ZHCSHZ4D
April 2018 – October 2023
TLV758P
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Undervoltage Lockout (UVLO)
6.3.2
Shutdown
6.3.3
Foldback Current Limit
6.3.4
Thermal Shutdown
6.4
Device Functional Modes
6.4.1
Device Functional Mode Comparison
6.4.2
Normal Operation
6.4.3
Dropout Operation
6.4.4
Disabled
7
Application and Implementation
7.1
Application Information
7.1.1
Adjustable Device Feedback Resistors
7.1.2
Input and Output Capacitor Selection
7.1.3
Dropout Voltage
7.1.4
Exiting Dropout
7.1.5
Reverse Current
7.1.6
Power Dissipation (PD)
7.1.7
Feed-Forward Capacitor (CFF)
7.1.8
Start-Up Sequencing
7.2
Typical Application
7.2.1
Design Requirements
7.2.2
Detailed Design Procedure
7.2.2.1
Input Current
7.2.2.2
Thermal Dissipation
7.2.3
Application Curve
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Examples
8
Device and Documentation Support
8.1
Documentation Support
8.1.1
Device Nomenclature
8.1.2
Related Documentation
8.2
接收文档更新通知
8.3
支持资源
8.4
Trademarks
8.5
静电放电警告
8.6
术语表
9
Revision History
10
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DRV|6
MPDS216E
DBV|5
MPDS018S
散热焊盘机械数据 (封装 | 引脚)
DRV|6
QFND087M
订购信息
zhcshz4d_oa
zhcshz4d_pm
8.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。