ZHCSK20D July   2019  – December 2021 SN74HCS00-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 CMOS Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diode Structure
      4. 8.3.4 Wettable Flanks
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision C (March 2021) to Revision D (December 2021)

  • 向器件信息 表中添加了 DYY 封装Go
  • Added DYY package information to the Pin Configuration and Functions sectionGo

Changes from Revision B (September 2019) to Revision C (March 2021)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 向器件信息 表中添加了 BQA 封装Go
  • Added BQA package information to Pin Configuration and Functions Go
  •  Added DYY package information to Thermal Information table Go
  • Added BQA package information to Thermal Information tableGo

Changes from Revision A (August 2019) to Revision B (September 2019)

  • 向器件信息 表中添加了 D 封装Go
  • Added D package column to Thermal Information tableGo

Changes from Revision * (July 2019) to Revision A (August 2019)

  • Fixed errors in the Pin Function TableGo
  • Deleted "ICC" and "output" from "Continuous current through VCC or GND" row for clarity Go
  • Removed eroneous fmax row from Switching Characteristics tableGo
  • Tightened specifications in Switching Characteristics table to reflect accurate device performanceGo
  • Tightened specifications in Operating Characteristics table to reflect accurate device performanceGo