ZHCSKS3D February   2020  – May 2025 TLV761

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Dropout Voltage
      2. 6.3.2 Foldback Current Limit
      3. 6.3.3 Undervoltage Lockout (UVLO)
      4. 6.3.4 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
      2. 7.1.2 Input and Output Capacitor Requirements
      3. 7.1.3 Reverse Current
      4. 7.1.4 Power Dissipation (PD)
      5. 7.1.5 Estimating Junction Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

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5.6 Typical Characteristics

at operating temperature TJ = 25°C, VIN = VOUT(NOM) + 1.5 V or 2.5 V (whichever is greater), IOUT = 10 mA, CIN = 1.0 µF, and COUT = 1.0 µF (unless otherwise noted)

TLV761 VOUT Accuracy vs IOUT
For VIN ≥ 3.0 V
Figure 5-1 VOUT Accuracy vs IOUT
TLV761 IQ vs Temperature
IOUT = 0 mA
Figure 5-3 IQ vs Temperature
TLV761 IGND vs IOUT
For VIN ≥ 3.0 V
Figure 5-5 IGND vs IOUT
TLV761 IOUT Transient From 1 mA to 1 A
VIN = 5 V, VOUT = 3.3 V, ramp rate = 0.5 A/µs
Figure 5-7 IOUT Transient From 1 mA to 1 A
TLV761 VIN Transient in Dropout From 4 V to 13 V
VIN = 5 V VOUT = 3.3 V, IOUT = 1 A, VIN ramp rate = 0.6 V/µs
Figure 5-9 VIN Transient in Dropout From 4 V to 13 V
TLV761 VDO vs VIN
IOUT = 1.0 A
Figure 5-11 VDO vs VIN
TLV761 UVLO Thresholds vs Temperature
 
Figure 5-13 UVLO Thresholds vs Temperature
TLV761 Foldback Current Limit vs Temperature
For VIN ≥ 3.0 V
Figure 5-15 Foldback Current Limit vs Temperature
TLV761 PSRR vs IOUT
VOUT = 1.8 V, VIN = 3.3 V
Figure 5-17 PSRR vs IOUT
TLV761 Output Noise (Vn) vs VOUT
IOUT = 0.1 A, RMS noise BW = 10 Hz to 100 kHz
Figure 5-19 Output Noise (Vn) vs VOUT
TLV761 VOUT Accuracy vs VIN
IOUT = 10 mA
Figure 5-2 VOUT Accuracy vs VIN
TLV761 IQ Increase Below Minimum VIN
IOUT = 0 mA
Figure 5-4 IQ Increase Below Minimum VIN
TLV761 IOUT Transient From 0 mA to 100 mA
VIN = 5 V, VOUT = 3.3 V, ramp rate = 0.4 A/µs
Figure 5-6 IOUT Transient From 0 mA to 100 mA
TLV761 IOUT Transient From 250 mA to 850 mA
VIN = 5 V, VOUT = 3.3 V, ramp rate = 0.8 A/µs
Figure 5-8 IOUT Transient From 250 mA to 850 mA
TLV761 VIN Transient From 5 V to 16 V
VOUT = 3.3 V, IOUT = 33 µA, VIN ramp rate = 1.6 V/µs
Figure 5-10 VIN Transient From 5 V to 16 V
TLV761 VDO vs VIN
IOUT = 0.8 A
Figure 5-12 VDO vs VIN
TLV761 VDO vs IOUT
For VIN ≥ 3.0 V
Figure 5-14 VDO vs IOUT
TLV761 Foldback Current Limit vs Temperature
 
Figure 5-16 Foldback Current Limit vs Temperature
TLV761 PSRR vs VIN
VOUT = 1.8 V, IOUT = 0.55 A
Figure 5-18 PSRR vs VIN
TLV761 Inrush Current With 22 µF at COUT
IOUT = 0.1 A, COUT = 22 µF
Figure 5-20 Inrush Current With 22 µF at COUT