SBOS371B August   2006  – October 2014 TMP401

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: V+ = 3 V to 5.5 V
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Standard and Extended Temperature Measurement Range
      2. 7.3.2 Remote Sensing
    4. 7.4 Device Functional Modes
      1. 7.4.1 SMBus Alert Function
      2. 7.4.2 THERM (Pin 4) and ALERT/THERM2 (Pin 6)
      3. 7.4.3 Sensor Fault
      4. 7.4.4 High-Speed Mode
      5. 7.4.5 Shutdown Mode (SD)
      6. 7.4.6 One-Shot Conversion
      7. 7.4.7 General-Call Reset
    5. 7.5 Programming
      1. 7.5.1 Bus Overview
      2. 7.5.2 Serial Interface
      3. 7.5.3 Serial Bus Address
      4. 7.5.4 Read and Write Operations
      5. 7.5.5 Timeout Function
      6. 7.5.6 Timing Diagrams
    6. 7.6 Register Maps
      1. 7.6.1  Pointer Register
      2. 7.6.2  Temperature Registers
      3. 7.6.3  Limit Registers
      4. 7.6.4  Status Register
      5. 7.6.5  Configuration Register
      6. 7.6.6  Resolution Register
      7. 7.6.7  Conversion Rate Register
      8. 7.6.8  Identification Registers
      9. 7.6.9  Consecutive Alert Register
      10. 7.6.10 THERM Hysteresis Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Filtering
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Series Resistance Cancellation
        2. 8.2.3.2 Differential Input Capacitance
  9. 9 Power-Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Measurement Accuracy and Thermal Considerations
      2. 10.1.2 Layout Considerations
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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11 Device and Documentation Support

11.1 Trademarks

All other trademarks are the property of their respective owners.

11.2 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.3 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.