ZHCSPV7F January   1996  – June 2022 SN54HC175 , SN74HC175

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions (1)
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Timing Requirements
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
  11. 11Device and Documentation Support
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PW|16
  • DB|16
  • NS|16
  • N|16
  • D|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.3 Thermal Information

THERMAL METRIC D (SOIC) DB (SSOP) N (PDIP) NS (SO) PW (TSSOP) UNIT
16 PINS 16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance(1) 117.2 102.7 60.5 88.6 137.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 77.2 48.6 48 46.2 75.3 °C/W
RθJB Junction-to-board thermal resistance 75.6 54.4 40.5 50.8 82.2 °C/W
ψJT Junction-to-top characterization parameter 38.1 11.6 27.4 13.4 25.1 °C/W
ψJB Junction-to-board characterization parameter 75.3 53.6 40.3 50.4 81.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.