ZHCSPJ4F
September 2010 – March 2023
TLV704
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
Thermal Information
6.4
Electrical Characteristics
6.5
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Wide Supply Range
7.3.2
Low Quiescent Current
7.3.3
Dropout Voltage (VDO)
7.3.4
Current Limit
7.4
Device Functional Modes
7.4.1
Normal Operation
7.4.2
Dropout Operation
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
External Capacitor Requirements
8.2.2.2
Input and Output Capacitor Requirements
8.2.2.3
Reverse Current
8.2.2.4
Power Dissipation (PD)
8.2.2.5
Estimating Junction Temperature
8.2.3
应用曲线
8.3
Best Design Practices
8.4
Power Supply Recommendations
8.5
Layout
8.5.1
Layout Guidelines
8.5.1.1
Power Dissipation
8.5.2
Layout Example
9
Device and Documentation Support
9.1
Device Support
9.1.1
Development Support
9.1.1.1
Evaluation Module
9.1.2
Device Nomenclature
9.2
Documentation Support
9.2.1
Related Documentation
9.3
接收文档更新通知
9.4
支持资源
9.5
Trademarks
9.6
静电放电警告
9.7
术语表
10
Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
DBV|5
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcspj4f_oa
zhcspj4f_pm
8.2.3
应用曲线
图 8-3
旧芯片的加电、断电
图 8-5
旧芯片的线路瞬态响应
图 8-7
旧芯片的负载瞬态响应
图 8-9
新芯片的线路瞬态响应
图 8-4
新芯片的加电、断电
图 8-6
新芯片的线路瞬态响应
图 8-8
新芯片的负载瞬态响应
图 8-10
新芯片的压降退出瞬态响应