ZHCSEP3B February   2016  – February 2016 THS3217

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: D2S
    6. 7.6  Electrical Characteristics: OPS
    7. 7.7  Electrical Characteristics: D2S + OPS
    8. 7.8  Electrical Characteristics: Midscale (DC) Reference Buffer
    9. 7.9  Typical Characteristics: D2S + OPS
    10. 7.10 Typical Characteristics: D2S Only
    11. 7.11 Typical Characteristics: OPS only
    12. 7.12 Typical Characteristics: Midscale (DC) Reference Buffer
    13. 7.13 Typical Characteristics: Switching Performance
    14. 7.14 Typical Characteristics: Miscellaneous Performance
  8. 8 Parameter Measurement Information
    1. 8.1 Overview
    2. 8.2 Frequency Response Measurement
    3. 8.3 Harmonic Distortion Measurement
    4. 8.4 Noise Measurement
    5. 8.5 Output Impedance Measurement
    6. 8.6 Step-Response Measurement
    7. 8.7 Feedthrough Measurement
    8. 8.8 Midscale Buffer ROUT Versus CLOAD Measurement
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Differential to Single-Ended Stage (D2S) With Fixed Gain of 2-V/V (Pins 2, 3, 6 and 14)
      2. 9.3.2 Midscale (DC) Reference Buffer (Pin 1 and Pin 15)
      3. 9.3.3 Output Power Stage (OPS) (Pins 4, 7, 9, 10, 11, and 12)
        1. 9.3.3.1 Output DC Offset and Drift for the OPS
        2. 9.3.3.2 OPS Harmonic Distortion (HD) Performance
        3. 9.3.3.3 Switch Feedthrough to the OPS
        4. 9.3.3.4 Driving Capacitive Loads
      4. 9.3.4 Digital Control Lines
    4. 9.4 Device Functional Modes
      1. 9.4.1 Full-Signal Path Mode
        1. 9.4.1.1 Internal Connection With Fixed Common-Mode Output Voltage
        2. 9.4.1.2 Internal Connection With Adjustable Common-Mode Output Voltage
        3. 9.4.1.3 External Connection
      2. 9.4.2 Dual-Output Mode
      3. 9.4.3 Differential I/O Voltage Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Typical Applications
        1. 10.1.1.1 High-Frequency, High-Voltage, Dual-Output Line Driver for AWGs
          1. 10.1.1.1.1 Design Requirements
          2. 10.1.1.1.2 Detailed Design Procedure
          3. 10.1.1.1.3 Application Curves
        2. 10.1.1.2 High-Voltage Pulse-Generator
          1. 10.1.1.2.1 Design Requirements
          2. 10.1.1.2.2 Detailed Design Procedure
          3. 10.1.1.2.3 Application Curves
        3. 10.1.1.3 Single-Supply, AC-Coupled, Piezo Element Driver
          1. 10.1.1.3.1 Design Requirements
        4. 10.1.1.4 Output Common-Mode Control Using the Midscale Buffer as a Level Shifter
          1. 10.1.1.4.1 Design Requirements
        5. 10.1.1.5 Differential I/O Driver With independent Common-Mode Control
          1. 10.1.1.5.1 Design Requirements
  11. 11Power Supply Recommendations
    1. 11.1 Thermal Considerations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 开发支持
        1. 13.1.1.1 TINA-TI（免费软件下载）
    2. 13.2 文档支持
      1. 13.2.1 相关文档
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configuration and Functions

RGV Package
16-Pin VQFN
Top View
THS3217 Pinout_RGV-16_SBOS766.gif

Table 1. Pin Functions

PIN I/O DESCRIPTION
NO. NAME
1 VMID_IN Input DC reference buffer input
2 +IN Input Positive signal input to D2S
3 –IN Input Negative signal input to D2S
4 PATHSEL Input Internal SPDT switch control: low selects the internal path, and high selects the external path
5 –VCC2(1) Power Negative supply for input stage
6 VO1 Output D2S external output
7 GND Power Ground for control pins reference
8 –VCC1(1) Power Negative supply for output stage
9 VIN+ Input External OPS noninverting input
10 DISABLE Input Output power stage shutdown control: low enables the OPS, and high disables the OPS
11 VOUT Output OPS output
12 VIN– Input OPS inverting input
13 +VCC1(1) Power Positive supply for output stage
14 VREF Input DC offsetting input to D2S
15 VMID_OUT Output DC reference buffer output
16 +VCC2(1) Power Positive supply for input stage
Thermal Pad — Connect the thermal pad to GND for single-supply and split-supply operation. See Thermal Considerations section for more information.
(1) Throughout this document +VCC refers to the voltage applied at the +VCC1 and +VCC2 pins, and –VCC is the voltage applied at the –VCC1 and –VCC2 pins