.
Memories under User PCR3 (Peripheral Segment 3)
MIBSPI5 RAM PCS[5] 0xFF0A_0000 0xFF0B_FFFF 128KB 2KB Abort for accesses above 2KB
MIBSPI4 RAM PCS[3] 0xFF06_0000 0xFF07_FFFF 128KB 2KB Abort for accesses above 2KB
MIBSPI3 RAM PCS[6] 0xFF0C_0000 0xFF0D_FFFF 128KB 2KB Abort for accesses above 2KB
MIBSPI2 RAM PCS[4] 0xFF08_0000 0xFF09_FFFF 128KB 2KB Abort for accesses above 2KB
MIBSPI1 RAM PCS[7] 0xFF0E_0000 0xFF0F_FFFF 128KB 4KB Abort for accesses above 4KB
DCAN4 RAM PCS[12] 0xFF18_0000 0xFF19_FFFF 128KB 8KB Abort generated for accesses beyond offset 0x2000
DCAN3 RAM PCS[13] 0xFF1A_0000 0xFF1B_FFFF 128KB 8KB Abort generated for accesses beyond offset 0x2000
DCAN2 RAM PCS[14] 0xFF1C_0000 0xFF1D_FFFF 128KB 8KB Abort generated for accesses beyond offset 0x2000
DCAN1 RAM PCS[15] 0xFF1E_0000 0xFF1F_FFFF 128KB 8KB Abort generated for accesses beyond offset 0x2000.
MIBADC2 RAM PCS[29] 0xFF3A_0000 0xFF3B_FFFF 128KB 8KB Wrap around for accesses to unimplemented address offsets lower than 0x1FFF.
MIBADC1 RAM PCS[31] 0xFF3E_0000 0xFF3F_FFFF 128KB 8KB Wrap around for accesses to unimplemented address offsets lower than 0x1FFF.
MIBADC1 Look-UP Table 384 bytes Look-Up Table for ADC1 wrapper. Starts at address offset 0x2000 and ends at address offset 0x217F. Wrap around for accesses between offsets 0x0180 and 0x3FFF. Abort generation for accesses beyond offset 0x4000.
NHET2 RAM PCS[34] 0xFF44_0000 0xFF45_FFFF 128KB 16KB Wrap around for accesses to unimplemented address offsets lower than 0x3FFF. Abort generated for accesses beyond 0x3FFF.
NHET1 RAM PCS[35] 0xFF46_0000 0xFF47_FFFF 128KB 16KB Wrap around for accesses to unimplemented address offsets lower than 0x3FFF. Abort generated for accesses beyond 0x3FFF.
HET TU2 RAM PCS[38] 0xFF4C_0000 0xFF4D_FFFF 128KB 1KB Abort
HET TU1 RAM PCS[39] 0xFF4E_0000 0xFF4F_FFFF 128KB 1KB Abort
FlexRay TU RAM PCS[40] 0xFF50_0000 0xFF51_FFFF 128KB 1KB Abort
CoreSight Debug Components
CoreSight Debug ROM CSCS[0] 0xFFA0_0000 0xFFA0_0FFF 4KB 4KB Reads return zeros, writes have no effect
Cortex-R5F Debug CSCS[1] 0xFFA0_1000 0xFFA0_1FFF 4KB 4KB Reads return zeros, writes have no effect
ETM-R5 CSCS[2] 0xFFA0_2000 0xFFA0_2FFF 4KB 4KB Reads return zeros, writes have no effect
CoreSight TPIU CSCS[3] 0xFFA0_3000 0xFFA0_3FFF 4KB 4KB Reads return zeros, writes have no effect
POM CSCS[4] 0xFFA0_4000 0xFFA0_4FFF 4KB 4KB Reads return zeros, writes have no effect
CTI1 CSCS[7] 0xFFA0_7000 0xFFA0_7FFF 4KB 4KB Reads return zeros, writes have no effect
CTI3 CSCS[9] 0xFFA0_9000 0xFFA0_9FFF 4KB 4KB Reads return zeros, writes have no effect
CTI4 CSCS[10] 0xFFA0_A000 0xFFA0_AFFF 4KB 4KB Reads return zeros, writes have no effect
CSTF CSCS[11] 0xFFA0_B000 0xFFA0_BFFF 4KB 4KB Reads return zeros, writes have no effect
Registers under PCR3 (Peripheral Segment 3)
PCR3 registers PS[31:30] 0xFFF7_8000 0xFFF7_87FF 2KB 2KB Reads return zeros, writes have no effect
FTU PS[23] 0xFFF7_A000 0xFFF7_A1FF 512B 512B Reads return zeros, writes have no effect
HTU1 PS[22] 0xFFF7_A400 0xFFF7_A4FF 256B 256B Abort
HTU2 PS[22] 0xFFF7_A500 0xFFF7_A5FF 256B 256B Abort
NHET1 PS[17] 0xFFF7_B800 0xFFF7_B8FF 256B 256B Reads return zeros, writes have no effect
NHET2 PS[17] 0xFFF7_B900 0xFFF7_B9FF 256B 256B Reads return zeros, writes have no effect
GIO PS[16] 0xFFF7_BC00 0xFFF7_BCFF 256B 256B Reads return zeros, writes have no effect
MIBADC1 PS[15] 0xFFF7_C000 0xFFF7_C1FF 512B 512B Reads return zeros, writes have no effect
MIBADC2 PS[15] 0xFFF7_C200 0xFFF7_C3FF 512B 512B Reads return zeros, writes have no effect
FlexRay PS[12]+PS[13] 0xFFF7_C800 0xFFF7_CFFF 2KB 2KB Reads return zeros, writes have no effect
I2C1 PS[10] 0xFFF7_D400 0xFFF7_D4FF 256B 256B Reads return zeros, writes have no effect
I2C2 PS[10] 0xFFF7_D500 0xFFF7_D5FF 256B 256B Reads return zeros, writes have no effect
DCAN1 PS[8] 0xFFF7_DC00 0xFFF7_DDFF 512B 512B Reads return zeros, writes have no effect
DCAN2 PS[8] 0xFFF7_DE00 0xFFF7_DFFF 512B 512B Reads return zeros, writes have no effect
DCAN3 PS[7] 0xFFF7_E000 0xFFF7_E1FF 512B 512B Reads return zeros, writes have no effect
DCAN4 PS[7] 0xFFF7_E200 0xFFF7_E3FF 512B 512B Reads return zeros, writes have no effect
LIN1 PS[6] 0xFFF7_E400 0xFFF7_E4FF 256B 256B Reads return zeros, writes have no effect
SCI3 PS[6] 0xFFF7_E500 0xFFF7_E5FF 256B 256B Reads return zeros, writes have no effect
LIN2 PS[6] 0xFFF7_E600 0xFFF7_E6FF 256B 256B Reads return zeros, writes have no effect
SCI4 PS[6] 0xFFF7_E700 0xFFF7_E7FF 256B 256B Reads return zeros, writes have no effect
MibSPI1 PS[2] 0xFFF7_F400 0xFFF7_F5FF 512B 512B Reads return zeros, writes have no effect
MibSPI2 PS[2] 0xFFF7_F600 0xFFF7_F7FF 512B 512B Reads return zeros, writes have no effect
MibSPI3 PS[1] 0xFFF7_F800 0xFFF7_F9FF 512B 512B Reads return zeros, writes have no effect
MibSPI4 PS[1] 0xFFF7_FA00 0xFFF7_FBFF 512B 512B Reads return zeros, writes have no effect
MibSPI5 PS[0] 0xFFF7_FC00 0xFFF7_FDFF 512B 512B Reads return zeros, writes have no effect
System Modules Control Registers and Memories under PCR1 (Peripheral Segment 1)
DMA RAM PPCS[0] 0xFFF8_0000 0xFFF8_0FFF 4KB 4KB Abort
VIM RAM PPCS[2] 0xFFF8_2000 0xFFF8_2FFF 4KB 4KB Wrap around for accesses to unimplemented address offsets lower than 0x2FFF.
RTP RAM PPCS[3] 0xFFF8_3000 0xFFF8_3FFF 4KB 4KB Abort
Flash Wrapper PPCS[7] 0xFFF8_7000 0xFFF8_7FFF 4KB 4KB Abort
eFuse Farm Controller PPCS[12] 0xFFF8_C000 0xFFF8_CFFF 4KB 4KB Abort
Power Domain Control (PMM) PPSE[0] 0xFFFF_0000 0xFFFF_01FF 512B 512B Abort
FMTM
Note: This module is only used by TI during test
PPSE[1] 0xFFFF_0400 0xFFFF_05FF 512B 512B Reads return zeros, writes have no effect
STC2 (NHET1/2) PPSE[2] 0xFFFF_0800 0xFFFF_08FF 256B 256B Reads return zeros, writes have no effect
SCM PPSE[2] 0xFFFF_0A00 0xFFFF_0AFF 256B 256B Abort
EPC PPSE[3] 0xFFFF_0C00 0xFFFF_0FFF 1KB 1KB Abort
PCR1 registers PPSE[4]–PPSE[5] 0xFFFF_1000 0xFFFF_17FF 2KB 2KB Reads return zeros, writes have no effect
NMPU (PS_SCR_S) PPSE[6] 0xFFFF_1800 0xFFFF_19FF 512B 512B Abort
NMPU (DMA Port A) PPSE[6] 0xFFFF_1A00 0xFFFF_1BFF 512B 512B Abort
Pin Mux Control (IOMM) PPSE[7] 0xFFFF_1C00 0xFFFF_1FFF 2KB 1KB Reads return zeros, writes have no effect
System Module - Frame 2 (see the TRM SPNU563) PPS[0] 0xFFFF_E100 0xFFFF_E1FF 256B 256B Reads return zeros, writes have no effect
PBIST PPS[1] 0xFFFF_E400 0xFFFF_E5FF 512B 512B Reads return zeros, writes have no effect
STC1 (Cortex-R5F) PPS[1] 0xFFFF_E600 0xFFFF_E6FF 256B 256B Reads return zeros, writes have no effect
DCC1 PPS[3] 0xFFFF_EC00 0xFFFF_ECFF 256B 256B Reads return zeros, writes have no effect
DMA PPS[4] 0xFFFF_F000 0xFFFF_F3FF 1KB 1KB Abort
DCC2 PPS[5] 0xFFFF_F400 0xFFFF_F4FF 256B 256B Reads return zeros, writes have no effect
ESM register PPS[5] 0xFFFF_F500 0xFFFF_F5FF 256B 256B Reads return zeros, writes have no effect
CCM-R5F PPS[5] 0xFFFF_F600 0xFFFF_F6FF 256B 256B Reads return zeros, writes have no effect
DMM PPS[5] 0xFFFF_F700 0xFFFF_F7FF 256B 256B Reads return zeros, writes have no effect
L2RAMW PPS[6] 0xFFFF_F900 0xFFFF_F9FF 256B 256B Abort
RTP PPS[6] 0xFFFF_FA00 0xFFFF_FAFF 256B 256B Reads return zeros, writes have no effect
RTI + DWWD PPS[7] 0xFFFF_FC00 0xFFFF_FCFF 256B 256B Reads return zeros, writes have no effect
VIM PPS[7] 0xFFFF_FD00 0xFFFF_FEFF 512B 512B Reads return zeros, writes have no effect
System Module - Frame 1 (see the TRM SPNU563) PPS[7] 0xFFFF_FF00 0xFFFF_FFFF 256B 256B Reads return zeros, writes have no effect

6.9.3 Special Consideration for CPU Access Errors Resulting in Imprecise Aborts

Any CPU write access to a Normal or Device type memory, which generates a fault, will generate an imprecise abort. The imprecise abort exception is disabled by default and must be enabled for the CPU to handle this exception. The imprecise abort handling is enabled by clearing the "A" bit in the CPU program status register (CPSR).

6.9.4 Master/Slave Access Privileges

Table 6-26 and Table 6-27 list the access permissions for each bus master on the device. A bus master is a module that can initiate a read or a write transaction on the device.

Each slave module on either the CPU Interconnect Subsystem or the Peripheral Interconnect Subsystem is listed in Table 6-27. Allowed indicates that the module listed in the MASTERS column can access that slave module.

Table 6-26 Bus Master / Slave Access Matrix for CPU Interconnect Subsystem

MASTERS SLAVES ON CPU INTERCONNECT SUBSYSTEM
L2 Flash OTP, ECC, Bank 7 (EEPROM) L2 FLASH L2 SRAM CACHE MEMORY EMIF
CPU Read Allowed Allowed Allowed Allowed Allowed
CPU Write Not allowed Not allowed Allowed Allowed Allowed
DMA PortA Allowed Allowed Allowed Not allowed Allowed
POM Not allowed Not allowed Allowed Not allowed Allowed
PS_SCR_M Allowed Allowed Allowed Not allowed Allowed
ACP_M Not allowed Not Allowed Allowed Not allowed Not allowed

Table 6-27 Bus Master / Slave Access Matrix for Peripheral Interconnect Subsystem

MASTER ID TO PCRx MASTERS SLAVES ON PERIPHERAL INTERCONNECT SUBSYSTEM
CRC1/CRC2 Resources Under
PCR2 and PCR3
Resources Under PCR1 CPU Interconnect Subsystem SDC MMR Port (see Section 6.9.6)
0 CPU Read Allowed Allowed Allowed Allowed
CPU Write Allowed Allowed Allowed Allowed
1 Reserved
2 DMA PortB Allowed Allowed Allowed Not allowed
3 HTU1 Not allowed Not allowed Not allowed Not allowed
4 HTU2 Not allowed Not allowed Not allowed Not allowed
5 FTU Not allowed Not allowed Not allowed Not allowed
7 DMM Allowed Allowed Allowed Allowed
9 DAP Allowed Allowed Allowed Allowed
10 EMAC Not allowed Allowed Not allowed Not allowed

6.9.4.1 Special Notes on Accesses to Certain Slaves

By design only the CPU and debugger can have privileged write access to peripherals under the PCR1 segment. The other masters can only read from these registers.

