SBVS114B July   2008  – January 2015 TLC5947

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Dissipation Ratings
    6. 6.6 Electrical Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Pin Equivalent Input and Output Schematic Diagrams
    2. 7.2 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Grayscale (GS) Control Function
      2. 8.3.2 Auto Display Repeat Function
      3. 8.3.3 Thermal Shutdown (TSD)
      4. 8.3.4 Noise Reduction
    4. 8.4 Programming
      1. 8.4.1 Register Configuration
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Define Basic Parameters
        2. 9.2.2.2 Grayscale (GS) Data
        3. 9.2.2.3 Auto-Display Function
        4. 9.2.2.4 Setting for the Constant Sink Current Value
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Power Dissipation
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range, unless otherwise noted.(1)(2)
MIN MAX UNIT
VCC Supply voltage: VCC –0.3 6.0 V
IO Output current (dc) OUT0 to OUT23 38 mA
VI Input voltage SIN, SCLK, XLAT, BLANK –0.3 VCC + 0.3 V
VO Output voltage SOUT –0.3 VCC + 0.3 V
OUT0 to OUT23 –0.3 33 V
TJ(MAX) Operating junction temperature 150 °C
Tstg Storage temperature –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2500 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

At TA= –40°C to 85°C, unless otherwise noted.
MIN NOM MAX UNIT
DC CHARACTERISTICS: VCC = 3 V to 5.5 V
VCC Supply voltage 3.0 5.5 V
VO Voltage applied to output OUT0 to OUT23 30 V
VIH High-level input voltage 0.7 × VCC VCC V
VIL Low-level input voltage GND 0.3 × VCC V
IOH High-level output current SOUT –3 mA
IOL Low-level output current SOUT 3 mA
IOLC Constant output sink current OUT0 to OUT23 2 30 mA
TA Operating free-air temperature range –40 85 °C
TJ Operating junction temperature –40 125 °C
AC CHARACTERISTICS: VCC = 3 V to 5.5 V
fSCLK Data shift clock frequency SCLK, Standalone operation 30 MHz
SCLK, Duty 50%, cascade operation 15 MHz
TWH0 Pulse duration SCLK = High-level pulse width 12 ns
TWL0 SCLK = Low-level pulse width 10 ns
TWH1 XLAT, BLANK High-level pulse width 30 ns
TSU0 Setup time SIN–SCLK↑ 5 ns
TSU1 XLAT↑–SCLK↑ 100 ns
TSU2 XLAT↑–BLANK↓ 30 ns
TH0 Hold time SIN–SCLK↑ 3 ns
TH1 XLAT↑–SCLK↑ 10 ns

6.4 Thermal Information

THERMAL METRIC(1) TLC5947 UNIT
DAP
32 PINS
RθJA Junction-to-ambient thermal resistance 32.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 17.1
RθJB Junction-to-board thermal resistance 17.9
ψJT Junction-to-top characterization parameter 0.4
ψJB Junction-to-board characterization parameter 17.8
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Dissipation Ratings

PACKAGE OPERATING FACTOR ABOVE TA = 25°C TA < 25°C
POWER RATING		 TA = 70°C
POWER RATING		 TA = 85°C
POWER RATING
HTSSOP-32 with
PowerPAD™ soldered(1)		 42.54 mW/°C 5318 mW 3403 mW 2765 mW
HTSSOP-32 with
PowerPAD not soldered(2)		 22.56 mW/°C 2820 mW 1805 mW 1466 mW
QFN-32(3) 27.86 mW/°C 3482 mW 2228 mW 1811 mW
(1) With PowerPAD soldered onto copper area on printed circuit board (PCB); 2 oz. copper. For more information, see SLMA002.
(2) With PowerPAD not soldered onto copper area on PCB.
(3) The package thermal impedance is calculated in accordance with JESD51-5.

