SBOS383D December   2006  – December 2016 TMP411

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
  8. 8 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Series Resistance Cancellation
      2. 9.3.2 Differential Input Capacitance
      3. 9.3.3 Temperature Measurement Data
      4. 9.3.4 THERM (Pin 4) and ALERTor THERM2 (Pin 6)
      5. 9.3.5 Sensor Fault
      6. 9.3.6 Undervoltage Lockout
      7. 9.3.7 Filtering
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode (SD)
      2. 9.4.2 One-Shot Conversion
    5. 9.5 Programming
      1. 9.5.1  Serial Interface
      2. 9.5.2  Bus Overview
      3. 9.5.3  Timing Diagrams
      4. 9.5.4  Serial Bus Address
      5. 9.5.5  Read and Write Operations
      6. 9.5.6  Timeout Function
      7. 9.5.7  High-Speed Mode
      8. 9.5.8  General Call Reset
      9. 9.5.9  Software Reset
      10. 9.5.10 SMBus Alert Function
    6. 9.6 Register Map
      1. 9.6.1  Register Information
      2. 9.6.2  Pointer Register
      3. 9.6.3  Temperature Registers
      4. 9.6.4  Limit Registers
      5. 9.6.5  Status Register
      6. 9.6.6  Configuration Register
      7. 9.6.7  Resolution Register
      8. 9.6.8  Conversion Rate Register
      9. 9.6.9  N-Factor Correction Register
      10. 9.6.10 Minimum and Maximum Registers
      11. 9.6.11 Consecutive Alert Register
      12. 9.6.12 THERM Hysteresis Register
      13. 9.6.13 Remote Temperature Offset Register
      14. 9.6.14 Identification Registers
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

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8 Typical Characteristics

at TA = 25°C and VS = 5 V (unless otherwise noted)
TMP411 Fig_1_SBOS383D.gif
Figure 1. Remote Temperature Error vs TMP411 Ambient Temperature
TMP411 Fig_3_SBOS383D.gif Figure 3. Remote Temperature Error vs Leakage Resistance
TMP411 Fig_5_SBOS383D.gif
Figure 5. Remote Temperature Error vs Series Resistance (GND Collector-Connected Transistor, 2N3906 PNP)
TMP411 Fig_7_SBOS383D.gif
Figure 7. Temperature Error vs Power-Supply Noise Frequency
TMP411 Fig_9_SBOS383D.gif Figure 9. Shutdown Quiescent Current vs SCL Clock Frequency
TMP411 Fig_2_SBOS383D.gif
Figure 2. Local Temperature Error vs TMP411 Ambient Temperature
TMP411 Fig_4_SBOS383D.gif Figure 4. Remote Temperature Error vs Series Resistance (Diode-Connected Transistor, 2N3906 PNP)
TMP411 Fig_6_SBOS383D.gif
Figure 6. Remote Temperature Error vs Differential Capacitance
TMP411 Fig_8_SBOS383D.gif
Figure 8. Quiescent Current vs Conversion Rate
TMP411 Fig_10_SBOS383D.gif Figure 10. Shutdown Quiescent Current vs Supply Voltage