ZHCSKI5D
November 2019 – December 2021
SN74HCS74
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Switching Characteristics
6.7
Timing Characteristics
6.8
Typical Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Balanced CMOS Push-Pull Outputs
8.3.2
CMOS Schmitt-Trigger Inputs
8.3.3
Clamp Diode Structure
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.1.1
Power Considerations
9.2.1.2
Input Considerations
9.2.1.3
Output Considerations
9.2.2
Detailed Design Procedure
9.2.3
Application Curve
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
接收文档更新通知
12.3
支持资源
12.4
Trademarks
12.5
静电放电警告
12.6
术语表
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DYY|14
MPSS114A
PW|14
MPDS360
BQA|14
MPQF538A
D|14
MPDS177G
散热焊盘机械数据 (封装 | 引脚)
BQA|14
QFND686
订购信息
zhcski5d_oa
zhcski5d_pm
12.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。