ZHCSEI9B February   2016  – January 2017 TL16C752D-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Functional Description
        1. 8.3.1.1  Trigger Levels
        2. 8.3.1.2  Hardware Flow Control
        3. 8.3.1.3  Auto-RTS
        4. 8.3.1.4  Auto-CTS
        5. 8.3.1.5  Software Flow Control
        6. 8.3.1.6  Software Flow Control Example
        7. 8.3.1.7  Reset
        8. 8.3.1.8  Interrupts
        9. 8.3.1.9  Interrupt Mode Operation
        10. 8.3.1.10 Polled Mode Operation
        11. 8.3.1.11 Break and Timeout Conditions
        12. 8.3.1.12 Programmable Baud Rate Generator
    4. 8.4 Device Functional Modes
      1. 8.4.1 DMA Signaling
        1. 8.4.1.1 Single DMA Transfers (DMA Mode0 or FIFO Disable)
        2. 8.4.1.2 Block DMA Transfers (DMA Mode 1)
      2. 8.4.2 Sleep Mode
    5. 8.5 Register Maps
      1. 8.5.1  Principals of Operation
      2. 8.5.2  Receiver Holding Register (RHR)
      3. 8.5.3  Transmit Holding Register (THR)
      4. 8.5.4  FIFO Control Register (FCR)
      5. 8.5.5  Line Control Register (LCR)
      6. 8.5.6  Line Status Register (LSR)
      7. 8.5.7  Modem Control Register (MCR)
      8. 8.5.8  Modem Status Register (MSR)
      9. 8.5.9  Interrupt Enable Register (IER)
      10. 8.5.10 Interrupt Identification Register (IIR)
      11. 8.5.11 Enhanced Feature Register (EFR)
      12. 8.5.12 Divisor Latches (DLL, DLH)
      13. 8.5.13 Transmission Control Register (TCR)
      14. 8.5.14 Trigger Level Register (TLR)
      15. 8.5.15 FIFO Ready Register
      16. 8.5.16 Alternate Function Register (AFR)
      17. 8.5.17 RS-485 Mode
      18. 8.5.18 IrDA Overview
      19. 8.5.19 IrDA Encoder Function
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 接收文档更新通知

要接收文档更新通知，请转至 ti.com 上您的器件的产品文件夹。请在右上角单击通知我 按钮进行注册，即可收到产品信息更改每周摘要（如有）。有关更改的详细信息，请查看任意已修订文档的修订历史记录。

12.2 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 静电放电警告

esds-image

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.