ZHCSQR3T April   1998  – March 2023 SN74LV595A

PRODMIX  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements, VCC = 2.5 V ± 0.2 V
    7. 6.7  Timing Requirements, VCC = 3.3 V ± 0.3 V
    8. 6.8  Timing Requirements, VCC = 5 V ± 0.5 V
    9. 6.9  Switching Characteristics, VCC = 2.5 V ± 0.2 V
    10. 6.10 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    11. 6.11 Switching Characteristics, VCC = 5 V ± 0.5 V
    12. 6.12 Noise Characteristics
    13. 6.13 Operating Characteristics
    14. 6.14 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS 3-State Outputs
      2. 8.3.2 Latching Logic
      3. 8.3.3 Partial Power Down (Ioff)
      4. 8.3.4 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Power Considerations
      2. 9.2.2 Input Considerations
      3. 9.2.3 Output Considerations
      4. 9.2.4 Design Requirements
      5. 9.2.5 Detailed Design Procedure
      6. 9.2.6 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

3 说明

SN74LV595A 器件包含一个对 8 位 D 类存储寄存器进行馈送的 8 位串行输入、并行输出移位寄存器。移位寄存器时钟 (SRCLK) 和存储寄存器时钟 (RCLK) 均为正边沿触发。

封装信息(1)
器件型号封装封装尺寸（标称值）
SN74LV595ARGY（VQFN，16）4.00mm × 3.50mm
PW (TSSOP, 16)5.00mm × 4.40mm
NS（SO，16）10.20mm × 5.30mm
D (SOIC, 16)9.00 mm × 3.90 mm
BQB（WQFN，16）3.60mm × 2.60mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附录。
GUID-20211015-SS0I-66P0-J2PR-6DVV9SDRTXZD-low.gif逻辑图（正逻辑）