SCES381N January   2002  – January 2015 SN74LVC2G17 , SN74LVC2G17

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Switching Characteristics, -40°C to 125°C
    5. 6.5 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Power Button Circuit
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Electrostatic Discharge Caution
    2. 12.2 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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订购信息

8 Detailed Description

8.1 Overview

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

8.2 Functional Block Diagram

LD_CES381.gif

8.3 Feature Description

  • 1.65 V to 5.5 V operating voltage range
  • Allows down voltage translation
    • 5 V to 3.3 V
    • 5 V or 3.3 V to 1.8 V
  • Inputs accept voltages to 5.5 V
    • 5-V tolerance on input pin
  • Ioff feature
    • Allows voltage on the inputs and outputs when VCC is 0 V
    • Able to reduce leakage when VCC is 0 V
  • Schmitt-Trigger Input can improve the noise immunity capability

8.4 Device Functional Modes

INPUT
A		 OUTPUT
Y
H H
L L