SBVS148D October   2010  – January 2015 TLV704

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Regulator Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation and Junction Temperature
    4. 10.4 Estimating Junction Temperature
    5. 10.5 Package Mounting
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Module
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
  • DBV|5
散热焊盘机械数据 (封装 | 引脚)
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6 Specifications

6.1 Absolute Maximum Ratings

Over operating junction temperature range, unless otherwise noted(1).
MIN MAX UNIT
Voltage(2) IN –0.3 24 V
Current source OUT Internally limited
Temperature Operating junction, TJ –40 150 °C
Storage range, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2) All voltages are with respect to network ground terminal.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Input voltage 2.5 24 V
IOUT Output current 0 150 mA
TJ Operating junction temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TLV704 UNIT
DBV
5 PINS
RθJA Junction-to-ambient thermal resistance 213.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 110.9
RθJB Junction-to-board thermal resistance 97.4
ψJT Junction-to-top characterization parameter 22.0
ψJB Junction-to-board characterization parameter 78.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

All values are at TJ = 25°C, VIN = VOUT(nom) + 1 V, IOUT = 1 mA, and COUT = 1 µF, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage range 24 V
Output voltage range 1.2 5 V
VOUT DC output accuracy –2% 2%
ΔVO(ΔVI) Line regulation V(nom) + 1 V < VIN < 24 V 20 50 mV
ΔVO(ΔIO) Load regulation VOUT ≤ 3.3 V 0 mA < IOUT < 10 mA 10 mV
0 mA < IOUT < 50 mA 25
0 mA < IOUT < 100 mA 33 50
VOUT ≥ 3.3 V 0 mA < IOUT < 10 mA 7
0 mA < IOUT < 50 mA 35
0 mA < IOUT < 100 mA 50 75
VDO Dropout voltage(1) IOUT = 10 mA 75 mV
IOUT = 50 mA 400
IOUT = 100 mA 850 1100
ICL Output current limit VOUT = 0 V 160 1000 mA
IGND Ground pin current IOUT = 0 mA 3.2 4.5 µA
IOUT = 100 mA 3.4 5.5
PSRR Power-supply rejection ratio f = 100 kHz, COUT = 10 µF 60 dB
TJ Operating junction temperature –40 125 °C
(1) VIN = VOUT(nom) – 0.1 V.

6.6 Typical Characteristics

tc_line_reg_bvs148.gif
Figure 1. Line Regulation
tc_vo_ta_bvs148.gif
Figure 3. Output Voltage vs Junction Temperature
tc_vdo_iout_new_bvs148.gif
Figure 5. Dropout Voltage vs Output Current
tc_ignd_vin_bvs148.gif
Figure 7. Ground Pin Current vs Input Voltage
tc_ilim_tj_new_bvs148.gif
Figure 9. Current Limit vs Junction Temperature
tc_psrr_fqcy_bvs148.gif
Figure 11. Power-Supply Ripple Rejection vs Frequency
tc_line_tr_bvs148.gif
Figure 13. Line Transient Response
tc_load_reg_33v_bvs148.gif
Figure 2. Load Regulation (VOUT = 3.3 V)
tc_vdo_vin_10ma_new_bvs148.gif
Figure 4. Dropout Voltage vs Input Voltage (TLV70433)
tc_ignd_tj_bvs148.gif
Figure 6. Ground Current vs Junction Temperature
tc_ignd_iout_bvs148.gif
Figure 8. Ground Pin Current vs Load Current
tc_output_snd_fqcy_bvs148.gif
Figure 10. Output Spectral Noise Density vs Frequency
tc_pupd_bvs148.gif
Figure 12. Power Up/Power Down
tc_load_tr_bvs148.gif
Figure 14. Load Transient Response