ZHCSV38S January   1993  – May 2024 SN54LVC02A , SN74LVC02A

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 说明
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions, SN54LVC02A
    4. 4.4  Recommended Operating Conditions, SN74LVC02A
    5. 4.5  Thermal Information
    6. 4.6  Electrical Characteristics, SN54LVC02A
    7. 4.7  Electrical Characteristics, SN74LVC02A
    8. 4.8  Switching Characteristics, SN54LVC02A
    9. 4.9  Switching Characteristics, SN74LVC02A
    10. 4.10 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|14
  • RGY|14
  • DB|14
  • PW|14
  • BQA|14
  • NS|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

4.5 Thermal Information

THERMAL METRIC(1) SN74LVC02A UNIT
BQA (WQFN) D (SOIC) DB (SSOP) NS (SOP) PW (TSSOP) RGY (VQFN)
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 102.3 86 140.4 123.8 150.8 92.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.