ZHCS928A May   2012  – January 2016 TAS5624A

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Electrical Characteristics - Audio Specification Stereo (BTL)
    7. 7.7 Electrical Characteristics - Audio Specification 4 Channels (SE)
    8. 7.8 Electrical Characteristics - Audio Specification Mono (PBTL)
    9. 7.9 Typical Characteristics
      1. 7.9.1 BTL Configuration
      2. 7.9.2 SE Configuration
      3. 7.9.3 PBTL Configuration
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1  System Power-Up and Power-Down Sequence
        1. 9.3.1.1 Powering Up
        2. 9.3.1.2 Powering Down
      2. 9.3.2  Start-Up and Shutdown Ramp Sequence
      3. 9.3.3  Unused Output Channels
      4. 9.3.4  Device Protection System
      5. 9.3.5  Pin-to-Pin Short-Circuit Protection (PPSC)
      6. 9.3.6  Overtemperature Protection
      7. 9.3.7  Overtemperature Warning, OTW
      8. 9.3.8  Undervoltage Protection (UVP) and Power-On Reset (POR)
      9. 9.3.9  Error Reporting
      10. 9.3.10 Fault Handling
      11. 9.3.11 Device Reset
      12. 9.3.12 System Design Consideration
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Typical BTL Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Pin Connections
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Typical SE Configuration
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
      3. 10.2.3 Typical PBTL Configuration
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power Supplies
    2. 11.2 Boot Strap Supply
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material Recommendation
      2. 12.1.2 PVDD Capacitor Recommendation
      3. 12.1.3 Decoupling Capacitor Recommendation
      4. 12.1.4 Circuit Component and Printed-Circuit-Board Recommendation
        1. 12.1.4.1 Circuit Component Requirements
        2. 12.1.4.2 Printed-Circuit-Board Requirements
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
    2. 13.2 文档支持
      1. 13.2.1 相关文档　
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8 Parameter Measurement Information

All parameters are measured according to the conditions described in the Specifications section.