ZHCSVF5E July   1985  – March 2024 SN75ALS192

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Dissipation Rating Table
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics Operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied.
  7. 6 Parameter Measurement Information
  8. 7 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 商标
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • NS|16
  • N|16
  • D|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1)D (SOIC)NS (SOP)UNIT
16-PINS
R θJAJunction-to-ambient thermal resistance84.688.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance43.546.2°C/W
R θJBJunction-to-board thermal resistance43.50.°C/W
ψ JTJunction-to-top characterization parameter10.413.5°C/W
ψ JBJunction-to-board characterization parameter42.850.3°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.