ZHCSR56G January   1994  – October 2022 SN65LBC179 , SN75LBC179

PRODUCTION DATA  

  1. 1特性
  2. 2说明
  3. 3Revision History
  4. 4Pin Configuration and Functions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Dissipation Rating Table
    5. 5.5 Electrical Characteristics - Driver
    6. 5.6 Switching Characteristics - Driver
    7. 5.7 Electrical Characteristics - Receiver
    8. 5.8 Switching Characteristics - Receiver
    9. 5.9 Typical Characteristics
  6. 6Parameter Measurement Information
  7. 7Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
    3. 7.3 Thermal Characteristics of IC Packages
  8. 8Device and Documentation Support
    1. 8.1 Device Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 术语表
  9. 9Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.3 Thermal Information

THERMAL METRIC(1) D (SOIC) P (PDIP) UNIT
8 Pins 8 Pins
R θJA Junction-to-ambient thermal resistance 116.7 65.6.4 °C/W
R θJC(top) Junction-to-case (top) thermal resistance 63.4 54.6 °C/W
R θJB Junction-to-board thermal resistance 56.3 42.1 °C/W
ψ JT Junction-to-top characterization parameter 8.8 22.9 °C/W
ψ JB Junction-to-board characterization parameter 62.6 41.6 °C/W
R θJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a °C/W
(1) See TI application note literature number https://www.ti.com/lit/pdf/SZZA003, Package Thermal Characterization Methodologies, for an explanation of this parameter.