ZHCS759E February   2012  – September 2016 TLV62150 , TLV62150A

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable / Shutdown (EN)
      2. 8.3.2 Soft Start / Tracking (SS/TR)
      3. 8.3.3 Power Good (PG)
      4. 8.3.4 Pin-Selectable Output Voltage (DEF)
      5. 8.3.5 Frequency Selection (FSW)
      6. 8.3.6 Undervoltage Lockout (UVLO)
      7. 8.3.7 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pulse Width Modulation (PWM) Operation
      2. 8.4.2 Power Save Mode Operation
      3. 8.4.3 100% Duty-Cycle Operation
      4. 8.4.4 Current Limit and Short Circuit Protection
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Programming the Output Voltage
        2. 9.2.2.2 External Component Selection
          1. 9.2.2.2.1 Inductor Selection
          2. 9.2.2.2.2 Capacitor Selection
            1. 9.2.2.2.2.1 Output Capacitor
            2. 9.2.2.2.2.2 Input Capacitor
            3. 9.2.2.2.2.3 Soft-Start Capacitor
        3. 9.2.2.3 Tracking Function
        4. 9.2.2.4 Output Filter and Loop Stability
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 LED Power Supply
      2. 9.3.2 Active Output Discharge
      3. 9.3.3 Inverting Power Supply
      4. 9.3.4 Various Output Voltages
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 相关链接
    3. 12.3 文档支持
      1. 12.3.1 相关文档　
    4. 12.4 接收文档更新通知
    5. 12.5 社区资源
    6. 12.6 商标
    7. 12.7 静电放电警告
    8. 12.8 Glossary
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGT|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configuration and Functions

RGT Package
16-Pin VQFN
Top View
TLV62150 TLV62150A SLVSAG7_pinout.gif

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Pin Functions

PIN(1) I/O DESCRIPTION
NAME NO.
AGND 6 — Analog Ground. Must be connected directly to the Exposed Thermal Pad and common ground plane.
AVIN 10 I Supply voltage for control circuitry. Connect to same source as PVIN.
DEF 8 I Output Voltage Scaling (Low = nominal, High = nominal + 5%)(3)
EN 13 I Enable input (High = enabled, Low = disabled)(3)
FB 5 I Voltage feedback. Connect resistive voltage divider to this pin.
FSW 7 I Switching Frequency Select (Low ≈ 2.5 MHz, High ≈ 1.25 MHz(2) for typical operation)(3)
SW 1,2,3 O Switch node, which is connected to the internal MOSFET switches. Connect inductor between SW and output capacitor.
PG 4 O Output power good (High = VOUT ready, Low = VOUT below nominal regulation) ; open drain (requires pull-up resistor)
PGND 15,16 — Power ground. Must be connected directly to the Exposed Thermal Pad and common ground plane.
PVIN 11,12 I Supply voltage for power stage. Connect to same source as AVIN.
SS/TR 9 I Soft-Start / Tracking Pin. An external capacitor connected to this pin sets the internal voltage reference rise time. It can be used for tracking and sequencing.
VOS 14 I Output voltage sense pin and connection for the control loop circuitry.
Exposed Thermal Pad — — Must be connected to AGND (pin 6), PGND (pin 15,16) and common ground plane. See the Layout Example. Must be soldered to achieve appropriate power dissipation and mechanical reliability.
(1) For more information about connecting pins, see Detailed Description and Application and Implementation sections.
(2) Connect FSW to VOUT or PG in this case.
(3) An internal pull-down resistor keeps logic level low, if pin is floating.