SDLS021D May   1990  – April 2016 SN74LS07

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resource
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|14
  • DB|14
  • N|14
  • NS|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage 7 V
VI Input voltage(2) 7 V
VO Output voltage(2)(3) 30 V
TJ Operating virtual junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND.
(3) This is the maximum voltage that should be applied to any output when it is in the off state.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN NOM MAX UNIT
VCC Supply voltage 4.75 5 5.25 V
VIH High-level input voltage 2 V
VIL Low-level input voltage 0.8 V
VOH High-level output voltage 30 V
IOL Low-level output current 40 mA
TA Operating free-air temperature 0 70 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004.

6.4 Thermal Information

THERMAL METRIC(1) SN74LS07 UNIT
D
(SOIC)		 DB
(SSOP)		 N
(PDIP)		 NS
(SO)
14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 85.2 97.4 50.2 82.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 43.5 49.8 37.5 40.9 °C/W
RθJB Junction-to-board thermal resistance 39.7 44.5 30 41.4 °C/W
ψJT Junction-to-top characterization parameter 10.9 16.5 22.3 12.4 °C/W
ψJB Junction-to-board characterization parameter 39.4 44 29.9 41.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP MAX UNIT
VIK VCC = MIN, II = –12 mA –1.5 V
IOH VCC = MIN, VIH = 2 V VOH = 30 V 0.25 mA
VOL VCC = MIN, VIL = 0.8 V IOL = 16 mA 0.4 V
IOL = MAX(2) 0.7
II VCC = MAX, VI = 7 V 1 mA
IIH VCC = MAX, VI = 2.4 V 20 µA
IIL VCC = MAX, VI = 0.4 V –0.2 mA
ICCH VCC = MAX 14 mA
ICCL VCC = MAX 45 mA
(1) For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
(2) IOL = 40 mA

6.6 Switching Characteristics

VCC = 5 V, TA = 25°C (see Figure 2)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 TEST CONDITIONS MIN TYP MAX UNIT
tPLH A Y RL = 110 Ω, CL = 15 pF 6 10 ns
tPHL 19 30

6.7 Typical Characteristics

SN74LS07 tPLH.png
Figure 1. tPLH vs. Temperature