ZHCSPC7B December   2022  – November 2023 TCA39416

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Enable and Disable
      3. 7.3.3 Pull up resistors on I/O Lines
      4. 7.3.4 Input Driver Requirements
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1) TCA39416 TCA39416 UNIT
DDF (SOT-23) DTW (X2SON)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 220.8 261.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 132.4 128.6 °C/W
RθJB Junction-to-board thermal resistance 138.3 146.8 °C/W
ψJT Junction-to-top characterization parameter 24.2 8.2 °C/W
ψJB Junction-to-board characterization parameter 137.2 146.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.