SLOS081M February   1977  – December 2021 TL081 , TL081A , TL081B , TL081H , TL082 , TL082A , TL082B , TL082H , TL084 , TL084A , TL084B , TL084H

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings: TL08xH
    2. 6.2  Absolute Maximum Ratings: All Other Devices
    3. 6.3  ESD Ratings: TL08xH
    4. 6.4  ESD Ratings: All Other Devices
    5. 6.5  Recommended Operating Conditions: TL08xH
    6. 6.6  Recommended Operating Conditions: All Other Devices
    7. 6.7  Thermal Information for Single Channel: TL081H
    8. 6.8  Thermal Information for Dual Channel: TL082H
    9. 6.9  Thermal Information for Quad Channel: TL084H
    10. 6.10 Thermal Information: All Other Devices
    11. 6.11 Electrical Characteristics: TL08xH
    12. 6.12 Electrical Characteristics for TL08xC, TL08xxC, and TL08xI
    13. 6.13 Electrical Characteristics for TL08xM and TL084x
    14. 6.14 Switching Characteristics
    15. 6.15 Dissipation Rating Table
    16. 6.16 Typical Characteristics: TL08xH
    17. 6.17 Typical Characteristics: All Other Devices
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Total Harmonic Distortion
      2. 8.3.2 Slew Rate
    4. 8.4 Device Functional Modes
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Inverting Amplifier Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
    3. 9.3 System Examples
      1. 9.3.1 General Applications
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • P|8
  • PS|8
  • PW|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision L (July 2021) to Revision M (December 2021)

  • Corrected DCK pinout diagram and table in Pin Configurations and Functions sectionGo

Changes from Revision K (June 2021) to Revision L (July 2021)

  • Deleted preview note from TL081H SOIC (8), SOT-23 (5), and SC70 (5) packages throughout the data sheetGo

Changes from Revision J (November 2020) to Revision K (June 2021)

  • Deleted VSSOP (8) package references throughout data sheetGo
  • Deleted preview note from TL082H SOIC (8), SOT-23 (8), and TSSOP (8) packages throughout the data sheetGo
  • Added DBV, DCK, and D packages to TL081H in Pin Configuration and Functions sectionGo
  • Added ESD information for TL082HGo
  • Added D, DCK, and DBV package thermal information in Thermal Information for Single Channel: TL081H sectionGo
  • Added D, DDF, and PW package thermal information in Thermal Information for Dual Channel: TL082H section Go
  • Added IB and IOS specification for single channel DCK and DBV packageGo
  • Added IQ spec for TL081H and TL082HGo
  • Removed Related Links section from Device and Documentation Support sectionGo

Changes from Revision I (May 2015) to Revision J (November 2020)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added TL08xH devices throughout the data sheetGo
  • Added features for TL08xH to the Features sectionGo
  • Added link to applications in the Applications sectionGo
  • Added TL08xH in the Description sectionGo
  • Added TL08xH in the Device Information tableGo
  • Updated pinout diagrams and pinout tables in Pin Configurations and Functions section Go
  • Added TSSOP, VSSOP and DDF packages to TL082x in Pin Configuration and Functions sectionGo
  • Added DYY package to TL084x in Pin Configuration and Functions sectionGo
  • Added Typical Characteristics:TL08xH section in Specifications sectionGo
  • Removed Table of Graphs in Typical Characteristics: All Other Devices sectionGo
  • Removed references to obsolete documentationGo

Changes from Revision H (January 2014) to Revision I (May 2015)

  • Added Applications section, Device Information table, Pin Functions table, Thermal Information table, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, ESD information, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Added Applications Go
  • Moved Typical Characteristics into Specifications section. Go

Changes from Revision G (September 2004) to Revision H (January 2014)

  • Deleted Ordering Information tableGo