ZHCSWS5J October   1996  – July 2024 SN65LBC184 , SN75LBC184

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: Driver
    6. 5.6  Electrical Characteristics: Receiver
    7. 5.7  Driver Switching Characteristics
    8. 5.8  Receiver Switching Characteristics
    9. 5.9  Dissipation Ratings
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Data Rate and Bus Length
        2. 8.2.1.2 Stub Length
        3. 8.2.1.3 Bus Loading
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 SN65LBC184 Test Description
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1)P (PDIP)D (SOIC)UNIT
8 PINS
RθJAJunction-to-ambient thermal resistance108.7116.3°C/W
RθJC(top)Junction-to-case (top) thermal resistance34.841.3°C/W
RθJBJunction-to-board thermal resistance23.661.4°C/W
ψJTJunction-to-top characterization parameter124.2°C/W
ψJBJunction-to-board characterization parameter23.560.3°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.