The master-id filtering check is implemented inside each PCR module of each peripheral segment and can be used to block certain masters from write accesses to certain peripherals. An unauthorized master write access detected by the PCR will result in the transaction being discarded and an error being generated to the ESM module.

The device contains dedicated logic to generate a bus error response on any access to a module that is in a power domain that has been turned off.

6.9.5 MasterID to PCRx

The MasterID associated with each master port on the Peripheral Interconnect Subsystem contains a 4-bit value. The MasterID is passed along with the address and control signals to three PCR modules. PCR decodes the address and control signals to select the peripheral. In addition, it decodes this 4-bit MasterID value to perform memory protection. With 4-bit of MasterID, it allows the PCR to distinguish among 16 different masters to allow or disallow access to a given peripheral. Associated with each peripheral a 16-bit MasterID access protection register is defined. Each bit grants or denies the permission of the corresponding binary coded decimal MasterID. For example, if bit 5 of the access permission register is set, it grants MasterID 5 to access the peripheral. If bit 7 is clear, it denies MasterID 7 to access the peripheral. Figure 6-10 shows the MasterID filtering scheme. Table 6-27 lists the MasterID of each master, which can access the PCRx.

TMS570LC4357 fig_pcr_masterid_filtering.gif Figure 6-10 PCR MasterID Filtering

6.9.6 CPU Interconnect Subsystem SDC MMR Port

The CPU Interconnect Subsystem SDC MMR Port is a special slave to the Peripheral Interconnect Subsystem. It is memory mapped at starting address of 0xFA00_0000. Various status registers pertaining to the diagnostics of the CPU Interconnect Subsystem can be access through this slave port. The CPU Interconnect Subsystem contains built-in hardware diagnostic checkers which will constantly watch transactions flowing through the interconnect. There is a checker for each master and slave attached to the CPU Interconnect Subsystem. The checker checks the expected behavior against the generated behavior by the interconnect. For example, if the CPU issues a burst read request to the flash, the checker will ensure that the expected behavior is indeed a burst read request to the proper slave module. If the interconnects generates a transaction which is not a read, or not a burst or not to the flash as the destination, then the checker will flag it one of the registers. The detected error will also be signaled to the ESM module. Refer to the Interconnect chapter of the TRM SPNU563 for details on the registers.

Table 6-28 CPU Interconnect Subsystem SDC Register Bit Field Mapping

Register name bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 Remark
ERR_GENERIC_PARITY PS_SCR_M POM DMA_PORTA Reserved CPU AXI-M ACP-M Reserved
  • Each bit indicates the transaction processing block inside the interconnect corresponding to the master that is detected by the interconnect checker to have a fault.
  • error related to parity mismatch in the incoming address
ERR_UNEXPECTED_TRANS PS_SCR_M POM DMA_PORTA Reserved CPU AXI-M ACP-M Reserved
  • error related to unexpected transaction sent by the master
ERR_TRANS_ID PS_SCR_M POM DMA_PORTA Reserved CPU AXI-M ACP-M Reserved
  • error related to mismatch on the transaction ID
ERR_TRANS_SIGNATURE PS_SCR_M POM DMA_PORTA Reserved CPU AXI-M ACP-M Reserved
  • error related to mismatch on the transaction signature
ERR_TRANS_TYPE PS_SCR_M POM DMA_PORTA Reserved CPU AXI-M ACP-M Reserved
  • error related to mismatch on the transaction type
ERR_USER_PARITY PS_SCR_M POM DMA_PORTA Reserved CPU AXI-M ACP-M Reserved
  • error related to mismatch on the parity
SERR_UNEXPECTED_MID L2 RAM Wrapper L2 Flash Wrapper Port A L2 Flash Wrapper Port B EMIF Reserved CPU AXi-S ACP-S
  • Each bit indicates the transaction processing block inside the interconnect corresponding to the slave that is detected by the interconnect checker to have a fault.
  • error related to mismatch on the master ID
SERR_ADDR_DECODE L2 RAM Wrapper L2 Flash Wrapper Port A L2 Flash Wrapper Port B EMIF Reserved CPU AXi-S ACP-S
  • error related to mismatch on the most significant address bits
SERR_USER_PARITY L2 RAM Wrapper L2 Flash Wrapper Port A L2 Flash Wrapper Port B EMIF Reserved CPU AXi-S ACP-S
  • error related to mismatch on the parity of the most significant address bits

6.9.7 Parameter Overlay Module (POM) Considerations

The Parameter Overlay Module (POM) is implemented as part of the L2FMC module. It is used to redirect flash memory accesses to external memory interfaces or internal SRAM. The POM has an OCP master port to redirect accesses. The POM MMRs are located in a separate block and read/writes will happen through the Debug APB port on the L2FMC. The POM master port is capable of read accesses only. Inside the CPU Subsystem SCR, the POM master port is connected to both the L2RAMW and EMIF slaves. The primary roles of the POM are:

  • The POM snoops the access on the two flash slave ports to determine if access should be remapped or not. It supports 32 regions among the two slave ports.
  • If access is to be remapped, then the POM kills the access to the flash bank, and instead redirects the access through its own master.
  • Upon obtaining response, the POM populates the response FIFO of the respective port so that the response is delivered back to the original requester.
  • The access is unaffected if the request is not mapped to any region, or if the POM is disabled.
  • The POM does not add any latency to the flash access when it is turned off.
  • The POM does not add any latency to the remapped access (except the latency, if any, associated with the getting the response from the an alternate slave)

6.10 Flash Memory

6.10.1 Flash Memory Configuration

Flash Bank: A separate block of logic consisting of 1 to 16 sectors. Each flash bank normally has a customer-OTP and a TI-OTP area. These flash sectors share input/output buffers, data paths, sense amplifiers, and control logic.

Flash Sector: A contiguous region of flash memory which must be erased simultaneously due to physical construction constraints.

Flash Pump: A charge pump which generates all the voltages required for reading, programming, or erasing the flash banks.

Flash Module: Interface circuitry required between the host CPU and the flash banks and pump module.

Table 6-29 Flash Memory Banks and Sectors

MEMORY ARRAYS (OR BANKS) SECTOR NO. SEGMENT LOW ADDRESS HIGH ADDRESS
BANK0 (2.0MB) 0 16KB 0x0000_0000 0x0000_3FFF
1 16KB 0x0000_4000 0x0000_7FFF
2 16KB 0x0000_8000 0x0000_BFFF
3 16KB 0x0000_C000 0x0000_FFFF
4 16KB 0x0001_0000 0x0001_3FFF
5 16KB 0x0001_4000 0x0001_7FFF
6 32KB 0x0001_8000 0x0001_FFFF
7 128KB 0x0002_0000 0x0003_FFFF
8 128KB 0x0004_0000 0x0005_FFFF
9 128KB 0x0006_0000 0x0007_FFFF
10 256KB 0x0008_0000 0x000B_FFFF
11 256KB 0x000C_0000 0x000F_FFFF
12 256KB 0x0010_0000 0x0013_FFFF
13 256KB 0x0014_0000 0x0017_FFFF
14 256KB 0x0018_0000 0x001B_FFFF
15 256KB 0x001C_0000 0x001F_FFFF
BANK1 (2.0MB) 0 128KB 0x0020_0000 0x0021_FFFF
1 128KB 0x0022_0000 0x0023_FFFF
2 128KB 0x0024_0000 0x0025_FFFF
3 128KB 0x0026_0000 0x0027_FFFF
4 128KB 0x0028_0000 0x0029_FFFF
5 128KB 0x002A_0000 0x002B_FFFF
6 128KB 0x002C_0000 0x002D_FFFF
7 128KB 0x002E_0000 0x002F_FFFF
8 128KB 0x0030_0000 0x0031_FFFF
9 128KB 0x0032_0000 0x0033_FFFF
10 128KB 0x0034_0000 0x0035_FFFF
11 128KB 0x0036_0000 0x0037_FFFF
12 128KB 0x0038_0000 0x0039_FFFF
13 128KB 0x003A_0000 0x003B_FFFF
14 128KB 0x003C_0000 0x003D_FFFF
15 128KB 0x003E_0000 0x003F_FFFF

Table 6-30 EEPROM Flash Bank

MEMORY ARRAYS (OR BANKS) SECTOR NO. SEGMENT LOW ADDRESS HIGH ADDRESS
BANK7 (128KB) for EEPROM emulation 0 4KB 0xF020_0000 0xF020_0FFF
"
"
"
"
"
"
"
"
"
"
"
"
31 4KB 0xF021_F000 0xF021_FFFF

6.10.2 Main Features of Flash Module

  • Support for multiple flash banks for program and/or data storage
  • Simultaneous read accesses on two banks while performing program or erase operation on any other bank
  • Integrated state machines to automate flash erase and program operations
  • Software interface for flash program and erase operations
  • Pipelined mode operation to improve instruction access interface bandwidth
  • Support for Single Error Correction Double Error Detection (SECDED) block inside Cortex-R5F CPU
  • Support for a rich set of diagnostic features

6.10.3 ECC Protection for Flash Accesses

All accesses to the L2 program flash memory are protected by SECDED logic embedded inside the CPU. The flash module provides 8 bits of ECC code for 64 bits of instructions or data fetched from the flash memory. The CPU calculates the expected ECC code based on the 64 bits data received and compares it with the ECC code returned by the flash module. A single-bit error is corrected and flagged by the CPU, while a multibit error is only flagged. The CPU signals an ECC error through its Event bus. This signaling mechanism is not enabled by default and must be enabled by setting the 'X' bit of the Performance Monitor Control Register, c9.

TMS570LC4357 ECC_Pro_Flash_Access_code_spns215a.gif

NOTE

ECC is permanently enabled in the CPU L2 interface.

6.10.4 Flash Access Speeds

For information on flash memory access speeds and the relevant wait states required, refer to Section 5.6.

6.10.5 Flash Program and Erase Timings

6.10.5.1 Flash Program and Erase Timings for Program Flash

Table 6-31 Timing Requirements for Program Flash

MIN NOM MAX UNIT
tprog(288bits) Wide Word (288-bits) programming time 40 300 µs
tprog(Total) 4.0MB programming time(1) –40°C to 125°C 21.3 s
0°C to 60°C, for first 25 cycles 5.3 10.6 s
terase Sector/Bank erase time –40°C to 125°C 0.3 4 s
0°C to 60°C, for first 25 cycles 100 ms
twec Write/erase cycles with 15-year Data Retention requirement –40°C to 125°C 1000 cycles
(1) This programming time includes overhead of state machine, but does not include data transfer time. The programming time assumes programming 288 bits at a time at the maximum specified operating frequency.

6.10.5.2 Flash Program and Erase Timings for Data Flash

Table 6-32 Timing Requirements for Data Flash

MIN NOM MAX UNIT
tprog(72bits) Wide Word (72-bits) programming time 47 300 µs
tprog(Total) EEPROM Emulation (bank 7) 128KB programming time(1) –40°C to 125°C 2.6 s
0°C to 60°C, for first 25 cycles 775 1320 ms
EEPROM Emulation (bank 7) Sector/Bank erase time terase(bank7) –40°C to 125°C 0.2 8 s
0°C to 60°C, for first 25 cycles 14 100 ms
twec Write/erase cycles with 15-year Data Retention requirement –40°C to 125°C 100000 cycles
(1) This programming time includes overhead of state machine, but does not include data transfer time. The programming time assumes programming 72 bits at a time at the maximum specified operating frequency.

6.11 L2RAMW (Level 2 RAM Interface Module)

L2RAMW is the TMS570 level two RAM wrapper. Major features implemented in this device include:

  • Supports 512KB of L2 SRAMs
  • One 64-bit OCP interface
  • Built-in ECC generation and evaluation logic
    • The ECC logic is enabled by default.
    • When enabled, automatic ECC correction on write data from masters on any write sizes (8-,16-,32-,or 64-bit)
    • Less than 64-bit write forces built in read-modify-write
    • When enabled, reads due to read-modify-write go through ECC correction before data merging with the incoming write data
  • Redundant address decoding. Same address decode logic block is duplicated and compared to each other
  • Data Trace
    • Support tracing of both read and write accesses through RTP module
  • Auto initialization of memory banks to known values for both data and their corresponding ECC checksum

6.11.1 L2 SRAM Initialization

The entire L2 SRAM can be globally initialized by setting the corresponding bit in SYS.MSINENA register. When initialized, the memory arrays are written with all zeros for the 64-bit data and the corresponding 8-bit ECC checksum. Hardware memory initialization eliminates ECC error when the CPU reads from an un-initialized memory location which can cause an ECC error. For more information, see the device-specific Technical Reference Manual.

6.12 ECC / Parity Protection for Accesses to Peripheral RAMs

Accesses to some peripheral RAMs are protected by either odd/even parity checking or ECC checking. During a read access the parity or ECC is calculated based on the data read from the peripheral RAM and compared with the good parity or ECC value stored in the peripheral RAM for that peripheral. If any word fails the parity or ECC check, the module generates a ECC/parity error signal that is mapped to the Error Signaling Module. The module also captures the peripheral RAM address that caused the parity error.

The parity or ECC protection for peripheral RAMs is not enabled by default and must be enabled by the application. Each individual peripheral contains control registers to enable the parity or ECC protection for accesses to its RAM.

NOTE

For peripherals with parity protection the CPU read access gets the actual data from the peripheral. The application can choose to generate an interrupt whenever a peripheral RAM parity error is detected.

