ZHCSIH8G October   2010  – November 2018 TCA9406

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      TCA9406 典型应用方框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements (VCCA = 1.8 V ± 0.15 V)
    7. 6.7  Timing Requirements (VCCA = 2.5 V ± 0.2 V)
    8. 6.8  Timing Requirements (VCCA = 3.3 V ± 0.3 V)
    9. 6.9  Switching Characteristics (VCCA = 1.8 V ± 0.15 V)
    10. 6.10 Switching Characteristics (VCCA = 2.5 V ± 0.2 V)
    11. 6.11 Switching Characteristics (VCCA = 3.3 V ± 0.3 V)
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Voltage Waveforms
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Architecture
      2. 8.3.2 Input Driver Requirements
      3. 8.3.3 Output Load Considerations
      4. 8.3.4 Enable and Disable
      5. 8.3.5 Pullup Resistors on I/O Lines
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TCA9406 UNIT
DCT DCU YZP
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 182.6 199.1 105.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 113.3 72.4 1.6 °C/W
RθJB Junction-to-board thermal resistance 94.9 77.8 10.8 °C/W
ψJT Junction-to-top characterization parameter 39.4 6.2 3.1 °C/W
ψJB Junction-to-board characterization parameter 93.9 77.4 10.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.