6.6 Electrical Characteristics

At VCC = 3.0 V to 5.5 V and TA = –40°C to 85°C. Typical values at VCC = 3.3 V and TA = 25°C, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage IOH = –3 mA at SOUT VCC – 0.4 VCC V
VOL Low-level output voltage IOL = 3 mA at SOUT 0.4 V
IIN Input current VIN = VCC or GND at SIN, XLAT, and BLANK –1 1 μA
ICC1 Supply current (VCC) SIN/SCLK/XLAT = low, BLANK = high, VOUTn = 1 V, RIREF = 24 kΩ 0.5 3 mA
ICC2 SIN/SCLK/XLAT = low, BLANK = high, VOUTn = 1 V, RIREF = 3.3 kΩ 1 6 mA
ICC3 SIN/SCLK/XLAT = low, BLANK = low, VOUTn = 1 V, RIREF = 3.3 kΩ, GSn = FFFh 15 45 mA
ICC4 SIN/SCLK/XLAT = low, BLANK = low, VOUTn = 1 V, RIREF = 1.6 kΩ, GSn = FFFh 30 90 mA
IOLC Constant output current All OUTn = ON, VOUTn = 1 V, VOUTfix = 1 V,
RIREF = 1.6 kΩ		 27.7 30.75 33.8 mA
IOLK Output leakage current BLANK = high, VOUTn = 30 V, RIREF = 1.6 kΩ,
At OUT0 to OUT23		 0.1 μA
ΔIOLC Constant-current error
(channel-to-channel)(1)		 All OUTn = ON, VOUTn = 1 V, VOUTfix = 1 V,
RIREF = 1.6 kΩ, At OUT0 to OUT23		 –4% ±2% 4%
ΔIOLC1 Constant-current error
(device-to-device)(2)		 All OUTn = ON, VOUTn = 1 V, VOUTfix = 1 V,
RIREF = 1.6 kΩ		 –7% ±2% 7%
ΔIOLC2 Line regulation(3) All OUTn = ON, VOUTn = 1 V, VOUTfix = 1 V,
RIREF = 1.6 kΩ, At OUT0 to OUT23		 ±1 ±3 %/V
ΔIOLC3 Load regulation(4) All OUTn = ON, VOUTn = 1 V to 3 V, VOUTfix = 1 V, RIREF = 1.6 kΩ, At OUT0 to OUT23 ±2 ±6 %/V
TDOWN Thermal shutdown threshold Junction temperature(5) 150 162 175 °C
THYS Thermal error hysteresis Junction temperature(5) 5 10 20 °C
VIREF Reference voltage output RIREF = 1.6 kΩ 1.16 1.20 1.24 V
(1) The deviation of each output from the average of OUT0–OUT23 constant-current. Deviation is calculated by the formula:
q_delta01_bvs114.gif.
(2) The deviation of the OUT0–OUT23 constant-current average from the ideal constant-current value. Deviation is calculated by the following formula:
q_delta02_bvs114.gif Ideal current is calculated by the formula:
q_ioutid_bvs114.gif
(3) Line regulation is calculated by this equation:
q_line_bvs114.gif
(4) Load regulation is calculated by the equation:
q_load_bvs114.gif
(5) Not tested. Specified by design.

6.7 Switching Characteristics

At VCC = 3.0 V to 5.5 V, TA = –40°C to 85°C, CL = 15 pF, RL = 150 Ω, RIREF = 1.6 kΩ, and VLED = 5.5 V. Typical values at VCC = 3.3 V and TA = 25°C, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tR0 Rise time SOUT 10 15 ns
tR1 OUTn 15 40 ns
tF0 Fall time SOUT 10 15 ns
tF1 OUTn 100 300 ns
fOSC Internal oscillator frequency 2.4 4 5.6 MHz
tD0 Propagation delay time SCLK↓ to SOUT 15 25 ns
tD1 BLANK↑ to OUT0 sink current off 20 40 ns
tD2 OUT0 current on to OUT1/5/9/13/17/21 current on 15 24 33 ns
tD3 OUT0 current on to OUT2/6/10/14/18/22 current on 30 48 66 ns
tD4 OUT0 current on to OUT3/7/11/15/19/23 current on 45 72 99 ns
tim_input_bvs114.gif
1. Input pulse rise and fall time is 1 ns to 3 ns.
Figure 1. Input Timing
tim_output_bvs114.gif
1. Input pulse rise and fall time is 1 ns to 3 ns.
Figure 2. Output Timing
tim_gs_wr_outn_bvs114.gif
1. GS data = FFFh.
Figure 3. Grayscale Data Write and OUTn Operation Timing

6.8 Typical Characteristics

At VCC = 3.3 V and TA = 25°C, unless otherwise noted.
tc_ref_res_iout_bvs114.gifFigure 4. Reference Resistor vs Output Current
tc_io-vo_io_bvs114.gifFigure 6. Output Current vs Output Voltage
tc_iolc-tmp_bvs114.gifFigure 8. ΔIOLC vs Ambient Temperature
tc_osc_frq-ta_bvs114.gifFigure 10. Internal Oscillator Frequency vs Ambient Temperature
tc_pdiss-tmp_bvs114.gifFigure 5. Power Dissipation Rate vs Free-Air Temperature
tc_io-vo_ta_bvs114.gifFigure 7. Output Current vs Output Voltage
tc_iolc-io_bvs114.gifFigure 9. ΔIOLC vs Output Current
tc_waveform_bvs114.gif
Figure 11. Constant-Current Output Voltage Waveform