ZHCSAV1A April   2013  – September 2019 TMP108

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      方框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Diagrams
      1. 6.6.1 Two-Wire Timing Diagrams
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Serial Interface
      2. 7.3.2 Serial Bus Address
      3. 7.3.3 Bus Overview
      4. 7.3.4 Writing and Reading Operation
      5. 7.3.5 Slave Mode Operations
        1. 7.3.5.1 Slave Receiver Mode:
        2. 7.3.5.2 Slave Transmitter Mode:
      6. 7.3.6 SMBus Alert Function
      7. 7.3.7 General Call
      8. 7.3.8 High-Speed (Hs) Mode
      9. 7.3.9 Timeout Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (M1 = 0, M0 = 0)
      2. 7.4.2 One-Shot Mode (M1 = 0, M0 = 1)
      3. 7.4.3 Continuous Conversion Mode (M1 = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Hysteresis Control (HYS1 and HYS0)
        2. 7.5.3.2 Polarity (POL)
        3. 7.5.3.3 Thermostat Mode (TM)
        4. 7.5.3.4 Temperature Watchdog Flags (FL and FH)
        5. 7.5.3.5 Conversion Rate
      4. 7.5.4 High- and Low-Limit Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11.4 静电放电警告

esds-image

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。