ZHCSIX3I July   2009  – December 2018 TMP303

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      TMP303 功能方框图
      2.      -20rep%#176;C 至 125°C 时的典型跳匣阈值精度
  4. 修订历史记录
  5. 器件选项
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 HYSTSET0, HYSTSET1 and SOH Functionality
      2. 8.3.2 TMP303 Power Up and Timing
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 TMP303 Typical Configuration
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 TMP303 With Switches
      3. 9.2.3 Simple Fan Controller
      4. 9.2.4 Wireless Fixed Temperature Heat Detector
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

TMP303 Typical Configuration

Figure 13 shows the typical circuit configuration for the TMP303 family of devices. These devices have preprogrammed trip-points. Select the TMP303 device that meets the application temperature trip requirement.

TMP303 TMP303_TYP_APP_SCH.gifFigure 13. TMP303 Typical Application Configuration Schematic