ZHCSGF4D July   2017  – June 2019 TIOL111 , TIOL1113 , TIOL1115

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1  Wake Up Detection
      2. 8.3.2  Current Limit Configuration
      3. 8.3.3  Current Fault Detection, Indication and Auto Recovery
      4. 8.3.4  Thermal Warning, Thermal Shutdown
      5. 8.3.5  Fault Reporting (NFAULT)
      6. 8.3.6  Transceiver Function Tables
      7. 8.3.7  The Integrated Voltage Regulator (LDO)
      8. 8.3.8  Reverse Polarity Protection
      9. 8.3.9  Integrated Surge Protection and Transient Waveform Tolerance
      10. 8.3.10 Power Up Sequence (TIOL111)
      11. 8.3.11 Undervoltage Lock-Out (UVLO)
    4. 8.4 Device Functional Modes
      1. 8.4.1 NPN Configuration (N-Switch SIO Mode)
      2. 8.4.2 PNP Configuration (P-Switch SIO Mode)
      3. 8.4.3 Push-Pull, Communication Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Maximum Junction Temperature Check
        2. 9.2.2.2 Driving Capacitive Loads
        3. 9.2.2.3 Driving Inductive Loads
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SECTION NAME
tPLH, tPHL Driver propagation delay See Figure 6
See Figure 7
See Figure 8
RL = 2 kΩ
CL = 5 nF
R(SET) = 0 Ω 		600 800 ns
tP(skew) Driver propagation delay skew. |tPLH - tPHL | 100 ns
tPZH, tPZL Driver enable delay 4 µs
tPHZ, tPLZ Driver disable delay 4 µs
tr, tf Driver output rise, fall time 150 ns
|tr – tf| Difference in rise and fall time 50 ns
tWU1 Wake-up recognition begin See Figure 10 45 60 75 µs
tWU2 Wake-up recognition end 85 100 135 µs
tpWAKE Wake-up output delay 140 µs
tSC Current fault blanking time 175 200 µs
tpSC Current fault indication delay 260 µs
tSCEN Current fault driver re-enable wait time 15 ms
t(UVLO) CQ re-enable delay after UVLO (1) V(UVLO) rising threshold crossing time to CQ enable time 10 30 50 ms
RECEIVER
tND Noise suppression time (2) 250 ns
tPLH, tPHL Receiver propagation delay See Figure 9 15-pF load on RX 150 300 ns
(1) CQ output remains Hi-Z for this time
(2) Noise suppression time is defined as the permissible duration of a receive signal above/below the detection threshold without detection taking place.