6.13 On-Chip SRAM Initialization and Testing

6.13.1 On-Chip SRAM Self-Test Using PBIST

6.13.1.1 Features

  • Extensive instruction set to support various memory test algorithms
  • ROM-based algorithms allow application to run TI production-level memory tests
  • Independent testing of all on-chip SRAM

6.13.1.2 PBIST RAM Groups

Table 6-33 PBIST RAM Grouping

MEMORY RAM
GROUP
TEST CLOCK RGS RDS MEM
TYPE
NO.
BANKS
TEST PATTERN
(ALGORITHM)
TRIPLE READ
SLOW READ
TRIPLE READ
FAST READ
March 13N(1)
TWO PORT
(cycles)
March 13N(1)
SINGLE PORT
(cycles)
ALGO MASK 0x1 ALGO MASK 0x2 ALGO MASK 0x4 ALGO MASK 0x8
PBIST_ROM 1 GCM_PBIST_ROM 1 1 ROM 1 24578 8194
STC1_1_ROM_R5 2 GCM_PBIST_ROM 14 1 ROM 1 49154 16386
STC1_2_ROM_R5 3 GCM_PBIST_ROM 14 2 ROM 1 49154 16386
STC2_ROM_NHET 4 GCM_PBIST_ROM 15 1 ROM 1 46082 15362
AWM1 5 GCM_VCLKP 2 1 2P 1 4210
DCAN1 6 GCM_VCLKP 3 1..6 2P 2 25260
DCAN2 7 GCM_VCLKP 4 1..6 2P 2 25260
DMA 8 GCM_HCLK 5 1..6 2P 2 37740
HTU1 9 GCM_VCLK2 6 1..6 2P 2 6540
MIBSPI1 10 GCM_VCLKP 8 1..4 2P 2 66760
MIBSPI2 11 GCM_VCLKP 9 1..4 2P 2 33480
MIBSPI3 12 GCM_VCLKP 10 1..4 2P 2 33480
NHET1 13 GCM_VCLK2 11 1..12 2P 4 50520
VIM 14 GCM_VCLK 12 1..2 2P 1 16740
Reserved 15 - - - - - -
RTP 16 GCM_HCLK 16 1..12 2P 4 50520
ATB(2) 17 GCM_GCLK1 17 1..16 2P 8 133920
AWM2 18 GCM_VCLKP 18 1 2P 1 4210
DCAN3 19 GCM_VCLKP 19 1..6 2P 2 25260
DCAN4 20 GCM_VCLKP 20 1..6 2P 2 25260
HTU2 21 GCM_VCLK2 21 1..6 2P 2 6540
MIBSPI4 22 GCM_VCLKP 22 1..4 2P 2 33480
MIBSPI5 23 GCM_VCLKP 23 1..4 2P 2 33480
NHET2 24 GCM_VCLK2 24 1..12 2P 4 50520
FTU 25 GCM_VCLKP 25 1 2P 1 8370
FRAY_INBUF_OUTBUF 26 GCM_VCLKP 26 1..8 2P 4 33680
CPGMAC_STATE_RXADDR 27 GCM_VCLK3 27 1..3 2P 2 6390
CPGMAC_STAT_FIFO 28 GCM_VCLK3 27 4..6 2P 3 8730
L2RAMW 29 GCM_HCLK 7 1 SP 4 532580
6 SP 4
L2RAMW 30 GCM_HCLK 32 1 SP 4 1597740
6 SP 4
11 SP 4
16 SP 4
21 SP 4
26 SP 4
R5_ICACHE 31 GCM_GCLK1 40 1 SP 4 166600
6 SP 4
11 SP 4
16 SP 4
R5_DCACHE 32 GCM_GCLK1 41 1 SP 4 299820
6 SP 4
11 SP 4
16 SP 4
21 SP 4
26 SP 4
Reserved 33 GCM_GCLK2 43 1 SP 4 166600
6 SP 4
11 SP 4
16 SP 4
Reserved 34 GCM_GCLK2 44 1 SP 4 299820
6 SP 4
11 SP 4
16 SP 4
21 SP 4
26 SP 4
FRAY_TRBUF_MSGRAM 35 GCM_VCLKP 26 9..11 SP 3 149910
CPGMAC_CPPI 36 GCM_VCLK3 27 7 SP 1 133170
R5_DCACHE_Dirty 37 GCM_GCLK1 42 2 SP 1 16690
Reserved 38 - - - - - -
(1) March13N is the only algorithm recommended for application testing of RAM.
(2) ATB RAM is part of the ETM module. PBIST testing of this RAM is limited to 85ºC or lower.

Several memory testing algorithms are stored in the PBIST ROM. However, TI only recommends the March13N algorithm for application testing of RAM.

The PBIST ROM clock frequency is limited to the maximum frequency of 82.5 MHz.

The PBIST ROM clock is divided down from HCLK. The divider is selected by programming the ROM_DIV field of the Memory Self-Test Global Control Register (MSTGCR) at address 0xFFFFFF58.

6.13.2 On-Chip SRAM Auto Initialization

This microcontroller allows some of the on-chip memories to be initialized through the Memory Hardware Initialization mechanism in the system module. This hardware mechanism allows an application to program the memory arrays with error detection capability to a known state based on their error detection scheme (odd/even parity or ECC).

The MINITGCR register enables the memory initialization sequence, and the MSINENA register selects the memories that are to be initialized.

For more information on these registers, see the device-specific Technical Reference Manual.

The mapping of the different on-chip memories to the specific bits of the MSINENA registers is provided in Table 6-34.

Table 6-34 Memory Initialization(4)(3)

CONNECTING MODULE ADDRESS RANGE SYS.MSINENA Register Bit # L2RAMW.MEMINT_ENA Register Bit #(1)
BASE ADDRESS ENDING ADDRESS
L2 SRAM 0x08000000 0x0800FFFF 0 0
L2 SRAM 0x08010000 0x0801FFFF 0 1
L2 SRAM 0x08020000 0x0802FFFF 0 2
L2 SRAM 0x08030000 0x0803FFFF 0 3
L2 SRAM 0x08040000 0x0804FFFF 0 4
L2 SRAM 0x08050000 0x0805FFFF 0 5
L2 SRAM 0x08060000 0x0806FFFF 0 6
L2 SRAM 0x08070000 0x0807FFFF 0 7
MIBSPI5 RAM(2) 0xFF0A0000 0xFF0BFFFF 12 n/a
MIBSPI4 RAM(2) 0xFF060000 0xFF07FFFF 19 n/a
MIBSPI3 RAM(2) 0xFF0C0000 0xFF0DFFFF 11 n/a
MIBSPI2 RAM(2) 0xFF080000 0xFF09FFFF 18 n/a
MIBSPI1 RAM(2) 0xFF0E0000 0xFF0FFFFF 7 n/a
DCAN4 RAM 0xFF180000 0xFF19FFFF 20 n/a
DCAN3 RAM 0xFF1A0000 0xFF1BFFFF 10 n/a
DCAN2 RAM 0xFF1C0000 0xFF1DFFFF 6 n/a
DCAN1 RAM 0xFF1E0000 0xFF1FFFFF 5 n/a
MIBADC2 RAM 0xFF3A0000 0xFF3BFFFF 14 n/a
MIBADC1 RAM 0xFF3E0000 0xFF3FFFFF 8 n/a
NHET2 RAM 0xFF440000 0xFF45FFFF 15 n/a
NHET1 RAM 0xFF460000 0xFF47FFFF 3 n/a
HET TU2 RAM 0xFF4C0000 0xFF4DFFFF 16 n/a
HET TU1 RAM 0xFF4E0000 0xFF4FFFFF 4 n/a
DMA RAM 0xFFF80000 0xFFF80FFF 1 n/a
VIM RAM 0xFFF82000 0xFFF82FFF 2 n/a
FlexRay TU RAM 0xFF500000 0xFF51FFFF 13 n/a
(1) The L2 SRAM from range 128KB to 512KB is divided into 8 memory regions. Each region has an associated control bit to enable auto-initialization.
(2) The MibSPIx modules perform an initialization of the transmit and receive RAMs as soon as the multibuffered mode is enabled. This is independent of whether the application has already initialized these RAMs using the auto-initialization method or not. The MibSPIx modules must be released from reset by writing a 1 to the SPIGCR0 registers before starting auto-initialization on the respective RAMs.
(3) If ECC protection is enabled for the CPU data RAM or peripheral SRAM modules, then the auto-initialization process also initializes the corresponding ECC space.
(4) If parity protection is enabled for the peripheral SRAM modules, then the parity bits will also be initialized along with the SRAM modules.

NOTE

Peripheral memories not listed in the table either do not support auto-initialization or have implemented auto-initialization controlled directly by their respective peripherals.

6.14 External Memory Interface (EMIF)

6.14.1 Features

The EMIF includes many features to enhance the ease and flexibility of connecting to external asynchronous memories or SDRAM devices. The EMIF features includes support for:

  • 3 addressable chip select for asynchronous memories of up to 16MB each
  • 1 addressable chip select space for SDRAMs up to 128MB
  • 8 or 16-bit data bus width
  • Programmable cycle timings such as setup, strobe, and hold times as well as turnaround time
  • Select strobe mode
  • Extended Wait mode
  • Data bus parking

NOTE

The EMIF is inherently BE8, or byte invariant big endian. This device is BE32, or word invariant big endian. There is no difference when interfacing to RAM or using an 8-bit wide data bus. However, there is an impact when reading from external ROMs or interfacing to hardware registers with a 16-bit wide data bus. The EMIF can be made BE32 by connecting EMIF_DATA[7:0] to the ROM or ASIC DATA[15:8] and EMIF_DATA[15:8] to the ROM or ASIC DATA[7:0].

Alternatively, the code stored in the ROM can be linked as -be8 instead of -be32.

NOTE

For a 32-bit access on the 16-bit EMIF interface, the lower 16-bits (the EMIF_BA[1] will be low) will be put out first followed by the upper 16-bits (EMIF_BA[1] will be high).

6.14.2 Electrical and Timing Specifications

6.14.2.1 Read Timing (Asynchronous RAM)

TMS570LC4357 emif_async_memory_read_timing_pns160.gif Figure 6-11 Asynchronous Memory Read Timing
TMS570LC4357 emif_nwait_read_pns160.gif Figure 6-12 EMIFnWAIT Read Timing Requirements

6.14.2.2 Write Timing (Asynchronous RAM)

TMS570LC4357 emif_async_memory_write_timing_pns160.gif Figure 6-13 Asynchronous Memory Write Timing
TMS570LC4357 emif_nwait_write_pns160.gif Figure 6-14 EMIFnWAIT Write Timing Requirements

6.14.2.3 EMIF Asynchronous Memory Timing

Table 6-35 EMIF Asynchronous Memory Timing Requirements(1)

NO. MIN NOM MAX UNIT
Reads and Writes
2 tw(EM_WAIT) Pulse duration, EMIFnWAIT assertion and deassertion 2E ns
Reads
12 tsu(EMDV-EMOEH) Setup time, EMIFDATA[15:0] valid before EMIFnOE high 11 ns
13 th(EMOEH-EMDIV) Hold time, EMIFDATA[15:0] valid after EMIFnOE high 0.5 ns
14 tsu(EMOEL-EMWAIT) Setup Time, EMIFnWAIT asserted before end of Strobe Phase(2) 4E+14 ns
Writes
28 tsu(EMWEL-EMWAIT) Setup Time, EMIFnWAIT asserted before end of Strobe Phase(2) 4E+14 ns
(1) E = EMIF_CLK period in ns.
(2) Setup before end of STROBE phase (if no extended wait states are inserted) by which EMIFnWAIT must be asserted to add extended wait states. Figure 6-12 and Figure 6-14 describe EMIF transactions that include extended wait states inserted during the STROBE phase. However, cycles inserted as part of this extended wait period should not be counted; the 4E requirement is to the start of where the HOLD phase would begin if there were no extended wait cycles.

Table 6-36 EMIF Asynchronous Memory Switching Characteristics(1)(2)(3)

