ZHCSNU6N november   1978  – august 2023 TL061 , TL061A , TL061B , TL062 , TL062A , TL062B , TL064 , TL064A , TL064B

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information (TL061)
    5. 6.5  Thermal Information (TL062)
    6. 6.6  Thermal Information (TL064)
    7. 6.7  Electrical Characteristics for TL06xC and TL06xxC
    8. 6.8  Electrical Characteristics for TL06xxC and TL06xI
    9. 6.9  Electrical Characteristics for TL06xM
    10. 6.10 Operating Characteristics
    11.     Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Common-Mode Rejection Ratio
      2. 8.3.2 Slew Rate
    4. 8.4 Device Functional Modes
  10. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Inverting Amplifier Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
    3. 9.3 System Examples
      1. 9.3.1 General Applications
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Examples
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 静电放电警告
    5. 10.5 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • P|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.6 Thermal Information (TL064)

THERMAL METRIC(1) TL064 UNIT
D (SOIC) N (PDIP) NS (SO) PS (SO) PW (TSSOP) FK (LCCC) J (CDIP) W (CFP)
14 PINS 14 PINS 14 PINS 8 PINS 14 PINS 20 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance(2)(3) 86 80 76 95 113 — — — °C/W
RθJC(top) Junction-to-case (top) thermal resistance(2)(3) — — — — — 5.61 15.05 14.65 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) Maximum power dissipation is a function of TJ(max), RθJC, and TC. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TC) / RθJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
(3) The package thermal impedance is calculated in accordance with MIL-STD-883.