ZHCSPI2A July   2020  – December 2021 SN74HCS259-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     4
    2.     5
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 CMOS Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diode Structure
      4. 8.3.4 Wettable Flanks
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

GUID-20200714-CA0I-8XVW-Z1XK-V0PM4ZNHTKJS-low.gifD or PW Package
16-Pin SOIC or TSSOP
Top View
GUID-20210604-CA0I-GXFS-MHBF-CRF9RJRL9TWF-low.gifWBQB Package
16-Pin WQFN
Top View
Pin Functions
PIN I/O(2) DESCRIPTION
SOIC or TSSOP NO. NAME
1 S0 I Address select 0
2 S1 I Address select 1
3 S2 I Address select 2
4 Q0 O Output 0
5 Q1 O Output 1
6 Q2 O Output 2
7 Q3 O Output 3
8 GND — Ground
9 Q4 O Output 4
10 Q5 O Output 5
11 Q6 O Output 6
12 Q7 O Output 7
13 D I Data input
14 G I Enable, active low
15 CLR O Clear input, active low
16 VCC — Positive supply
Thermal Pad (1) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) WBQB package only.
(2) Signal Types: I = Input, O = Output, I/O = Input or Output.