NO. PARAMETER MIN TYP MAX UNIT
Reads and Writes
1 td(TURNAROUND) Turn around time (TA)*E -3 (TA)*E (TA)*E + 3 ns
Reads
3 tc(EMRCYCLE) EMIF read cycle time (EW = 0) (RS+RST+RH)*E-3 (RS+RST+RH)*E (RS+RST+RH)*E + 3 ns
EMIF read cycle time (EW = 1) (RS+RST+RH+ EWC)*E -3 (RS+RST+RH+ EWC)*E (RS+RST+RH+ EWC)*E + 3 ns
4 tsu(EMCEL-EMOEL) Output setup time, EMIF_nCS[4:2] low to EMIF_nOE low (SS = 0) (RS)*E-3 (RS)*E (RS)*E+3 ns
Output setup time, EMIFnCS[4:2] low to EMIF_nOE low (SS = 1) –3 0 3 ns
5 th(EMOEH-EMCEH) Output hold time, EMIF_nOE high to EMIF_nCS[4:2] high (SS = 0) (RH)*E -4 (RH)*E (RH)*E + 3 ns
Output hold time, EMIF_nOE high to EMIF_nCS[4:2] high (SS = 1) –4 0 3 ns
6 tsu(EMBAV-EMOEL) Output setup time, EMIF_BA[1:0] valid to EMIF_nOE low (RS)*E-3 (RS)*E (RS)*E+3 ns
7 th(EMOEH-EMBAIV) Output hold time, EMIF_nOE high to EMIF_BA[1:0] invalid (RH)*E-4 (RH)*E (RH)*E+3 ns
8 tsu(EMBAV-EMOEL) Output setup time, EMIF_ADDR[21:0] valid to EMIF_nOE low (RS)*E-3 (RS)*E (RS)*E+3 ns
9 th(EMOEH-EMAIV) Output hold time, EMIF_nOE high to EMIF_ADDR[21:0] invalid (RH)*E-4 (RH)*E (RH)*E+3 ns
10 tw(EMOEL) EMIF_nOE active low width (EW = 0) (RST)*E-3 (RST)*E (RST)*E+3 ns
EMIF_nOE active low width (EW = 1) (RST+EWC) *E-3 (RST+EWC)*E (RST+EWC) *E+3 ns
11 td(EMWAITH-EMOEH) Delay time from EMIF_nWAIT deasserted to EMIF_nOE high 3E-3 4E 4E+5 ns
29 tsu(EMDQMV-EMOEL) Output setup time, EMIF_nDQM[1:0] valid to EMIF_nOE low (RS)*E-5 (RS)*E (RS)*E+3 ns
30 th(EMOEH-EMDQMIV) Output hold time, EMIF_nOE high to EMIF_nDQM[1:0] invalid (RH)*E-4 (RH)*E (RH)*E+5 ns
Writes
15 tc(EMWCYCLE) EMIF write cycle time (EW = 0) (WS+WST+WH)* E-3 (WS+WST+WH)*E (WS+WST+WH)* E+3 ns
EMIF write cycle time (EW = 1) (WS+WST+WH+ EWC)*E -3 (WS+WST+WH+ EWC)*E (WS+WST+WH+ EWC)*E + 3 ns
16 tsu(EMCEL-EMWEL) Output setup time, EMIF_nCS[4:2] low to EMIF_nWE low (SS = 0) (WS)*E -3 (WS)*E (WS)*E + 3 ns
Output setup time, EMIF_nCS[4:2] low to EMIF_nWE low (SS = 1) –3 0 3 ns
17 th(EMWEH-EMCEH) Output hold time, EMIF_nWE high to EMIF_nCS[4:2] high (SS = 0) (WH)*E-3 (WH)*E (WH)*E+3 ns
Output hold time, EMIF_nWE high to EMIF_CS[4:2] high (SS = 1) –3 0 3 ns
18 tsu(EMDQMV-EMWEL) Output setup time, EMIF_nDQM[1:0] valid to EMIF_nWE low (WS)*E-3 (WS)*E (WS)*E+3 ns
19 th(EMWEH-EMDQMIV) Output hold time, EMIF_nWE high to EMIF_nDQM[1:0] invalid (WH)*E-3 (WH)*E (WH)*E+3 ns
20 tsu(EMBAV-EMWEL) Output setup time, EMIF_BA[1:0] valid to EMIF_nWE low (WS)*E-3 (WS)*E (WS)*E+3 ns
21 th(EMWEH-EMBAIV) Output hold time, EMIF_nWE high to EMIF_BA[1:0] invalid (WH)*E-3 (WH)*E (WH)*E+3 ns
22 tsu(EMAV-EMWEL) Output setup time, EMIF_ADDR[21:0] valid to EMIF_nWE low (WS)*E-3 (WS)*E (WS)*E+3 ns
23 th(EMWEH-EMAIV) Output hold time, EMIF_nWE high to EMIF_ADDR[21:0] invalid (WH)*E-3 (WH)*E (WH)*E+3 ns
24 tw(EMWEL) EMIF_nWE active low width (EW = 0) (WST)*E-3 (WST)*E (WST)*E+3 ns
EMIF_nWE active low width (EW = 1) (WST+EWC) *E-3 (WST+EWC)*E (WST+EWC) *E+3 ns
25 td(EMWAITH-EMWEH) Delay time from EMIF_nWAIT deasserted to EMIF_nWE high 3E+3 4E 4E+14 ns
26 tsu(EMDV-EMWEL) Output setup time, EMIF_DATA[15:0] valid to EMIF_nWE low (WS)*E-3 (WS)*E (WS)*E+3 ns
27 th(EMWEH-EMDIV) Output hold time, EMIF_nWE high to EMIF_DATA[15:0] invalid (WH)*E-3 (WH)*E (WH)*E+3 ns
(1) TA = Turn around, RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold, MEWC = Maximum external wait cycles. These parameters are programmed through the Asynchronous Bank and Asynchronous Wait Cycle Configuration Registers. These support the following ranges of values: TA[4–1], RS[16–1], RST[64–1], RH[8–1], WS[16–1], WST[64–1], WH[8–1], and MEWC[1–256]. See the EMIF chapter of the TRM SPNU563 for more information.
(2) E = EMIF_CLK period in ns.
(3) EWC = external wait cycles determined by EMIFnWAIT input signal. EWC supports the following range of values. EWC[256–1]. Note that the maximum wait time before time-out is specified by bit field MEWC in the Asynchronous Wait Cycle Configuration Register. See the EMIF chapter of the TRM SPNU563 for more information.

6.14.2.4 Read Timing (Synchronous RAM)

TMS570LC4357 emif_sdram_read_pns160.gif Figure 6-15 Basic SDRAM Read Operation

6.14.2.5 Write Timing (Synchronous RAM)

TMS570LC4357 emif_sdram_write_pns160.gif Figure 6-16 Basic SDRAM Write Operation

6.14.2.6 EMIF Synchronous Memory Timing

Table 6-37 EMIF Synchronous Memory Timing Requirements

NO. MIN MAX UNIT
19 tsu(EMIFDV-EM_CLKH) Input setup time, read data valid on EMIF_DATA[15:0] before EMIF_CLK rising 1 ns
20 th(CLKH-DIV) Input hold time, read data valid on EMIF_DATA[15:0] after EMIF_CLK rising 2.2 ns

Table 6-38 EMIF Synchronous Memory Switching Characteristics

NO. PARAMETER MIN MAX UNIT
1 tc(CLK) Cycle time, EMIF clock EMIF_CLK 10 ns
2 tw(CLK) Pulse width, EMIF clock EMIF_CLK high or low 3 ns
3 td(CLKH-CSV) Delay time, EMIF_CLK rising to EMIF_nCS[0] valid 7 ns
4 toh(CLKH-CSIV) Output hold time, EMIF_CLK rising to EMIF_nCS[0] invalid 1 ns
5 td(CLKH-DQMV) Delay time, EMIF_CLK rising to EMIF_nDQM[1:0] valid 7 ns
6 toh(CLKH-DQMIV) Output hold time, EMIF_CLK rising to EMIF_nDQM[1:0] invalid 1 ns
7 td(CLKH-AV) Delay time, EMIF_CLK rising to EMIF_ADDR[21:0] and EMIF_BA[1:0] valid 7 ns
8 toh(CLKH-AIV) Output hold time, EMIF_CLK rising to EMIF_ADDR[21:0] and EMIF_BA[1:0] invalid 1 ns
9 td(CLKH-DV) Delay time, EMIF_CLK rising to EMIF_DATA[15:0] valid 7 ns
10 toh(CLKH-DIV) Output hold time, EMIF_CLK rising to EMIF_DATA[15:0] invalid 1 ns
11 td(CLKH-RASV) Delay time, EMIF_CLK rising to EMIF_nRAS valid 7 ns
12 toh(CLKH-RASIV) Output hold time, EMIF_CLK rising to EMIF_nRAS invalid 1 ns
13 td(CLKH-CASV) Delay time, EMIF_CLK rising to EMIF_nCAS valid 7 ns
14 toh(CLKH-CASIV) Output hold time, EMIF_CLK rising to EMIF_nCAS invalid 1 ns
15 td(CLKH-WEV) Delay time, EMIF_CLK rising to EMIF_nWE valid 7 ns
16 toh(CLKH-WEIV) Output hold time, EMIF_CLK rising to EMIF_nWE invalid 1 ns
17 tdis(CLKH-DHZ) Delay time, EMIF_CLK rising to EMIF_DATA[15:0] tri-stated 7 ns
18 tena(CLKH-DLZ) Output hold time, EMIF_CLK rising to EMIF_DATA[15:0] driving 1 ns

6.15 Vectored Interrupt Manager

There are two on-chip Vector Interrupt Manager (VIM) modules. The VIM module provides hardware assistance for prioritizing and controlling the many interrupt sources present on a device. Interrupts are caused by events outside of the normal flow of program execution. Normally, these events require a timely response from the CPU; therefore, when an interrupt occurs, the CPU switches execution from the normal program flow to an interrupt service routine (ISR).

6.15.1 VIM Features

The VIM module has the following features:

  • Supports 128 interrupt channels
  • Provides programmable priority for the request lines
  • Manages interrupt channels through masking
  • Prioritizes interrupt channels to the CPU
  • Provides the CPU with the address of the interrupt service routine (ISR) for each interrupt

The two VIM modules are in lockstep. These two VIM modules are memory mapped to the same address space. From a programmer’s model point of view it is only one VIM module. Writes to VIM1 registers and memory will be broadcasted to both VIM1 and VIM2. Reads from VIM1 will only read the VIM1 registers and memory. All interrupt requests which go to the VIM1 module will also go to the VIM2 module. Because the VIM1 and VIM2 have the identical setup, both will result in the same output behavior responding to the same interrupt requests. The second VIM module acts as a diagnostic checker module against the first VIM module. The output signals of the two VIM modules are routed to CCM-R5F module and are compared constantly. Mis-compare detected will be signaled as an error to the ESM module. The lockstep VIM pair takes care of the interrupt generation to the lockstep R5F pair.

6.15.2 Interrupt Generation

To avoid common mode failures the input and output signals of the two VIMs are delayed in a different way as shown in Figure 6-17.

TMS570LC4357 interrupt_generation_LC_spns195.gif Figure 6-17 Interrupt Generation

6.15.3 Interrupt Request Assignments

Table 6-39 Interrupt Request Assignments

MODULES VIM INTERRUPT SOURCES DEFAULT VIM
INTERRUPT CHANNEL
ESM ESM high-level interrupt (NMI) 0
Reserved Reserved 1
RTI RTI1 compare interrupt 0 2
RTI RTI1 compare interrupt 1 3
RTI RTI1 compare interrupt 2 4
RTI RTI1 compare interrupt 3 5
RTI RTI1 overflow interrupt 0 6
RTI RTI1 overflow interrupt 1 7
RTI RTI1 time-base 8
GIO GIO high level interrupt 9
NHET1 NHET1 high-level interrupt (priority level 1) 10
HET TU1 HET TU1 level 0 interrupt 11
MIBSPI1 MIBSPI1 level 0 interrupt 12
LIN1 LIN1 level 0 interrupt 13
MIBADC1 MIBADC1 event group interrupt 14
MIBADC1 MIBADC1 software group 1 interrupt 15
DCAN1 DCAN1 level 0 interrupt 16
MIBSPI2 MIBSPI2 level 0 interrupt 17
FlexRay FlexRay level 0 interrupt (CC_int0) 18
CRC1 CRC1 Interrupt 19
ESM ESM low-level interrupt 20
SYSTEM Software interrupt for Cortex-R5F (SSI) 21
CPU Cortex-R5F PMU Interrupt 22
GIO GIO low level interrupt 23
NHET1 NHET1 low level interrupt (priority level 2) 24
HET TU1 HET TU1 level 1 interrupt 25
MIBSPI1 MIBSPI1 level 1 interrupt 26
LIN1 LIN1 level 1 interrupt 27
MIBADC1 MIBADC1 software group 2 interrupt 28
DCAN1 DCAN1 level 1 interrupt 29
MIBSPI2 MIBSPI2 level 1 interrupt 30
MIBADC1 MIBADC1 magnitude compare interrupt 31
FlexRay FlexRay level 1 interrupt (CC_int1) 32
DMA FTCA interrupt 33
DMA LFSA interrupt 34
DCAN2 DCAN2 level 0 interrupt 35
DMM DMM level 0 interrupt 36
MIBSPI3 MIBSPI3 level 0 interrupt 37
MIBSPI3 MIBSPI3 level 1 interrupt 38
DMA HBCA interrupt 39
DMA BTCA interrupt 40
EMIF AEMIFINT 41
DCAN2 DCAN2 level 1 interrupt 42
DMM DMM level 1 interrupt 43
DCAN1 DCAN1 IF3 interrupt 44
DCAN3 DCAN3 level 0 interrupt 45
DCAN2 DCAN2 IF3 interrupt 46
FPU FPU interrupt of Cortex-R5F 47
FlexRay TU FlexRay TU Transfer Status interrupt (TU_Int0) 48
MIBSPI4 MIBSPI4 level 0 interrupt 49
MIBADC2 MibADC2 event group interrupt 50
MIBADC2 MibADC2 software group1 interrupt 51
FlexRay FlexRay T0C interrupt (CC_tint0) 52
MIBSPI5 MIBSPI5 level 0 interrupt 53
MIBSPI4 MIBSPI4 level 1 interrupt 54
DCAN3 DCAN3 level 1 interrupt 55
MIBSPI5 MIBSPI5 level 1 interrupt 56
MIBADC2 MibADC2 software group2 interrupt 57
FlexRay TU FlexRay TU Error interrupt (TU_Int1) 58
MIBADC2 MibADC2 magnitude compare interrupt 59
DCAN3 DCAN3 IF3 interrupt 60
L2FMC FSM_DONE interrupt 61
FlexRay FlexRay T1C interrupt (CC_tint1) 62
NHET2 NHET2 level 0 interrupt 63
SCI3 SCI3 level 0 interrupt 64
NHET TU2 NHET TU2 level 0 interrupt 65
I2C1 I2C level 0 interrupt 66
Reserved Reserved 67–72
NHET2 NHET2 level 1 interrupt 73
SCI3 SCI3 level 1 interrupt 74
NHET TU2 NHET TU2 level 1 interrupt 75
Ethernet C0_MISC_PULSE 76
Ethernet C0_TX_PULSE 77
Ethernet C0_THRESH_PULSE 78
Ethernet C0_RX_PULSE 79
HWAG1 HWA_INT_REQ_H 80
HWAG2 HWA_INT_REQ_H 81
DCC1 DCC1 done interrupt 82
DCC2 DCC2 done interrupt 83
SYSTEM Reserved 84
PBIST PBIST Done 85
Reserved Reserved 86–87
HWAG1 HWA_INT_REQ_L 88
HWAG2 HWA_INT_REQ_L 89
ePWM1INTn ePWM1 Interrupt 90
ePWM1TZINTn ePWM1 Trip Zone Interrupt 91
ePWM2INTn ePWM2 Interrupt 92
ePWM2TZINTn ePWM2 Trip Zone Interrupt 93
ePWM3INTn ePWM3 Interrupt 94
ePWM3TZINTn ePWM3 Trip Zone Interrupt 95
ePWM4INTn ePWM4 Interrupt 96
ePWM4TZINTn ePWM4 Trip Zone Interrupt 97
ePWM5INTn ePWM5 Interrupt 98
ePWM5TZINTn ePWM5 Trip Zone Interrupt 99
ePWM6INTn ePWM6 Interrupt 100
ePWM6TZINTn ePWM6 Trip Zone Interrupt 101
ePWM7INTn ePWM7 Interrupt 102
ePWM7TZINTn ePWM7 Trip Zone Interrupt 103
eCAP1INTn eCAP1 Interrupt 104
eCAP2INTn eCAP2 Interrupt 105
eCAP3INTn eCAP3 Interrupt 106
eCAP4INTn eCAP4 Interrupt 107
eCAP5INTn eCAP5 Interrupt 108
eCAP6INTn eCAP6 Interrupt 109
eQEP1INTn eQEP1 Interrupt 110
eQEP2INTn eQEP2 Interrupt 111
Reserved Reserved 112
DCAN4 DCAN4 Level 0 interrupt 113
I2C2 I2C2 interrupt 114
LIN2 LIN2 level 0 interrupt 115
SCI4 SCI4 level 0 interrupt 116
DCAN4 DCAN4 Level 1 interrupt 117
LIN2 LIN2 level 1 interrupt 118
SCI4 SCI4 level 1 interrupt 119
DCAN4 DCAN4 IF3 Interrupt 120
CRC2 CRC2 Interrupt 121
Reserved Reserved 122
Reserved Reserved 123
EPC EPC FIFO FULL or CAM FULL interrupt 124
Reserved Reserved 125-127

NOTE

Address location 0x00000000 in the VIM RAM is reserved for the phantom interrupt ISR entry; therefore only request channels 0..126 can be used and are offset by one address in the VIM RAM.

