ZHCSGC4D March   2016  – April 2021 TCAN1051-Q1 , TCAN1051G-Q1 , TCAN1051GV-Q1 , TCAN1051H-Q1 , TCAN1051HG-Q1 , TCAN1051HGV-Q1 , TCAN1051HV-Q1 , TCAN1051V-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings, Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Power Rating
    7. 6.7 Electrical Characteristics
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 TXD Dominant Timeout (DTO)
      2. 8.3.2 Thermal Shutdown (TSD)
      3. 8.3.3 Undervoltage Lockout
      4. 8.3.4 Unpowered Device
      5. 8.3.5 Floating Terminals
      6. 8.3.6 CAN Bus Short Circuit Current Limiting
      7. 8.3.7 Digital Inputs and Outputs
        1. 8.3.7.1 5-V VCC Only Devices (Devices without the "V" Suffix):
        2. 8.3.7.2 5 V VCC with VIO I/O Level Shifting (Devices with the "V" Suffix):
    4. 8.4 Device Functional Modes
      1. 8.4.1 CAN Bus States
      2. 8.4.2 Normal Mode
      3. 8.4.3 Silent Mode
      4. 8.4.4 Driver and Receiver Function Tables
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Bus Loading, Length and Number of Nodes
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 CAN Termination
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision C (May 2017) to Revision D (April 2021)

  • 添加了特性：EMC 性能：..Go
  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 添加了特性 “提供功能安全型”Go
  • Deleted "Base" from the D and DRB pin images in the Pin Configurations and Functions Go
  • Deleted "Product Preview" from the DRB pin images in the Pin Configurations and Functions Go
  • Added footnote to the GND pin in the Pin Functions table Go
  • Changed ICC Normal Mode Max value From: 180 To 110 in the Electrical Characteristics tableGo
  • Added SR, Differential output slew rate to the Switching Characteristics table Go

Changes from Revision B (May 2016) to Revision C (May 2017)

  • 向汽车应用特性 添加了条目Go
  • 删除了特性“符合 2015 年 12 月 17 日发布的 ISO 11898-2 物理层更新草案”Go
  • 将特性 从“符合发布的 ISO 11898-2:2007 和 ISO 11898-2:2003 物理层标准”更改为“符合 ISO 11898-2:2016 和 ISO 11898-5:2007 物理层标准”Go
  • 将“特性”从“所有器件均支持 2Mbps CAN FD..”更改为“所有器件均支持经典 CAN 和 2Mbps CAN FD..”Go
  • 添加了特性 “可采用 SOIC(8) 封装和无引线 VSON(8) 封装...”Go
  • 将应用 从“重型机械 ISO11783”更改为“重型机械 ISOBUS 应用 – ISO 11783”Go
  • 更改了功能方框图，删除了显性超时功能框Go
  • Changed "D Package for (HV) and (HGV)" To: "DRB Package for (HV) and (HGV)" Go
  • Added Storage temperature range to the Absolute Maximum Ratings tableGo
  • Changed the ESD Ratings table to show the D(SOIC) and DRB (VSON) values Go
  • Changed Human Body Model (HBM) From: ±10000 To: ±16000 in the ESD Ratings tableGo
  • Changed Charged Device Model (CDM) From: ±750 To: ±1500 in the ESD Ratings tableGo
  • Changed TBD to values for the DRB (VSON) Package in the ESD Ratings tableGo
  • Added the Power Rating table Go
  • Changed VSYM in the DRIVER ELECTRICAL CHARACTERISTICS tableGo
  • Changed VSYM_DC in the DRIVER ELECTRICAL CHARACTERISTICS tableGo
  • Deleted "VI = 0.4 sin (4E6 π t) + 2.5 V" from the Test Condition of CI in the RECEIVER ELECTRICAL CHARACTERISTICS tableGo
  • Deleted "VI = 0.4 sin (4E6 π t)" from the Test Condition of CID in the RECEIVER ELECTRICAL CHARACTERISTICS tableGo
  • Added "-30 V ≤ VCM ≤ +30" to the Test Condition of RID and RIN in the RECEIVER ELECTRICAL CHARACTERISTICS table tableGo
  • Changed the Functional Block Diagram, removed the Dominant time-out boxGo
  • Changed Table 8-2, BUS OUTPUT columGo

Changes from Revision A (April 2016) to Revision B (May 2016)

  • 添加了特性 “符合发布的 ISO 11898-2:2007 和 ISO 11898-2:2003 物理层标准”Go
  • 将特性 从“符合 ISO11898-2 (2016) 标准的要求”更改为“符合 2015 年 12 月 17 日发布的 ISO 11898-2 物理层更新草案”Go
  • 更改了应用 列表Go
  • 向器件信息 表中添加了 VSON (8) 引脚封装Go
  • Added the VSON (8) pin package to the Pin Configuration and Functions Go
  • Added V(Diff) to the Section 6.1 table Go
  • Added the DRB package to the Thermal Information table Go

Changes from Revision * (March 2016) to Revision A (April 2016)

  • 将器件状态从“产品预发布”更改为“量产”Go
  • Added the VSON (8) pin package to the Pin Configuration and Functions Go