ZHCSKS4G october   2009  – august 2023 TL331-Q1 , TL331B-Q1 , TL391B-Q1

PRODMIX  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings, TL331-Q1
    2. 6.2  Absolute Maximum Ratings, TL331B-Q1 and TL391B-Q1
    3. 6.3  ESD Ratings, All Devices
    4. 6.4  Recommended Operating Conditions, TL331-Q1
    5. 6.5  Recommended Operating Conditions, TL331B-Q1 and TL391B-Q1
    6. 6.6  Thermal Information
    7. 6.7  Electrical Characteristics, TL331B-Q1 and TL391B-Q1
    8. 6.8  Switching Characteristics, TL331B-Q1 and TL391B-Q1
    9. 6.9  Electrical Characteristics, TL331-Q1
    10. 6.10 Switching Characteristics, TL331-Q1
    11. 6.11 Typical Characteristics, TL331-Q1
    12. 6.12 Typical Characteristics, TL331B-Q1 and TL391B-Q1
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Voltage Comparison
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Voltage Range
        2. 8.2.2.2 TL331B-Q1 and TL391B-Q1 ESD Protection
        3. 8.2.2.3 Minimum Overdrive Voltage
        4. 8.2.2.4 Output and Drive Current
        5. 8.2.2.5 Response Time
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.5 静电放电警告

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif 静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。