NOTE

The EMIF_nWAIT signal has a pull-up on it. The EMIF module generates a "Wait Rise" interrupt whenever it detects a rising edge on the EMIF_nWAIT signal. This interrupt condition is indicated as soon as the device is powered up. This can be ignored if the EMIF_nWAIT signal is not used in the application. If the EMIF_nWAIT signal is actually used in the application, then the external slave memory must always drive the EMIF_nWAIT signal such that an interrupt is not caused due to the default pull-up on this signal.

NOTE

The lower-order interrupt channels are higher priority channels than the higher-order interrupt channels.

NOTE

The application can change the mapping of interrupt sources to the interrupt channels through the interrupt channel control registers (CHANCTRLx) inside the VIM module.

6.16 ECC Error Event Monitoring and Profiling

This device includes an Error Profiling Controller (EPC) module. The main goal of this module is to enable the system to tolerate a certain amount of ECC correctable errors on the same address repeatedly in the memory system with minimal runtime overhead. Main features implemented in this device are described below.

  • Capture the address of correctable ECC faults from different sources (for example, CPU, L2RAM, Interconnect) into a 16-entry Content Addressable Memory (CAM).
  • For correctable faults, the error handling depends on the below conditions:
    • if the incoming address is already in the 16-entry CAM, discard the fail. No error generated to ESM
    • if the address is not in the CAM list, and the CAM has empty entries, add the address into the CAM list. In addition, raise the error signal to the ESM group 1 if enabled.
    • if the address is not in the CAM list, and the CAM has no empty entries, always raise a signal to the ESM group 1.
  • A 4-entry FIFO to store correctable error events and addresses for each IP interface.
  • For uncorrectable faults of non-CPU access, capture the address and raise a signal to the ESM group 2.
  • The CAM is implemented in memory mapped registers. The CPU can read and write to any entry for diagnostic test as if a real CAM memory macro.
TMS570LC4357 epc_block_diagram_f1_spns195.gif Figure 6-18 EPC Block Diagram

6.16.1 EPC Module Operation

6.16.1.1 Correctable Error Handling

When a correctable error is detected in the system by an IP, it sends the error signal along with the error address to EPC module. The EPC module will scan this error address in the 16-entry CAM. If there is a match then the address is discard and no error is generated to ESM by the ECP. It takes one cycle to scan one address at a time through the CAM. The idea is to allow the system to tolerate a correctable error occurring on the same address because this error has been handled before by the CPU. This error scenario is particularly frequent when the software is in a for loop fetching the same address. Because there are multiple IPs which can simultaneously detect correctable errors in the system, the EPC employs a 4-entry FIFO per IP interface so that error addresses are not lost.

If an address is not matched in the CAM then it depends if there is empty entry in the CAM. If there is an empty entry then the new address is stored into the empty entry. For each entry there is a 4-bit valid key. When a new address is stored the 4-bit key is updated with "1010". It is programmable to generate a correctable error to the ESM if the address is not matched and there is an empty CAM entry. Once CPU is interrupted, it can choose to evaluate the error address and handle it accordingly. The software can also invalidate the entry by writing "0101".

If an dress is not matched and there is no empty entry in the CAM then the correctable error is immediately sent to the ESM. The new error address is lost if there is no empty entry left in the CAM.

6.16.1.2 Uncorrectable Error Handling

Uncorrectable errors reported by the IP (non-CPU access) are immediately captured for their error addresses and update to the uncorrectable error status register. For more information see the device specific technical reference guide SPNU563.

6.17 DMA Controller

The DMA controller is used to transfer data between two locations in the memory map in the background of CPU operations. Typically, the DMA is used to:

  • Transfer blocks of data between external and internal data memories
  • Restructure portions of internal data memory
  • Continually service a peripheral

6.17.1 DMA Features

  • 64-bit OCP protocol to perform bus master accesses
  • INCR-4 64-bit burst accesses
  • Multithreading architecture allowing data of two different channel transfers to be interleaved during nonburst accesses
  • 2-port configuration for parallel bus master
  • Channels can be assigned to either high-priority queue or low-priority queue. Within each queue, fixed or round-robin priorities can be serviced
  • Built-in ECC generation and evaluation logic for internal RAM storing channel transfer information
  • Supports multiple interrupt outputs for mapping to multiple interrupt controllers in multicore systems
  • 48 requests can be mapped to any 32 channels
  • Supports LE endianess
  • External ECC Gen/Eval block of DMA support ECC generation for data transactions, and parity for address, and control signals (following Cortex-R5F standard)
  • 8 MPU regions
  • Channel chaining capability
  • Hardware and software DMA requests
  • 8-, 16-, 32-, or 64-bit transactions supported
  • Multiple addressing modes for source/destination (fixed, increment, offset)
  • Auto-initiation

6.17.2 DMA Transfer Port Assignment

There are two ports, port A and port B attached to the DMA controller. When configuring a DMA channel for a transfer, the application must also specify the port associated with the transfer source and destination. Table 6-40 lists the mapping between each port and the resources. For example, if a transfer is to be made from the the flash to the SRAM, the application will need configure the desired DMA channel in the PARx register to select port A as the target for both the source and destination. If a transfer is to be made from the SRAM to a peripheral or a peripheral memory, the application will need to configure the desired DMA channel in the PARx register to select port A for read and port B for write. Likewise, if a transfer is from a peripheral to the SRAM then the PARx will be configured to select port B for read and port A for write.

Table 6-40 DMA Port Assignment

TARGET NAME ACCESS PORT OF DMA
Flash Port A
SRAM Port A
EMIF Port A
Flash OTP/ECC/EEPROM Port A
All other targets (peripherals, peripheral memories) Port B

6.17.3 Default DMA Request Map

The DMA module on this microcontroller has 32 channels and up to 48 hardware DMA requests. The module contains DREQASIx registers which are used to map the DMA requests to the DMA channels. By default, channel 0 is mapped to request 0, channel 1 to request 1, and so on.

Some DMA requests have multiple sources, see Table 6-41. The application must ensure that only one of these DMA request sources is enabled at any time.

Table 6-41 DMA Request Line Connection

MODULES DMA REQUEST SOURCES DMA REQUEST
MIBSPI1 MIBSPI1[1](1) DMAREQ[0]
MIBSPI1 MIBSPI1[0](2) DMAREQ[1]
MIBSPI2 MIBSPI2[1](1) DMAREQ[2]
MIBSPI2 MIBSPI2[0](2) DMAREQ[3]
MIBSPI1 / MIBSPI3 / DCAN2 MIBSPI1[2] / MIBSPI3[2] / DCAN2 IF3 DMAREQ[4]
MIBSPI1 / MIBSPI3 / DCAN2 MIBSPI1[3] / MIBSPI3[3] / DCAN2 IF2 DMAREQ[5]
DCAN1 / MIBSPI5 DCAN1 IF2 / MIBSPI5[2] DMAREQ[6]
MIBADC1 / MIBSPI5 MIBADC1 event / MIBSPI5[3] DMAREQ[7]
MIBSPI1 / MIBSPI3 / DCAN1 MIBSPI1[4] / MIBSPI3[4] / DCAN1 IF1 DMAREQ[8]
MIBSPI1 / MIBSPI3 / DCAN2 MIBSPI1[5] / MIBSPI3[5] / DCAN2 IF1 DMAREQ[9]
MIBADC1 / I2C / MIBSPI5 MIBADC1 G1 / I2C receive / MIBSPI5[4] DMAREQ[10]
MIBADC1 / I2C / MIBSPI5 MIBADC1 G2 / I2C transmit / MIBSPI5[5] DMAREQ[11]
RTI1 / MIBSPI1 / MIBSPI3 RTI1 DMAREQ0 / MIBSPI1[6] / MIBSPI3[6] DMAREQ[12]
RTI1 / MIBSPI1 / MIBSPI3 RTI1 DMAREQ1 / MIBSPI1[7] / MIBSPI3[7] DMAREQ[13]
MIBSPI3 / MibADC2 / MIBSPI5 MIBSPI3[1](1) / MibADC2 event / MIBSPI5[6] DMAREQ[14]
MIBSPI3 / MIBSPI5 MIBSPI3[0](2) / MIBSPI5[7] DMAREQ[15]
MIBSPI1 / MIBSPI3 / DCAN1 / MibADC2 MIBSPI1[8] / MIBSPI3[8] / DCAN1 IF3 / MibADC2 G1 DMAREQ[16]
MIBSPI1 / MIBSPI3 / DCAN3 / MibADC2 MIBSPI1[9] / MIBSPI3[9] / DCAN3 IF1 / MibADC2 G2 DMAREQ[17]
RTI1 / MIBSPI5 RTI1 DMAREQ2 / MIBSPI5[8] DMAREQ[18]
RTI1 / MIBSPI5 RTI1 DMAREQ3 / MIBSPI5[9] DMAREQ[19]
NHET1 / NHET2 / DCAN3 NHET1 DMAREQ[4] / NHET2 DMAREQ[4] / DCAN3 IF2 DMAREQ[20]
NHET1 / NHET2 / DCAN3 NHET1 DMAREQ[5] / NHET2 DMAREQ[5] / DCAN3 IF3 DMAREQ[21]
MIBSPI1 / MIBSPI3 / MIBSPI5 MIBSPI1[10] / MIBSPI3[10] / MIBSPI5[10] DMAREQ[22]
MIBSPI1 / MIBSPI3 / MIBSPI5 MIBSPI1[11] / MIBSPI3[11] / MIBSPI5[11] DMAREQ[23]
NHET1 / NHET2 / MIBSPI4 / MIBSPI5 NHET1 DMAREQ[6] / NHET2 DMAREQ[6] / MIBSPI4[1] (1)/ MIBSPI5[12] DMAREQ[24]
NHET1 / NHET2 / MIBSPI4 / MIBSPI5 NHET1 DMAREQ[7] / NHET2 DMAREQ[7] / MIBSPI4[0](2) / MIBSPI5[13] DMAREQ[25]
CRC1 / MIBSPI1 / MIBSPI3 CRC1 DMAREQ[0] / MIBSPI1[12] / MIBSPI3[12] DMAREQ[26]
CRC1 / MIBSPI1 / MIBSPI3 CRC1 DMAREQ[1] / MIBSPI1[13] / MIBSPI3[13] DMAREQ[27]
LIN1 / MIBSPI5 LIN1 receive / MIBSPI5[14] DMAREQ[28]
LIN1 / MIBSPI5 LIN1 transmit / MIBSPI5[15] DMAREQ[29]
MIBSPI1 / MIBSPI3 / SCI3 / MIBSPI5 MIBSPI1[14] / MIBSPI3[14] / SCI3 receive / MIBSPI5[1](1) DMAREQ[30]
MIBSPI1 / MIBSPI3 / SCI3 / MIBSPI5 MIBSPI1[15] / MIBSPI3[15] / SCI3 transmit / MIBSPI5[0](2) DMAREQ[31]
I2C2 / ePWM1 / MIBSPI2 / MIBSPI4 / GIOA I2C2 receive / ePWM1_SOCA / MIBSPI2[2] / MIBSPI4[2] / GIOA[0] DMAREQ[32]
I2C2 / ePWM 1 / MIBSPI2 / MIBSPI4 / GIOA I2C2 transmit / ePWM1_SOCB / MIBSPI2[3] / MIBSPI4[3] / GIOA[1] DMAREQ[33]
ePWM2 / MIBSPI2 / MIBSPI4 / GIOA ePWM2_SOCA / MIBSPI2[4] / MIBSPI4[4] / GIOA[2] DMAREQ[34]
ePWM2 / MIBSPI2 / MIBSPI4 / GIOA ePWM2_SOCB / MIBSPI2[5] / MIBSPI4[5] / GIOA[3] DMAREQ[35]
ePWM3 / MIBSPI2 / MIBSPI4 / GIOA ePWM3_SOCA / MIBSPI2[6] / MIBSPI4[6] / GIOA[4] DMAREQ[36]
ePWM3 / MIBSPI2 / MIBSPI4 / GIOA ePWM3_SOCB / MIBSPI2[7] / MIBSPI4[7] / GIOA[5] DMAREQ[37]
CRC2 / ePWM4 / MIBSPI2 / MIBSPI4 / GIOA CRC2 DMAREQ[0] / ePWM4_SOCA / MIBSPI2[8] / MIBSPI4[8] / GIOA[6] DMAREQ[38]
CRC2 / ePWM4 / MIBSPI2 / MIBSPI4 / GIOA CRC2 DMAREQ[1] / ePWM4_SOCB / MIBSPI2[9] / MIBSPI4[9] / GIOA[7] DMAREQ[39]
LIN2 / ePWM5 / MIBSPI2 / MIBSPI4 / GIOB LIN2 receive / ePWM5_SOCA / MIBSPI2[10] / MIBSPI4[10] / GIOB[0] DMAREQ[40]
LIN2 / ePWM5 / MIBSPI2 / MIBSPI4 / GIOB LIN2 transmit / ePWM5_SOCB / MIBSPI2[11] / MIBSPI4[11] / GIOB[1] DMAREQ[41]
SCI4 / ePWM6 / MIBSPI2 / MIBSPI4 / GIOB SCI4 receive / ePWM6_SOCA / MIBSPI2[12] / MIBSPI4[12] / GIOB[2] DMAREQ[42]
SCI4 / ePWM6 / MIBSPI2 / MIBSPI4 / GIOB SCI4 transmit / ePWM6_SOCB / MIBSPI2[13] / MIBSPI4[13] / GIOB[3] DMAREQ[43]
ePWM7 / MIBSPI2 / MIBSPI4 / GIOB ePWM7_SOCA / MIBSPI2[14] / MIBSPI4[14] / GIOB[4] DMAREQ[44]
ePWM7 / MIBSPI2 / MIBSPI4 / GIOB / DCAN4 ePWM7_SOCB / MIBSPI2[15] / MIBSPI4[15] / GIOB[5] / DCAN4 IF1 DMAREQ[45]
GIOB / DCAN4 GIOB[6] / DCAN4_IF2 DMAREQ[46]
GIOB / DCAN4 GIOB[7] / DCAN4_IF3 DMAREQ[47]
(1) SPI1, SPI2, SPI3, SPI4, SPI5 receive in compatibility mode
(2) SPI1, SPI2, SPI3, SPI4, SPI5 transmit in compatibility mode

6.17.4 Using a GIO terminal as a DMA Request Input

Each GIO terminal can also directly be used as DMA request input as listed in Table 6-41. The polarity of the GIO terminal to trigger a DMA request can be selected inside the DMA module. To use the GIO terminal as a DMA request input, the corresponding select bit must be set to low. See Figure 6-19 for an illustration. For more information see the technical reference guide SPNU563.

TMS570LC4357 gio_pin_dma_request_spns195.gif Figure 6-19 Using a GIO terminal as a DMA Request Input

Table 6-42 GIO DMA Request Disable Mapping

GIO TERMINAL GIO DMA REQUEST SELECT BIT
GIOA[0] PINMMR175[0]
GIOA[1] PINMMR175[8]
GIOA[2] PINMMR175[16]
GIOA[3] PINMMR175[24]
GIOA[4] PINMMR176[0]
GIOA[5] PINMMR176[8]
GIOA[6] PINMMR176[16]
GIOA[7] PINMMR176[24]
GIOB[0] PINMMR177[0]
GIOB[1] PINMMR177[8]
GIOB[2] PINMMR177[16]
GIOB[3] PINMMR177[24]
GIOB[4] PINMMR178[0]
GIOB[5] PINMMR178[8]
GIOB[6] PINMMR178[16]
GIOB[7] PINMMR178[24]

6.18 Real-Time Interrupt Module

The real-time interrupt (RTI) module provides timer functionality for operating systems and for benchmarking code. The RTI module can incorporate several counters that define the time bases needed for scheduling an operating system.

The timers also let you benchmark certain areas of code by reading the values of the counters at the beginning and the end of the desired code range and calculating the difference between the values.

6.18.1 Features

The RTI module has the following features:

  • Two independent 64-bit counter blocks
  • Four configurable compares for generating operating system ticks or DMA requests. Each event can be driven by either counter block 0 or counter block 1.
  • Fast enabling/disabling of events
  • Two timestamp (capture) functions for system or peripheral interrupts, one for each counter block

6.18.2 Block Diagrams

Figure 6-20 shows a high-level block diagram for one of the two 64-bit counter blocks inside the RTI module. Both the counter blocks are identical except the Network Time Unit (NTUx) inputs are only available as time-base inputs for the counter block 0. Figure 6-21 shows the compare unit block diagram of the RTI module.

TMS570LC4357 rti_counter_bd_pns160.gif Figure 6-20 Counter Block Diagram
TMS570LC4357 rti_compare_bd_pns160.gif Figure 6-21 Compare Block Diagram

6.18.3 Clock Source Options

The RTI module uses the RTI1CLK clock domain for generating the RTI time bases.

The application can select the clock source for the RTI1CLK by configuring the RCLKSRC register in the system module at address 0xFFFFFF50. The default source for RTI1CLK is VCLK.

For more information on clock sources, see Table 6-11 and Table 6-16.

6.18.4 Network Time Synchronization Inputs

The RTI module supports four Network Time Unit (NTU) inputs that signal internal system events, and which can be used to synchronize the time base used by the RTI module. On this device, these NTU inputs are connected as shown in Table 6-43.

Table 6-43 Network Time Synchronization Inputs

NTU INPUT SOURCE
0 FlexRay Macrotick
1 FlexRay Start of Cycle
2 PLL2 Clock output
3 EXTCLKIN1 clock input

6.19 Error Signaling Module

The Error Signaling Module (ESM) manages the various error conditions on the TMS570LCx microcontroller. The error condition is handled based on a fixed severity level assigned to it. Any severe error condition can be configured to drive a low level on a dedicated device terminal called nERROR. The nERROR can be used as an indicator to an external monitor circuit to put the system into a safe state.

6.19.1 ESM Features

The features of the ESM are:

  • 160 interrupt/error channels are supported, divided into three groups
    • 96 channels with maskable interrupt and configurable error terminal behavior
    • 32 error channels with nonmaskable interrupt and predefined error terminal behavior
    • 32 channels with predefined error terminal behavior only
  • Error terminal to signal severe device failure
  • Configurable time base for error signal
  • Error forcing capability

6.19.2 ESM Channel Assignments

The ESM integrates all the device error conditions and groups them in the order of severity. Group1 is used for errors of the lowest severity while Group3 is used for errors of the highest severity. The device response to each error is determined by the severity group to which the error is connected. Table 6-45 lists the channel assignment for each group.

Table 6-44 ESM Groups

ERROR GROUP INTERRUPT CHARACTERISTICS INFLUENCE ON ERROR
TERMINAL
Group1 Maskable, low or high priority Configurable
Group2 Nonmaskable, high priority Fixed
Group3 No interrupt generated Fixed

Table 6-45 ESM Channel Assignments

ESM ERROR SOURCES GROUP CHANNELS
Group1
Reserved Group1 0
MibADC2 - parity Group1 1
DMA - MPU error for CPU (DMAOCP_MPVINT(0)) Group1 2
DMA - ECC uncorrectable error Group1 3
EPC - Correctable Error Group1 4
Reserved Group1 5
L2FMC - correctable error (implicit OTP read). Group1 6
NHET1 - parity Group1 7
HET TU1/HET TU2 - parity Group1 8
HET TU1/HET TU2 - MPU Group1 9
PLL1 - slip Group1 10
LPO Clock Monitor - interrupt Group1 11
FlexRay RAM - ECC uncorrectable error Group1 12
Reserved Group1 13
FlexRay TU RAM - ECC uncorrectable error (TU_UCT_err) Group1 14
VIM RAM - ECC uncorrectable error Group1 15
FlexRay TU - MPU violation (TU_MPV_err) Group1 16
MibSPI1 - ECC uncorrectable error Group1 17
MibSPI3 - ECC uncorrectable error Group1 18
MibADC1 - parity Group1 19
DMA - Bus Error Group1 20
DCAN1 - ECC uncorrectable error Group1 21
DCAN3 - ECC uncorrectable error Group1 22
DCAN2 - ECC uncorrectable error Group1 23
MibSPI5 - ECC uncorrectable error Group1 24
Reserved Group1 25
L2RAMW - correctable error Group1 26
Cortex-R5F CPU - self-test Group1 27
Reserved Group1 28
Reserved Group1 29
DCC1 - error Group1 30
CCM-R5F - self-test Group1 31
Reserved Group1 32
Reserved Group1 33
NHET2 - parity Group1 34
Reserved Group1 35
Reserved Group1 36
IOMM - Mux configuration error Group1 37
Power domain compare error Group1 38
Power domain self-test error Group1 39
eFuse farm – EFC error Group1 40
eFuse farm - self-test error Group1 41
PLL2 - slip Group1 42
Ethernet Controller master interface Group1 43
Reserved Group1 44
Reserved Group1 45
Cortex-R5F Core - cache correctable error event Group1 46
ACP d-cache invalidate Group1 47
Reserved Group1 48
MibSPI2 - ECC uncorrectable error Group1 49
MibSPI4 - ECC uncorrectable error Group1 50
DCAN4 - ECC uncorrectable error Group1 51
CPU Interconnect Subsystem - Global error Group1 52
CPU Interconnect Subsystem - Global Parity Error Group1 53
NHET1/2 - self-test error Group1 54
NMPU - EMAC MPU Error Group1 55
Reserved Group1 56
Reserved Group1 57
Reserved Group1 58
Reserved Group1 59
Reserved Group1 60
NMPU - PS_SCR_S MPU Error Group1 61
DCC2 - error Group1 62
Reserved Group1 63
Reserved Group1 64
Reserved Group1 65
Reserved Group1 66
Reserved Group1 67
Reserved Group1 68
NMPU - DMA Port A MPU Error Group1 69
DMA - Transaction Bus Parity Error Group1 70
FlexRay TU RAM- ECC single bit error (TU_SBE_err) Group1 71
FlexRay - ECC single bit error Group1 72
DCAN1 - ECC single bit error Group1 73
DCAN2 - ECC single bit error Group1 74
DCAN3 - ECC single bit error Group1 75
DCAN4 - ECC single bit error Group1 76
MIBSPI1 - ECC single bit error Group1 77
MIBSPI2 - ECC single bit error Group1 78
MIBSPI3 - ECC single bit error Group1 79
MIBSPI4 - ECC single bit error Group1 80
MIBSPI5 - ECC single bit error Group1 81
DMA - ECC single bit error Group1 82
VIM - ECC single bit error Group1 83
EMIF 64-bit Bridge I/F ECC uncorrectable error Group1 84
EMIF 64-bit Bridge I/F ECC single bit error Group1 85
Reserved Group1 86
Reserved Group1 87
DMA - Register Soft Error Group1 88
L2FMC - Register Soft Error Group1 89
SYS - Register Soft Error Group1 90
SCM - Time-out Error Group1 91
CCM-R5F - Operating status Group1 92
Reserved Group1 93-95
Group2
Reserved Group2 0
Reserved Group2 1
CCM-R5F - CPU compare error Group2 2
Cortex-R5F Core - All fatal bus error events. [Commonly caused by improper or incomplete ECC values in Flash.] Group2 3
Event Reference Event Description EVNTBUSm bit
0x71 Bus ECC 48
Reserved Group2 4
Reserved Group2 5
Reserved Group2 6
L2RAMW - Uncorrectable error type B Group2 7
Reserved Group2 8
Reserved Group2 9
Reserved Group2 10
Reserved Group2 11
Reserved Group2 12
Reserved Group2 13
Reserved Group2 14
Reserved Group2 15
Reserved Group2 16
L2FMC - parity error

  • Mcmd parity error on Idle command
  • POM idle state parity error
  • Port A/B Idle state parity error

Group2 17
Reserved Group2 18
L2FMC - double bit ECC error-error due to implicit OTP reads Group2 19
Reserved Group2 20
EPC - Uncorrectable Error Group2 21
Reserved Group2 22
Reserved Group2 23
RTI_WWD_NMI Group2 24
CCM-R5F VIM compare error Group2 25
CPU1 AXIM Bus Monitor failure Group2 26
Reserved Group2 27
CCM-R5F - Power Domain monitor error Group2 28
Reserved Group2 29
Reserved Group2 30
Reserved Group2 31
Group3
Reserved Group3 0
eFuse Farm - autoload error Group3 1
Reserved Group3 2
L2RAMW - double bit ECC uncorrectable error Group3 3
Reserved Group3 4
Reserved Group3 5
Reserved Group3 6
Reserved Group3 7
Reserved Group3 8
Cortex-R5F Core - All fatal events (OR of: Group3 9
Event Reference Value Event Description EVNTBUSm Bit
0x60 Data Cache 33
0x61 Data Cache tag/dirty 34
Reserved Group3 10
Reserved Group3 11
CPU Interconnect Subsystem - Diagnostic Error Group3 12
L2FMC - uncorrectable error due to:
  • address parity/internal parity error
  • address tag
  • internal switch time-out
Group3 13
L2RAMW - Uncorrectable error Type A Group3 14
L2RAMW - Address/Control parity error Group3 15
Reserved Group3 16
Reserved Group3 17
Reserved Group3 18
Reserved Group3 19
Reserved Group3 20
Reserved Group3 21
Reserved Group3 22
Reserved Group3 23
Reserved Group3 24

6.20 Reset / Abort / Error Sources

Table 6-46 Reset/Abort/Error Sources

ERROR SOURCE SYSTEM MODE ERROR RESPONSE ESM HOOKUP
GROUP.CHANNEL
CPU TRANSACTIONS
Precise write error (NCNB/Strongly Ordered) User/Privilege Precise Abort (CPU) N/A
Precise read error (NCB/Device or Normal) User/Privilege Precise Abort (CPU) N/A
Imprecise write error (NCB/Device or Normal) User/Privilege Imprecise Abort (CPU) N/A
Illegal instruction User/Privilege Undefined Instruction Trap (CPU)(1) N/A
MPU access violation User/Privilege Abort (CPU) N/A
Correctable error User/Privilege ESM 1.4
Uncorrectable error User/Privilege ESM => NMI 2.21
LEVEL 2 SRAM
CPU Write ECC single error (correctable) User/Privilege ESM 1.26
ECC double bit error:
Read-Modify-Write (RMW) ECC double error
CPU Write ECC double error
User/Privilege Bus Error, ESM => nERROR 3.3
Uncorrectable error Type A:
Write SECDED malfunction error
Redundant address decode error
Read SECDED malfunction error
User/Privilege Bus Error, ESM => nERROR 3.14
Uncorrectable error type B:
Memory scrubbing SECDED malfunction error
Memory scrubbing Redundant address decode error
Memory scrubbing address/control parity error
Write data merged mux diagnostic error
Write SECDED malfunction diagnostic error
Read SECDED malfunction diagnostic error
Write ECC correctable and uncorrectable diagnostic error
Read ECC correctable and uncorrectable diagnostic error
Write data merged mux error
Redundant address decode diagnostic error
Command parity error on idle
User/Privilege ESM => NMI 2.7
Address/Control parity error User/Privilege Bus Error, ESM => nERROR 3.15
Level 2 RAM illegal address error Memory initialization error User/Privilege Bus Error N/A
FLASH
L2FMC correctable error - single bit ECC error for implicit OTP read User/Privilege ESM 1.6
L2FMC uncorrectable error - double bit ECC error for implicit OTP read User/Privilege ESM => NMI 2.19
L2FMC fatal uncorrectable error:
address parity error/internal parity error
address tag error
Internal switch time-out
User/Privilege Bus Error, ESM => nERROR 3.13
L2FMC parity error:
Mcmd parity error on Idle command
POM idle state parity error

Port A/B Idle state parity error
User/Privilege ESM => NMI 2.17
L2FMC nonfatal uncorrectable error:
Response error on POM
Response parity error on POM

Bank accesses during special operation (program/erase) by the FSM
Bank/Pump in sleep
Unimplemented special/unavailable space
User/Privilege Bus Error N/A
L2FMC register soft error. User/Privilege ESM 1.89
DMA TRANSACTIONS
Memory access permission violation User/Privilege ESM 1.2
Memory ECC uncorrectable error User/Privilege ESM 1.3
Transaction Error:
that is, Bus Parity Error
User/Privilege ESM 1.70
Memory ECC single bit error User/Privilege ESM 1.82
DMA register soft error User/Privilege ESM 1.88
DMA bus error User/Privilege ESM 1.20
EMIF_ECC
64-bit Bridge I/F ECC uncorrectable error User/Privilege ESM 1.84
64-bit Bridge I/F ECC single error User/Privilege ESM 1.85
HET TU1 (HTU1)
NCNB (Strongly Ordered) transaction with slave error response User/Privilege Interrupt => VIM N/A
External imprecise error (Illegal transaction with ok response) User/Privilege Interrupt => VIM N/A
Memory access permission violation User/Privilege ESM 1.9
Memory parity error User/Privilege ESM 1.8
HET TU2 (HTU2)
NCNB (Strongly Ordered) transaction with slave error response User/Privilege Interrupt => VIM N/A
External imprecise error (Illegal transaction with ok response) User/Privilege Interrupt => VIM N/A
Memory access permission violation User/Privilege ESM 1.9
Memory parity error User/Privilege ESM 1.8
N2HET1
Memory parity error User/Privilege ESM 1.7
N2HET2
Memory parity error User/Privilege ESM 1.34
MibSPI
MibSPI1 memory ECC uncorrectable error User/Privilege ESM 1.17
MibSPI2 memory ECC uncorrectable error User/Privilege ESM 1.49
MibSPI3 memory ECC uncorrectable error User/Privilege ESM 1.18
MibSPI4 memory ECC uncorrectable error User/Privilege ESM 1.50
MibSPI5 memory ECC uncorrectable error User/Privilege ESM 1.24
MibSPI1 memory ECC single error User/Privilege ESM 1.77
MibSPI2 memory ECC single error User/Privilege ESM 1.78
MibSPI3 memory ECC single error User/Privilege ESM 1.79
MibSPI4 memory ECC single error User/Privilege ESM 1.80
MibSPI5 memory ECC single error User/Privilege ESM 1.81
MibADC
MibADC1 Memory parity error User/Privilege ESM 1.19
MibADC2 Memory parity error User/Privilege ESM 1.1
DCAN
DCAN1 memory ECC uncorrectable error User/Privilege ESM 1.21
DCAN2 memory ECC uncorrectable error User/Privilege ESM 1.23
DCAN3 memory ECC uncorrectable error User/Privilege ESM 1.22
DCAN4 memory ECC uncorrectable error User/Privilege ESM 1.51
DCAN1 memory ECC single error User/Privilege ESM 1.73
DCAN2 memory ECC single error User/Privilege ESM 1.74
DCAN3 memory ECC single error User/Privilege ESM 1.75
DCAN4 memory ECC single error User/Privilege ESM 1.76
PLL
PLL1 slip error User/Privilege ESM 1.10
PLL2 slip error User/Privilege ESM 1.42
Clock Monitor
Clock monitor interrupt User/Privilege ESM 1.11
DCC
DCC1 error User/Privilege ESM 1.30
DCC2 error User/Privilege ESM 1.62
CCM-R5F
Self-test failure User/Privilege ESM 1.31
CPU Bus Compare failure User/Privilege ESM => NMI 2.2
VIM Bus Compare failure User/Privilege ESM => NMI 2.25
Power Domain Monitor failure User/Privilege ESM => NMI 2.28
CCM-R5F operating status (asserted when not in lockstep or CCM-R5F is in self-test mode) User/Privilege ESM 1.92
EPC (Error Profiling Controller)
Correctable Error User/Privilege ESM 1.4
Uncorrectable Error User/Privilege ESM => NMI 2.21
SCM (SCR Control module)
Time-out Error User/Privilege ESM 1.91
FlexRay
Memory ECC uncorrectable error User/Privilege ESM 1.12
Memory ECC single error User/Privilege ESM 1.72
FlexRay TU
NCNB (Strongly Ordered) transaction with slave error response User/Privilege Interrupt => VIM N/A
External imprecise error (Illegal transaction with ok response) User/Privilege Interrupt => VIM N/A
Memory access permission violation User/Privilege ESM 1.16
Memory ECC uncorrectable error User/Privilege ESM 1.14
Memory ECC single bit error User/Privilege ESM 1.71
Ethernet master interface
Any error reported by slave being accessed User/Privilege ESM 1.43
VIM
Memory ECC uncorrectable error User/Privilege ESM 1.15
Memory ECC single bit error User/Privilege ESM 1.83
Voltage Monitor
VMON out of voltage range N/A Reset N/A
Self-Test (LBIST)
Cortex-R5F CPU self-test (LBIST) error User/Privilege ESM 1.27
NHET Self-test (LBIST) error User/Privilege ESM 1.54
IOMM (terminal multiplexing control)
Mux configuration error User/Privilege ESM 1.37
Power Domain Control
Power Domain control access privilege error User Imprecise Abort (CPU) N/A
PSCON compare error User/Privilege ESM 1.38
PSCON self-test error User/Privilege ESM 1.39
Efuse farm
eFuse farm autoload error User/Privilege ESM 3.1
eFuse farm error User/Privilege ESM 1.40
eFuse farm self-test error User/Privilege ESM 1.41
WIndowed Watchdog
WWD Nonmaskable Interrupt Exception N/A ESM 2.24
Errors Reflected in the SYSESR Register
Power-Up Reset N/A Reset N/A
Oscillator fail / PLL slip(2) N/A Reset N/A
Watchdog exception N/A Reset N/A
CPUx Reset N/A Reset N/A
Software Reset N/A Reset N/A
External Reset N/A Reset N/A
Register Soft Error User/Privilege ESM 1.90
CPU Interconnect Subsystem
Diagnostic error User/Privilege ESM => Error terminal 3.12
Global error User/Privilege ESM 1.52
Global Parity error User/Privilege ESM 1.53
NMPU for EMAC
MPU Access violation error User/Privilege ESM 1.55
NMPU for PS_SCR_S
MPU Access violation error User/Privilege ESM 1.61
NMPU for DMA Port A
MPU Access violation error User/Privilege ESM 1.69
PCR1
MasterID filtering MPU Access violation error User/Privilege Bus Error N/A
PCR2
MasterID filtering MPU Access violation error User/Privilege Bus Error N/A
PCR3
MasterID filtering MPU Access violation error User/Privilege Bus Error N/A
(1) The Undefined Instruction TRAP is not detectable outside the CPU. The trap is taken only if the instruction reaches the execute stage of the CPU.
(2) Oscillator fail/PLL slip can be configured in the system register (SYS.PLLCTL1) to generate a reset.

6.21 Digital Windowed Watchdog

This device includes a Digital Windowed Watchdog (DWWD) module that protects against runaway code execution (see Figure 6-22).

The DWWD module allows the application to configure the time window within which the DWWD module expects the application to service the watchdog. A watchdog violation occurs if the application services the watchdog outside of this window, or fails to service the watchdog at all. The application can choose to generate a system reset or a nonmaskable interrupt to the CPU in case of a watchdog violation.

The watchdog is disabled by default and must be enabled by the application. Once enabled, the watchdog can only be disabled upon a system reset.

TMS570LC4357 rti_dwwd.gif Figure 6-22 Digital Windowed Watchdog Example

6.22 Debug Subsystem

6.22.1 Block Diagram

The device contains an ICEPICK module (version C) to allow JTAG access to the scan chains (see Figure 6-23).

TMS570LC4357 debug_subsystem_LC_spns195.gif Figure 6-23 Debug Subsystem Block Diagram

6.22.2 Debug Components Memory Map

Table 6-47 Debug Components Memory Map

MODULE
NAME
FRAME CHIP
SELECT
FRAME ADDRESS RANGE FRAME
SIZE
ACTUAL
SIZE
RESPONSE FOR ACCESS
TO UNIMPLEMENTED LOCATIONS
IN FRAME
START END
CoreSight Debug ROM CSCS0 0xFFA0_0000 0xFFA0_0FFF 4KB 4KB Reads return zeros, writes have no effect
Cortex-R5F Debug CSCS1 0xFFA0_1000 0xFFA0_1FFF 4KB 4KB Reads return zeros, writes have no effect
ETM-R5 CSCS2 0xFFA0_2000 0xFFA0_2FFF 4KB 4KB Reads return zeros, writes have no effect
CoreSight TPIU CSCS3 0xFFA0_3000 0xFFA0_3FFF 4KB 4KB Reads return zeros, writes have no effect
POM CSCS4 0xFFA0_4000 0xFFA0_4FFF 4KB 4KB Reads return zeros, writes have no effect
CTI1 CSCS7 0xFFA0_7000 0xFFA0_7FFF 4KB 4KB Reads return zeros, writes have no effect
CTI3 CSCS9 0xFFA0_9000 0xFFA0_9FFF 4KB 4KB Reads return zeros, writes have no effect
CTI4 CSCS10 0xFFA0_A000 0xFFA0_AFFF 4KB 4KB Reads return zeros, writes have no effect
CSTF CSCS11 0xFFA0_B000 0xFFA0_BFFF 4KB 4KB Reads return zeros, writes have no effect

6.22.3 Embedded Cross Trigger

The Embedded Cross Trigger (ECT) is a modular component that supports the interaction and synchronization of multiple triggering events within a SoC.

The ECT consists of two modules:

  • A (Cross Trigger Interface) CTI. The CTI provides the interface between a component or subsystem and the Cross Trigger Matrix (CTM).
  • A CTM. The CTM combines the trigger requests generated from CTIs and broadcasts them to all CTIs as channel triggers. This enables subsystems to interact, cross trigger, with one another.
TMS570LC4357 cti_ctm_integration_f1_spns195.gif Figure 6-24 CTI/CTM Integration
TMS570LC4357 cti1_mapping_LC_spns195.gif Figure 6-25 CTI1 Mapping

NOTE

ETM-R5, Cortex-R5F and CTI1 run at same frequency.

Table 6-48 CTI1 Mapping

CTI TRIGGER Module Signal
Trigger Input 0 From Cortex-R5F DBTRIGGER
Trigger Input 1 From Cortex-R5F nPMUIRQ
Trigger Input 2 From ETM-R5 EXTOUT[0]
Trigger Input 3 From ETM-R5 EXTOUT[1]
Trigger Input 4 From Cortex-R5F COMMRX
Trigger Input 5 From Cortex-R5F COMMTX
Trigger Input 6 From ETM-R5 TRIGGER
Trigger Input 7 From Cortex-R5F DBTRIGGER
Trigger Output 0 To Cortex-R5F EDBGRQ
Trigger Output 1 To ETM-R5 EXTIN[0]
Trigger Output 2 To ETM-R5 EXTIN[1]
Trigger Output 3 To Cortex-R5F nIRQ
Trigger Output 4 Reserved
Trigger Output 5 Reserved
Trigger Output 6 Reserved
Trigger Output 7 To Cortex-R5F DBGRESTARTED
TMS570LC4357 cti3_mapping_spns195.gif Figure 6-26 CTI3 Mapping

NOTE

TPIU and CTI3 run at different frequencies.

Table 6-49 CTI3 Mapping

CTI TRIGGER Module Signal
Trigger Input 0 Reserved
Trigger Input 1 Reserved
Trigger Input 2 Reserved
Trigger Input 3 Reserved
Trigger Input 4 Reserved
Trigger Input 5 Reserved
Trigger Input 6 Reserved
Trigger Input 7 Reserved
Trigger Output 0 To TPIU TRIGIN
Trigger Output 1 To TPIU FLUSHIN
Trigger Output 2 Reserved
Trigger Output 3 Reserved
Trigger Output 4 Reserved
Trigger Output 5 Reserved
Trigger Output 6 Reserved
Trigger Output 7 Reserved
TMS570LC4357 cti4_mapping_spns195.gif Figure 6-27 CTI4 Mapping

Table 6-50 CTI4 Mapping

CTI TRIGGER Module Signal
Trigger Input 0 From DMA_DBGREQ
Trigger Input 1 From N2HET1_DBGREQ
Trigger Input 2 From N2HET2_DBGREQ
Trigger Input 3 From HTU1_DBGREQ
Trigger Input 4 From HTU2_DBGREQ
Trigger Input 5 From DMA_DBGREQ
Trigger Input 6 From N2HET1_DBGREQ or HTU1_DBGREQ
Trigger Input 7 From N2HET2_DBGREQ or HTU2_DBGREQ
Trigger Output 0 To SYS_MODULE_TRIGGER
Trigger Output 1 To USER_PERIPHERAL_TRIGGER1
Trigger Output 2 To USER_PERIPHERAL_TRIGGER2
Trigger Output 3 To USER_PERIPHERAL_TRIGGER3
Trigger Output 4 To IcePick Debug_Attention
Trigger Output 5 Reserved
Trigger Output 6 Reserved
Trigger Output 7 Reserved

Table 6-51 Peripheral Suspend Generation

TRIGGER OUTPUT MODULE SIGNAL CONNECTED DESCRIPTION
SYS_MODULE_TRIGGER L2FMC_CPU_EMUSUSP L2FMC Wrapper Suspend
CCM_R5_CPU_EMUSUSP CCM_R5 module suspend
CRC_CPU_EMUSUSP CRC1 / CRC2 module suspend
SYS_CPU_EMUSUSP SYS module Suspend
USER_PERIPHERAL_TRIGGER1 DMA_SUSPEND DMA Suspend
RTI_CPU_SUSPEND RTI1 / RTI2 Suspend
AWM_CPU_SUSPEND AWM1 / AWM2 Suspend
HTU_CPU_EMUSUSP HTU1 / HTU2 Suspend
SCI_CPU_EMUSUSP SCI3 / SCI4 Suspend
LIN_CPU_EMUSUSP LIN1 / LIN2 Suspend
I2C_CPU_EMUSUSP I2C1 / I2C2 Suspend
EMAC_CPU_EMUSUSP EMAC Suspend
EQEP_CPU_EMUSUSP EQEP Suspend
ECAP_CPU_EMUSUSP ECAP Suspend
DMM_CPU_EMUSUSP DMM Suspend
  DCC_CPU_EMUSUSP DCC1 / DCC2 Suspend
USER_PERIPHERAL_TRIGGER2 DCAN_CPU_EMUSUSP DCAN1 / DCAN2 / DCAN3 / DCAN4 Suspend
USER_PERIPHERAL_TRIGGER3 ePWM_CPU_EMUSUSP ePWM1..7 Trip Zone TZ6n and ePWM1..7 Suspend

6.22.4 JTAG Identification Code

The JTAG ID code for this device is the same as the device ICEPick Identification Code. For the JTAG ID Code per silicon revision, see Table 6-52.

Table 6-52 JTAG ID Code

SILICON REVISION ID
Rev A 0x0B95A02F
Rev B 0x1B95A02F

6.22.5 Debug ROM

The Debug ROM stores the location of the components on the Debug APB bus (see Table 6-53).

Table 6-53 Debug ROM Table

ADDRESS DESCRIPTION VALUE
0x000 Cortex-R5F 0x00001003
0x004 ETM-R5 0x00002003
0x008 TPIU 0x00003003
0x00C POM 0x00004003
0x018 CTI1 0x00007003
0x020 CTI3 0x00009003
0x024 CTI4 0x0000A003
0x028 CSTF 0x0000B003
0x02C end of table 0x00000000

6.22.6 JTAG Scan Interface Timings

Table 6-54 JTAG Scan Interface Timing(1)

NO. PARAMETER MIN MAX UNIT
fTCK TCK frequency (at HCLKmax) 12 MHz
fRTCK RTCK frequency (at TCKmax and HCLKmax) 10 MHz
1 td(TCK -RTCK) Delay time, TCK to RTCK 24 ns
2 tsu(TDI/TMS - RTCKr) Setup time, TDI, TMS before RTCK rise (RTCKr) 26 ns
3 th(RTCKr -TDI/TMS) Hold time, TDI, TMS after RTCKr 0 ns
4 th(RTCKr -TDO) Hold time, TDO after RTCKf 0 ns
5 td(TCKf -TDO) Delay time, TDO valid after RTCK fall (RTCKf) 12 ns
(1) Timings for TDO are specified for a maximum of 50-pF load on TDO.
TMS570LC4357 jtag_timing_pns160.gif Figure 6-28 JTAG Timing

6.22.7 Advanced JTAG Security Module

This device includes a an Advanced JTAG Security Module (AJSM) module. The AJSM provides maximum security to the memory content of the device by letting users secure the device after programming.

TMS570LC4357 ajsm_unlock_pns160.gif Figure 6-29 AJSM Unlock

The device is unsecure by default by virtue of a 128-bit visible unlock code programmed in the OTP address 0xF0000000. The OTP contents are XOR-ed with the contents of the "Unlock By Scan" register. The outputs of these XOR gates are again combined with a set of secret internal tie-offs. The output of this combinational logic is compared against a secret hard-wired 128-bit value. A match results in the UNLOCK signal being asserted, so that the device is now unsecure.

A user can secure the device by changing at least 1 bit in the visible unlock code from 1 to 0. Changing a 0 to 1 is not possible because the visible unlock code is stored in the One Time Programmable (OTP) flash region. Also, changing all 128 bits to zeros is not a valid condition and will permanently secure the device.

Once secured, a user can unsecure the device by scanning an appropriate value into the "Unlock By Scan" register of the AJSM. The value to be scanned is such that the XOR of the OTP contents and the Unlock-By-Scan register contents results in the original visible unlock code.

The Unlock-By-Scan register is reset only upon asserting power-on reset (nPORRST).

A secure device only permits JTAG accesses to the AJSM scan chain through the Secondary Tap 2 of the ICEPick module. All other secondary taps, test taps, and the boundary scan interface are not accessible in this state.

6.22.8 Embedded Trace Macrocell (ETM-R5)

The device contains a ETM-R5 module with a 32-bit internal data port. The ETM-R5 module is connected to a Trace Port Interface Unit (TPIU) with a 32-bit data bus. The TPIU provides a 35-bit (32-bit data, 3-bit control) external interface for trace. The ETM-R5 is CoreSight compliant and follows the ETM v3 specification. For more details, see the ARM CoreSight ETM-R5 TRM specification.

6.22.8.1 ETM TRACECLKIN Selection

The ETM clock source can be selected as either VCLK or the external ETMTRACECLKIN terminal. The selection is chosen by the EXTCTLOUT[1:0] control bits of the TPIU (default is '00'). The address of this register is the TPIU base address + 0x404.

Before the user begins accessing TPIU registers, the TPIU should be unlocked through the CoreSight key and 1 or 2 written to this register.

Table 6-55 TPIU / TRACECLKIN Selection

EXTCTLOUT[1:0] TPIU/TRACECLKIN
00 Tied-zero
01 VCLK
10 ETMTRACECLKIN
11 Tied-zero

6.22.8.2 Timing Specifications

TMS570LC4357 etmtraceclkout_timing_pns160.gif Figure 6-30 ETMTRACECLKOUT Timing

Table 6-56 ETMTRACECLK Timing

PARAMETER MIN MAX UNIT
tcyc(ETM) Clock period 18.18 ns
tl(ETM) Low pulse width 6 ns
th(ETM) High pulse width 6 ns
tr(ETM) Clock and data rise time 3 ns
tf(ETM) Clock and data fall time 3 ns
TMS570LC4357 etmdata_timing_pns160.gif Figure 6-31 ETMDATA Timing

Table 6-57 ETMDATA Timing

PARAMETER MIN MAX UNIT
tsu(ETM) Data setup time 2.5 ns
th(ETM) Data hold time 1.5 ns

NOTE

The ETMTRACECLK and ETMDATA timing is based on a 15-pF load and for ambient temperatures lower than 85°C.

6.22.9 RAM Trace Port (RTP)

The RTP provides the ability to datalog the RAM contents of the TMS570 devices or accesses to peripherals without program intrusion. It can trace all data write or read accesses to internal RAM. In addition, it provides the capability to directly transfer data to a FIFO to support a CPU-controlled transmission of the data. The trace data is transmitted over a dedicated external interface.

6.22.9.1 RTP Features

The RTP offers the following features:

  • Two modes of operation - Trace Mode and Direct Data Mode
    • Trace Mode
      • Nonintrusive data trace on write or read operation
      • Visibility of RAM content at any time on external capture hardware
      • Trace of peripheral accesses
      • 2 configurable trace regions for each RAM module to limit amount of data to be traced
      • FIFO to store data and address of data of multiple read/write operations
      • Trace of CPU and/or DMA accesses with indication of the master in the transmitted data packet
    • Direct Data Mode
      • Directly write data with the CPU or trace read operations to a FIFO, without transmitting header and address information
  • Dedicated synchronous interface to transmit data to external devices
  • Free-running clock generation or clock stop mode between transmissions
  • Up to 100 Mbps terminal transfer rate for transmitting data
  • Pins not used in functional mode can be used as GIOs

6.22.9.2 Timing Specifications

TMS570LC4357 rtpclk_timing_pns160.gif Figure 6-32 RTPCLK Timing

Table 6-58 RTPCLK Timing

PARAMETER MIN MIN UNIT
tcyc(RTP) Clock period 9.09 (= 110 MHz) ns
th(RTP) High pulse width ((tcyc(RTP))/2) - ((tr+tf)/2) ns
tl(RTP) Low pulse width ((tcyc(RTP))/2) - ((tr+tf)/2) ns
TMS570LC4357 rtpdata_timing_pns160.gif Figure 6-33 RTPDATA Timing

Table 6-59 RTPDATA Timing

PARAMETER MIN MAX UNIT
tdsu(RTP) Data setup time 3 ns
tdh(RTP) Data hold time 1 ns
tssu(RTP) SYNC setup time 3 ns
tsh(RTP) SYNC hold time 1 ns
TMS570LC4357 rtp_nena_timing_pns160.gif Figure 6-34 RTPnENA timing

Table 6-60 RTPnENA timing

PARAMETER MIN MAX UNIT
tdis(RTP) Disable time, time RTPnENA must go high before what would be the next RTPSYNC, to ensure delaying the next packet 3tc(HCLK) + tr(RTPSYNC) + 12 ns
tena(RTP) Enable time, time after RTPnENA goes low before a packet that has been halted, resumes 4tc(HCLK) + tr(RTPSYNC) 5tc(HCLK) + tr(RTPSYNC) + 12 ns

6.22.10 Data Modification Module (DMM)

The Data Modification Module (DMM) provides the capability to modify data in the entire 4GB address space of the TMS570devices from an external peripheral, with minimal interruption of the application.

6.22.10.1 DMM Features

The DMM module has the following features:

  • Acts as a bus master, enabling direct writes to the 4GB address space without CPU intervention
  • Writes to memory locations specified in the received packet (leverages packets defined by trace mode of the RAM Trace Port (RTP) module
  • Writes received data to consecutive addresses, which are specified by the DMM module (leverages packets defined by direct data mode of the RTP module)
  • Configurable port width (1-, 2-, 4-, 8-, 16-pins)
  • Up to 100 Mbps terminal data rate
  • Unused pins configurable as GIO pins

6.22.10.2 Timing Specifications

Table 6-61 DMMCLK Timing (see Figure 6-35)

PARAMETER MIN MAX UNIT
tcyc(DMM) Cycle time, DMMCLK clock period 9.09 ns
th(DMM) High-pulse width ((tcyc(DMM))/2) - ((tr+tf)/2) ns
tl(DMM) Low-pulse width ((tcyc(DMM))/2) - ((tr+tf)/2) ns
TMS570LC4357 dmmclk_timing_pns160.gif Figure 6-35 DMMCLK Timing

Table 6-62 DMMDATA Timing (see Figure 6-36)

PARAMETER MIN MAX UNIT
tssu(DMM) Setup time, SYNC active before clk falling edge 2 ns
tsh(DMM) Hold time, clk falling edge after SYNC deactive 3 ns
tdsu(DMM) Setup time, DATA before clk falling edge 2 ns
tdh(DMM) Hold time, clk falling edge after DATA hold time 3 ns
TMS570LC4357 dmmdata_timing_pns160.gif Figure 6-36 DMMDATA Timing

Figure 6-37 shows a case with 1 DMM packet per 2 DMMCLK cycles (Mode = Direct Data Mode, data width = 8, portwidth = 4) where none of the packets received by the DMM are sent out, leading to filling up of the internal buffers. The DMMnENA signal is shown asserted, after the first two packets have been received and synchronized to the HCLK domain. Here, the DMM has the capacity to accept packets D4x, D5x, D6x, D7x. Packet D8 would result in an overflow. Once DMMnENA is asserted, the DMM expects to stop receiving packets after 4 HCLK cycles; once DMMnENA is deasserted, the DMM can handle packets immediately (after 0 HCLK cycles).

TMS570LC4357 dmm_nena_timing_pns160.gif Figure 6-37 DMMnENA Timing

6.22.11 Boundary Scan Chain

The device supports BSDL-compliant boundary scan for testing pin-to-pin compatibility. The boundary scan chain is connected to the Boundary Scan Interface of the ICEPICK module (see Figure 6-38).

TMS570LC4357 boundary_scan_implementation _pns160.gif Figure 6-38 Boundary Scan Implementation (Conceptual Diagram)

Data is serially shifted into all boundary-scan buffers through TDI, and out through TDO.